Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > ULVAC Launches Revolutionary PZT Piezoelectric Thin-film Process Technology and HVM Solution for MEMS Sensors/Actuators: Enabling Reliable, High-quality Film Production for Next Generation Devices

Overhead view of the 8-chamber configuration (7 process chambers and a load-lock chamber)
Overhead view of the 8-chamber configuration (7 process chambers and a load-lock chamber)

Abstract:
ULVAC, Inc. today announced the successful launch of PZT piezoelectric thin-film sputtering technology and a high volume manufacturing (HVM) solution to solve technical issues that have hindered the development of MEMS devices, which are crucial in applications from autonomous driving to next generation wearable terminals (such as smart glasses). The company has begun selling production systems incorporating the new technology.

ULVAC Launches Revolutionary PZT Piezoelectric Thin-film Process Technology and HVM Solution for MEMS Sensors/Actuators: Enabling Reliable, High-quality Film Production for Next Generation Devices

Chigasaki, Japan | Posted on August 16th, 2019

Evolutions in technologies such as 5G and AI are expected to accelerate the journey towards smart societies, in which the digitization of all types of industries will improve industrial performance and enhance convenience for people. With increasing levels of multi-functionality found in autonomous driving, AR/VR, security, and smartphone applications, actuators are needed in order to activate devices based on signals received from various types of sensors. Demand for actuators is projected to explode and key issues in their development have come to the fore, including the need for miniaturization, reduced production costs, lower power consumption, and higher performance.

It used to be impossible to fabricate PZT piezoelectric thin films, which constitute the key technology in sensors and actuators, using a low-temperature process with the conventional coating method (Sol-Gel). However, in 2015, ULVAC successfully developed the world's most advanced technology for forming PZT piezoelectric thin films using a low-temperature sputtering process. ULVAC has continued developing this as next-generation MEMS technology.

By further advancing this proprietary technology, ULVAC has reduced running costs by optimizing system operation and has greatly improved the technology's reliability, which is critical for device commercialization. The result is a groundbreaking mass-production technology that is now incorporated into systems ULVAC has begun to sell.

This technology allows MEMS devices to be integrated with semiconductors (CMOS), and enables other positive outcomes such as miniaturization, reduced production costs, lower power consumption, and higher performance. It is expected to pave the way for increased use of MEMS devices in sensors and actuators in spatial information sensing and 3D image displays, including smart glasses. The technology will also facilitate MEMS device use in applications such as 3D fingerprint authentication.

ULVAC will continue to spearhead innovations in MEMS device technologies that can be used in a wide range of applications, including etching, sputtering, ashing, and sputtering targets. With all of these contributions, ULVAC plans to remain a driving force in the creation of smart societies.

Overview of the Technology

MEMS devices using thin-film PZT are formed on a silicon substrate with the following five (5) layers: an adhesion layer, a lower electrode layer, a buffer layer, a piezoelectric (PZT) layer, and an upper electrode layer. The laminated structure of all these layers can be formed using ULVAC's single-wafer sputtering system without exposing the substrate to the atmosphere. This multi-chamber sputtering system (model SME-200) allows for continuous process flow, optimizing each individual layer inside its own process chamber to achieve high repeatability and improved throughput. The system is also designed to provide a uniform and stable process for forming 8-inch silicon substrates, the largest size substrate available today for MEMS device mass production. A load-lock chamber and a maximum of seven (7) process chambers can be installed, including DC and RF magnetron sputtering chambers, and a rapid thermal annealing (RTA) chamber for accelerating crystallization.

ULVAC's PZT sputtering system uses PZT sputtering chambers specifically designed to solve problems unique to PZT, and it forms PZT thin films by growing crystals on a heated wafer. To do so, ULVAC uses a new low-temperature PZT thin-film process carried out at no more than 500 degrees C, as well as a proprietary process technology for applying a buffer layer, simultaneously achieving superior piezoelectric performance*1 and high reliability*2. Furthermore, through maintenance cycle optimization, running costs have been reduced to 75% of what they were in 2015, resulting in the world's highest PZT thin film performance under mass-production conditions.

Features of the Technology

1. Allows film formation by laminating individual layers inside the same system using a single-wafer sputtering system.
2. Achieves mass production of high-performance PZT thin films using a proprietary low-temperature process technology carried out at no more than 500 degrees C.
3. Achieves high device reliability through the use of a new process.
4. Reduces running costs to 75% of what they were in 2015.

*1 Piezoelectric performance: The higher the piezoelectric constant (e31), the greater the movement per unit of voltage applied to the device, making it possible to miniaturize the device and reduce its power consumption. (Piezoelectric constant e31: -15.5 C/m2 @ PZT film thickness: 2.0 um)
*2 High reliability: As indicators for the device's high level of durability, a dielectric breakdown voltage of around 200 V and a time-dependent dielectric breakdown (TDDB) of 2 million hours were confirmed.

####

About ULVAC, Inc.
ULVAC, Inc., founded in 1952, contributes to the development of industry through its comprehensive vacuum technologies. We created ULVAC SOLUTIONS based on these unique technologies and long years of research, development and production innovation. We offer these solutions, for equipment, materials, vacuum components, analytic evaluation and various other services, to manufacturers of electronic components, semiconductors, solar cells, flat panel displays and other industrial equipment.

