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February 27th, 2008

Rohm & Haas, IBM eye Cu CMP for 32nm-22nm

Abstract:
Rohm & Haas Electronic Materials/CMP Technologies and IBM are adding to their collaborative plate, following news of joint work on 32nm and below implant materials/processes with a pact to develop CMP processes for integrating copper and low-k dielectrics, in order to create copper CMP consumables for 32nm and 22nm device manufacturing. Research will take place at IBM's Research facility in Yorktown Heights, NY, as well as the U. of Albany's NanoTech complex and Rohm and Haas's Technology Centers in Newark, DE, and Phoenix, AZ.

Source:
sst.pennnet.com

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