Home > Press > Laser sintering optimized for printed electronics: New study sheds (laser) light on the best means of laying down thin-film circuitry
Abstract:
Printed electronics use standard printing techniques to manufacture electronic devices on different substrates like glass, plastic films, and paper. Interest in this area is growing because of the potential to create cheaper circuits more efficiently than conventional methods. A new study by researchers at Soonchunhyang University in South Korea, published in AIP Advances, from AIP Publishing, provides insights into the processing of copper nanoparticle ink with green laser light.
Kye-Si Kwon and his colleagues previously worked with silver nanoparticle ink, but they turned to copper (derived from copper oxide) as a possible low-cost alternative. Metallic inks composed of nanoparticles hold an advantage over bulk metals because of their lower melting points. Although the melting point of copper is about 1,083 degrees Celsius in bulk, according to Kwon, copper nanoparticles can be brought to their melting point at just 150 to 500 C -- through a process called sintering. Then, they can be merged and bound together.
Kwon's group concentrates on photonic approaches for heating nanoparticles by the absorption of light. "A laser beam can be focused on a very small area, down to the micrometer level," explained Kwon and doctorate student Md. Khalilur Rahman. Heat from the laser serves two main purposes: converting copper oxide into copper and promoting the conjoining of copper particles through melting.
A green laser was selected for these tasks because its light (in the 500- to 800-nanometer wavelength absorption rate range) was deemed best suited to the application. Kwon was also curious because, to his knowledge, the use of green lasers in this role has not been reported elsewhere.
In their experiment, his group used commercially available copper oxide nanoparticle ink, which was spin-coated onto glass at two speeds to obtain two thicknesses. The, they prebaked the material to dry out most of the solvent prior to sintering. This is necessary to reduce the copper oxide film thickness and to prevent air bubble explosions that might occur from the solvent suddenly boiling during irradiation. After a series of tests, Kwon's team concluded that the prebaking temperature should be slightly lower than 200 degrees C.
The researchers also investigated the optimal settings of laser power and scanning speed during sintering to enhance the conductivity of the copper circuits. They discovered that the best sintered results were produced when the laser power ranged from 0.3 to 0.5 watts. They also found that to reach the desired conductivity, the laser scanning speed should not be faster than 100 millimeters per second, or slower than 10 mm/s.
Additionally, Kwon and his group investigated the thickness of the film -- before and after sintering -- and its impact on conductivity. Kwon and his group concluded that sintering reduces thickness by as much as 74 percent.
In future experiments, Kwon's team will examine the substrate effects on sintering. Taken together, these studies can provide answers to some of the uncertainties hindering printed electronics.
####
About American Institute of Physics
AIP Advances is a fully open access, online-only, peer-reviewed journal. It covers all areas of applied physical sciences. With its advanced web 2.0 functionality, the journal puts relevant content and discussion tools in the hands of the community to shape the direction of the physical sciences. See https://aip.scitation.org/journal/adv .
For more information, please click here
Contacts:
Rhys Leahy
301-209-3090
Copyright © American Institute of Physics
If you have a comment, please Contact us.Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Related Links |
Related News Press |
News and information
Simulating magnetization in a Heisenberg quantum spin chain April 5th, 2024
NRL charters Navy’s quantum inertial navigation path to reduce drift April 5th, 2024
Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024
Good as gold - improving infectious disease testing with gold nanoparticles April 5th, 2024
Thin films
Utilizing palladium for addressing contact issues of buried oxide thin film transistors April 5th, 2024
Understanding the mechanism of non-uniform formation of diamond film on tools: Paving the way to a dry process with less environmental impact March 24th, 2023
New study introduces the best graphite films: The work by Distinguished Professor Feng Ding at UNIST has been published in the October 2022 issue of Nature Nanotechnology November 4th, 2022
Possible Futures
Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024
With VECSELs towards the quantum internet Fraunhofer: IAF achieves record output power with VECSEL for quantum frequency converters April 5th, 2024
Chip Technology
Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024
Utilizing palladium for addressing contact issues of buried oxide thin film transistors April 5th, 2024
HKUST researchers develop new integration technique for efficient coupling of III-V and silicon February 16th, 2024
Nanoelectronics
Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023
Key element for a scalable quantum computer: Physicists from Forschungszentrum Jülich and RWTH Aachen University demonstrate electron transport on a quantum chip September 23rd, 2022
Reduced power consumption in semiconductor devices September 23rd, 2022
Atomic level deposition to extend Moore’s law and beyond July 15th, 2022
Discoveries
Chemical reactions can scramble quantum information as well as black holes April 5th, 2024
New micromaterial releases nanoparticles that selectively destroy cancer cells April 5th, 2024
Utilizing palladium for addressing contact issues of buried oxide thin film transistors April 5th, 2024
Announcements
NRL charters Navy’s quantum inertial navigation path to reduce drift April 5th, 2024
Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024
Interviews/Book Reviews/Essays/Reports/Podcasts/Journals/White papers/Posters
Simulating magnetization in a Heisenberg quantum spin chain April 5th, 2024
Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024
Photonics/Optics/Lasers
With VECSELs towards the quantum internet Fraunhofer: IAF achieves record output power with VECSEL for quantum frequency converters April 5th, 2024
Nanoscale CL thermometry with lanthanide-doped heavy-metal oxide in TEM March 8th, 2024
Optically trapped quantum droplets of light can bind together to form macroscopic complexes March 8th, 2024
HKUST researchers develop new integration technique for efficient coupling of III-V and silicon February 16th, 2024
Printing/Lithography/Inkjet/Inks/Bio-printing/Dyes
Presenting: Ultrasound-based printing of 3D materials—potentially inside the body December 8th, 2023
Simple ballpoint pen can write custom LEDs August 11th, 2023
Disposable electronics on a simple sheet of paper October 7th, 2022
The latest news from around the world, FREE | ||
Premium Products | ||
Only the news you want to read!
Learn More |
||
Full-service, expert consulting
Learn More |
||