Home > News > Intel helps lead Europe's 450-mm wafer initiative
January 13th, 2010
Intel helps lead Europe's 450-mm wafer initiative
Abstract:
European semiconductor manufacturing equipment companies have come together with chip maker Intel Corp. and research group IMEC to form a European 450-mm diameter wafer equipment and materials initiative, called EEMI-450.
The group has held a couple of meetings during 2009 and applied for funding under the ENIAC European nanotechnology program and under the European Union Framework Project 7 (FP7) as a so-called co-ordinated action.
Source:
eetimes.com
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