Home > News > Infrastructure Predicts Greater Consolidation in Semiconductor and Related Markets in 2008
January 24th, 2008
Infrastructure Predicts Greater Consolidation in Semiconductor and Related Markets in 2008
Abstract:
New Website Features Comprehensive Review of ISS/SMC Forecasts and Issues
Story:
According to Infrastructure's just-released outlook and commentary from the SEMI® Industry Strategy Symposium (ISS), which was held last week in Northern California, continuing macroeconomic disruptions in the U.S. and other parts of the world -- driven primarily by debt-related issues, and concerns about declines in consumer spending -- are putting a chill on the prospects of the semiconductor sector for 2008. Chipmakers, already challenged to keep pace with Moore's Law, face pricing pressure and declining revenues that will likely ripple through the equipment OEM supply chain, spurring greater OEM industry consolidation in the year ahead. The article is one of several features highlighting proceedings at the 2008 ISS and subsequent Semiconductor Materials Conference (SMC), and is available on the new Infrastructure website, which serves executive level subscribers in semiconductor and related electronics markets.
"The consensus among the ISS panel of market forecasters is that 2008 is going to be a challenging year for the device makers," said Carl Johnson, managing director at Infrastructure. "Although IC unit volumes should continue to show decent growth -- around 10 to 12 percent -- average selling prices (ASPs) will be under pressure and revenues for the year are likely to be flat."
He added that semiconductor equipment manufacturers, confronting a year of declining revenue growth, are more receptive than ever to partnerships, collaborations, merger or acquisition strategies that help them expand market share and boost profitability. "We've been hearing predictions of consolidation in this industry for years," Johnson said. "Faced with the slowing revenue growth, 2008 could be the year in which we see an unprecedented number of corporate engagements and marriages in the equipment sector."
This complete story and additional features on the 2008 ISS and SMC conferences are available at www.infras.com.
| Related News Press |
News and information
Decoding hydrogen‑bond network of electrolyte for cryogenic durable aqueous zinc‑ion batteries January 30th, 2026
COF scaffold membrane with gate‑lane nanostructure for efficient Li+/Mg2+ separation January 30th, 2026
Possible Futures
Decoding hydrogen‑bond network of electrolyte for cryogenic durable aqueous zinc‑ion batteries January 30th, 2026
COF scaffold membrane with gate‑lane nanostructure for efficient Li+/Mg2+ separation January 30th, 2026
Chip Technology
Metasurfaces smooth light to boost magnetic sensing precision January 30th, 2026
Beyond silicon: Electronics at the scale of a single molecule January 30th, 2026
Lab to industry: InSe wafer-scale breakthrough for future electronics August 8th, 2025
Announcements
Decoding hydrogen‑bond network of electrolyte for cryogenic durable aqueous zinc‑ion batteries January 30th, 2026
COF scaffold membrane with gate‑lane nanostructure for efficient Li+/Mg2+ separation January 30th, 2026
Events/Classes
Institute for Nanoscience hosts annual proposal planning meeting May 16th, 2025
A New Blue: Mysterious origin of the ribbontail ray’s electric blue spots revealed July 5th, 2024
Researchers demonstrate co-propagation of quantum and classical signals: Study shows that quantum encryption can be implemented in existing fiber networks January 20th, 2023
|
|
||
|
|
||
| The latest news from around the world, FREE | ||
|
|
||
|
|
||
| Premium Products | ||
|
|
||
|
Only the news you want to read!
Learn More |
||
|
|
||
|
Full-service, expert consulting
Learn More |
||
|
|
||