Home > Press > Imec and SPTS Technologies, an Orbotech Company, Collaborate on Critical Processes for 3D IC Wafer Stacking
Top SEM view for wet and Orbotech dry etch via reveal process |
Abstract:
Nano-electronics research center imec and SPTS Technologies, an Orbotech company (NASDAQ: ORBK) and supplier of advanced wafer processing solutions for the global semiconductor and related industries, announced today at SEMICON West that they are jointly developing a highly accurate, short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding.
Wafer backside processing is critical for 3D-IC wafer stacking. Today, through-silicon vias (TSV) formed using ‘via-middle’ processing, are typically exposed from the backside of 300mm device wafers by a combination of mechanical grinding and wet or dry etch processes. Dielectric layers are then deposited by plasma enhanced chemical vapour deposition (PECVD) to passivate and mechanically support the exposed TSVs prior to bump/RDL (redistribution) formation, followed by chip-to-wafer or wafer-to-wafer bonding.
To develop an industrially viable 3D-IC technology, the via reveal process requires a shorter cycle time etching process. Additionally, due to accumulating non-uniformities coming from the TSV frontside etching, bonding and grinding processes, variations of a few microns may occur in residual silicon thickness above the via tips. Therefore, a highly selective process to thin TSV liners and smooth post-etch surfaces is essential to achieve the necessary precision and control within wafer uniformity.
Imec and SPTS are developing a dry etching solution that features in-situ end-point detection. This enables controlled and very precise processing. The process achieves the required TSV height while avoiding lengthy and multiple rework steps thus minimizing the overall cost per wafer. Our first results demonstrate that 1,57µm nail height can be controlled within 300nm range (see image below).
To follow the via reveal etch step, imec and SPTS will also work on PECVD dielectric passivation stacks, with SiO and SiN layers deposited at temperatures below 200°C. Films will be engineered to optimise device electrical performance and stress-managed to minimize warpage of the thin die after debonding.
The collaboration will use SPTS’s Versalis fxP system, a single-wafer cluster platform carrying both etch and dielectric deposition modules to be installed into imec’s 300mm packaging line in Q32015.
“Equipment suppliers are key in developing an integrated solution for the challenges of scaling technology into advanced nodes,” said An Steegen, senior vice president process technology at imec. “The collaboration with SPTS confirms imec’s direction to accelerate innovation for all our partners by closely interacting with suppliers at an early stage of development.”
“Imec plays a critical role in the long term development of the entire semiconductor value chain, from front to back-end,” said Kevin Crofton President of SPTS, and Corporate Vice President at Orbotech. “Their pre-competitive work supports the roadmaps of their core customers. Their remit dictates that they work with vendors and processes that are enabling for imec and their partners, and to be selected is a huge endorsement of our capabilities. We look forward to the results and milestones that we will achieve together.”
Imec’s research into 3D-IC includes key partners such as GLOBALFOUNDRIES, INTEL, Micron, Panasonic, Samsung, SK Hynix, Sony, and TSMC.
####
About IMEC
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in the Netherlands, Taiwan, USA, China, India and Japan. Its staff of about 2,200 people includes almost 700 industrial residents and guest researchers. In 2014, imec's revenue (P&L) totaled 363 million euro. Further information on imec can be found at www.imec.be. Stay up to date about what’s happening at imec with the monthly imec magazine, available for tablets and smartphones (as an app for iOS and Android), or via the website www.imec.be/imecmagazine
Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.)and imec China (IMEC Microelectronics (Shanghai) Co. Ltd.) and imec India (Imec India Private Limited).
About Orbotech
Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device in the world is produced using Orbotech systems. For more information, visit www.orbotech.com/.
About SPTS Technologies
SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports etch, PVD, CVD and thermal wafer processing solutions for the MEMS, advanced packaging, LEDs, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, Allentown, Pennsylvania, and San Jose, California, the company operates across 19 countries in Europe, North America and Asia-Pacific.
For more information, please click here
Contacts:
Stephanie Black
Business Technology
1215 Cushman Avenue
San Diego, CA 92110
Office 619-234-0345
Copyright © IMEC
If you have a comment, please Contact us.Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Related News Press |
News and information
Researchers develop artificial building blocks of life March 8th, 2024
Chip Technology
New chip opens door to AI computing at light speed February 16th, 2024
HKUST researchers develop new integration technique for efficient coupling of III-V and silicon February 16th, 2024
NRL discovers two-dimensional waveguides February 16th, 2024
Nanoelectronics
Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023
Key element for a scalable quantum computer: Physicists from Forschungszentrum Jülich and RWTH Aachen University demonstrate electron transport on a quantum chip September 23rd, 2022
Reduced power consumption in semiconductor devices September 23rd, 2022
Atomic level deposition to extend Moore’s law and beyond July 15th, 2022
Announcements
What heat can tell us about battery chemistry: using the Peltier effect to study lithium-ion cells March 8th, 2024
Nanoscale CL thermometry with lanthanide-doped heavy-metal oxide in TEM March 8th, 2024
Events/Classes
Researchers demonstrate co-propagation of quantum and classical signals: Study shows that quantum encryption can be implemented in existing fiber networks January 20th, 2023
Alliances/Trade associations/Partnerships/Distributorships
Chicago Quantum Exchange welcomes six new partners highlighting quantum technology solutions, from Chicago and beyond September 23rd, 2022
University of Illinois Chicago joins Brookhaven Lab's Quantum Center June 10th, 2022
Research partnerships
Researchers’ approach may protect quantum computers from attacks March 8th, 2024
'Sudden death' of quantum fluctuations defies current theories of superconductivity: Study challenges the conventional wisdom of superconducting quantum transitions January 12th, 2024
Development of zinc oxide nanopagoda array photoelectrode: photoelectrochemical water-splitting hydrogen production January 12th, 2024
The latest news from around the world, FREE | ||
Premium Products | ||
Only the news you want to read!
Learn More |
||
Full-service, expert consulting
Learn More |
||