Nanotechnology Now - Press Release: ICPT 2012 to Present Latest R&D and Future Strategies In Microelectronics and Microsystems Oct. 15-17 in Grenoble, France

Home > Press > ICPT 2012 to Present Latest R&D and Future Strategies In Microelectronics and Microsystems Oct. 15-17 in Grenoble, France

Abstract:
The annual International Conference on Planarization/CMP Technology (ICPT) that will take place on October 15-17 in Grenoble, France. Laurent Malier, CEO of Leti and Daniel Bensahel, silicon technology R&D director at STMicroelectronics, will present keynote addresses on future strategies in Microsystems and microelectronics. In addition, conference sessions will be opened by experts from major semiconductor companies and research institutes, such as Intel, GlobalFoundries and Imec.

ICPT 2012 to Present Latest R&D and Future Strategies In Microelectronics and Microsystems Oct. 15-17 in Grenoble, France

Grenoble, France | Posted on October 11th, 2012

Laurent Malier, CEO of CEA-Leti and Daniel Bensahel, silicon technology R&D director at STMicroelectronics, will present keynote addresses on future strategies in Microsystems and microelectronics during ICPT 2012 at the Minatec Conference Center in Grenoble, France, Oct. 15-17.

ICPT, the International Conference on Planarization/CMP Technology, is the annual high-level conference covering all aspects of chemical-mechanical polishing (CMP). It brings together the CMP community, end users from the semiconductor industry, suppliers and research institutes from around the world to exchange information and state-of-the-art research in CMP technology.

Bensahel will address "CMOS Evolutions and New Challenges" at 9:10 a.m. Monday, Oct. 15, and Malier will present "Disruptive Planar & 3D Solutions for Energy Efficiency" in his keynote at 8:30 a.m. Tuesday.

In addition, conference sessions will be opened by experts from major semiconductor companies and research institutes, including:
• Mansour Moinpour, Intel Corporation
• Jinok Moon, Samsung Electronics
• Yongsik Moon, GlobalFoundries
• Katia Devriendt and Patrick Ong, Imec
• Keiichi Kimura, Kyushu Institute of Technology, and
• Xin-Ping Qu, Fudan University of Shanghai

The program includes 32 presentations on topics such as front-end CMP processes for 28nm and beyond, challenges in CMP processes for 14nm logic technology, step-height reduction of 28nm ceria-particle slurry depending on pad surface profile, interaction of surface chemistry and adsorption behavior of CMP abrasives, new explanations of the material removal process in CMP, and CMP processes for future materials like Co and Mo.

The conference also will include two poster sessions to accommodate the large number of papers submitted, and exhibits of innovative CMP products available on the market. Founded by CMP user groups in Europe, Japan, Korea, Taiwan and the United States, the conference alternates its venue among members' countries each year.

For more information visit the conference home page: www.icpt2012.com

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About CEA-Leti
Leti is an institute of CEA, a French research-and-technology organization with activities in energy, IT, healthcare, defence and security. Leti is focused on creating value and innovation through technology transfer to its industrial partners. It specializes in nanotechnologies and their applications, from wireless devices and systems, to biology, healthcare and photonics. NEMS and MEMS are at the core of its activities. An anchor of the MINATEC campus, CEA-Leti operates 8,000-m² of state-of-the-art clean room space on 200mm and 300mm wafer platforms. It employs 1,700 scientists and engineers including 240 Ph.D. students and 200 assignees from partner companies. CEA-Leti owns more than 1,880 patent families.

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