For more information, please click here

Contacts:
ULVAC, Inc.
Advanced Electronics Equipment Division
TEL: +81-467-89-2139

Sales in Japan
ULVAC EQUIPMENT SALES, Inc.
Head Office (Tokyo) TEL: +81-3-5769-5511
Osaka Branch TEL: +81-6-6397-2281

Copyright © ULVAC, Inc.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Optimized method to detect high-dimensional entanglement December 3rd, 2021

Scientists edge closer to probe that would inspect atherosclerotic plaques by forcing molecules to sound their presence December 3rd, 2021

Two-dimensional bipolar magnetic semiconductors with high Curie-temperature and electrically controllable spin polarization realized in exfoliated Cr(pyrazine)2 monolayers December 3rd, 2021

Review on the femtosecond laser precision micro/nano-engineering December 3rd, 2021

Internet-of-Things

Thin-film, high-frequency antenna array offers new flexibility for wireless communications November 5th, 2021

MXene-GaN van der Waals metal-semiconductor junctions for high performance photodetection September 24th, 2021

Thin films

Thin-film, high-frequency antenna array offers new flexibility for wireless communications November 5th, 2021

Leibniz Prize winner Professor Dr. Oliver G. Schmidt moves to Chemnitz University of Technology: President Professor Dr. Gerd Strohmeier refers to an 'absolute top transfer' September 10th, 2021

Stress-free path to stress-free metallic films paves the way for next-gen circuitry: Optimized sputtering technique helps minimize stress in tungsten thin films July 4th, 2021

Thin is now in to turn terahertz polarization: Rice lab’s discovery of ‘magic angle’ builds on its ultrathin, highly aligned nanotube films May 20th, 2021

Wearable electronics

A molecule like a nanobattery: Chemical scientists decipher complex electronic structure of a three-nuclear metallorganic compound with the capacity of donating and receiving multiple electrons June 9th, 2021

New brain-like computing device simulates human learning: Researchers conditioned device to learn by association, like Pavlov's dog April 30th, 2021

CEA-Leti Announces EU Project to Mimic Multi-Timescale Processing of Biological Neural Systems: Targeted Applications Include High-Dimensional Distributed Environmental Monitoring, Implantable Medical-Diagnostic Microchips, Wearable Electronics & Human/Computer Interfaces April 23rd, 2021

Possible Futures

Researchers develop polyimide-mica nanocomposite film with high resistance to low earth orbit environments December 3rd, 2021

Researchers realize ultra-high precision search for exotic interactions December 3rd, 2021

Optimized method to detect high-dimensional entanglement December 3rd, 2021

Scientists edge closer to probe that would inspect atherosclerotic plaques by forcing molecules to sound their presence December 3rd, 2021

MEMS

Bosch launches longevity program for industrial and IoT applications: High-performance accelerometer, IMU and pressure sensor with 10-year availability July 23rd, 2020

CEA-Leti Develops Tiny Photoacoustic-Spectroscopy System For Detecting Chemicals & Gases: Paper at Photonics West to Present Detector that Could Cost 10x Less Than Existing Systems and Prompt Widespread Use of the Technology February 4th, 2020

MEMS & Sensors Executive Congress Technology Showcase Finalists Highlight Innovations in Automotive, Biomedical and Consumer Electronics: MSIG MEMS & Sensors Executive Congress – October 22-24, 2019, Coronado, Calif. October 1st, 2019

New Video Highlights Specific Topics Sought in Call for Papers for the 2019 IEEE International Electron Devices Meeting (IEDM) June 13th, 2019

Chip Technology

Optimized method to detect high-dimensional entanglement December 3rd, 2021

Two-dimensional bipolar magnetic semiconductors with high Curie-temperature and electrically controllable spin polarization realized in exfoliated Cr(pyrazine)2 monolayers December 3rd, 2021

Efficient photon upconversion at an organic semiconductor interface November 19th, 2021

Visualizing temperature transport: An unexpected technique for nanoscale characterization November 19th, 2021

Announcements

Scientists edge closer to probe that would inspect atherosclerotic plaques by forcing molecules to sound their presence December 3rd, 2021

Two-dimensional bipolar magnetic semiconductors with high Curie-temperature and electrically controllable spin polarization realized in exfoliated Cr(pyrazine)2 monolayers December 3rd, 2021

Review on the femtosecond laser precision micro/nano-engineering December 3rd, 2021

Development of a single-process platform for the manufacture of graphene quantum dots: Precisely controls the bonding configuration of heteroatoms in graphene quantum dots through simple chemical processes. Practical application and commercialization in various fields is expected December 3rd, 2021

Automotive/Transportation

Unprecedented view of a single catalyst nanoparticle at work: X-rays reveal compositional changes on active surface under reaction conditions October 1st, 2021

Silver nanoparticles boost performance of microbial fuel cells September 17th, 2021

Gamechanger for clean hydrogen production, Curtin research finds: Curtin University research has identified a new, cheaper and more efficient electrocatalyst to make green hydrogen from water that could one day open new avenues for large-scale clean energy production September 17th, 2021

HKUST scientists discover new mechanisms of activity improvement on bimetallic catalysts for hydrogen generation and fuel cells August 13th, 2021

Battery Technology/Capacitors/Generators/Piezoelectrics/Thermoelectrics/Energy storage

Developing high-performance MXene electrodes for next-generation powerful battery November 19th, 2021

A materials passport for greener batteries: Research project is investigating more environmentally friendly manufacturing and recycling processes October 15th, 2021

New study shows how to power electronics using mechanical motion: Researchers develop a composite film that can be used in nanogenerators to generate electricity from mechanical motion October 1st, 2021

Stretching the capacity of flexible energy storage September 10th, 2021

Artificial Intelligence

Quantum Physics in Proteins: Artificial intelligence affords unprecedented insights into how biomolecules work November 5th, 2021

Development of dendritic-network-implementable artificial neurofiber transistors: Transistors with a fibrous architecture similar to those of neurons are capable of forming artificial neural networks. Fibrous networks can be used in smart wearable devices and robots September 24th, 2021

Argonne researchers use AI to optimize a popular material coating technique in real time June 25th, 2021

Graphene key for novel hardware security May 10th, 2021

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project