Home > Press > Kinetic Technologies Selects Dongbu HiTek to Manufacture LED Driver ICs Destined for Smart Phone Applications: Korean foundry has begun volume production using its groundbreaking low-voltage BCDMOS process at the 0.18-micron node
Abstract:
Dongbu HiTek today announced that it has begun volume production of LED Driver ICs for Kinetic Technologies, a high-performance analog and mixed-signal fabless company. Implemented with the Korean foundry's specialized low voltage BCDMOS process at the 0.18-micron node (BD180LV), Kinetic's LED Driver ICs are ideal for backlighting smart phone displays and providing the camera's flash feature.
"Our BD180LV process continues to set the high-performance standard for advanced mixed-signal technologies that promise to shrink the size of chips for handheld consumer products," said Jae Song, Dongbu HiTek EVP of marketing. He noted that Dongbu HiTek is leveraging its specialized BCDMOS to implement an expanding range of power management chips such as the LED Driver IC, input protection switches and DC/DC converters for Kinetic. "We look forward to extending our foundry partnership with Kinetic into manufacturing power management chips for AMOLED displays and buck converters as well as other applications."
Dongbu HiTek's BD180LV process was formally launched about four years ago at the International Symposium on Power Semiconductor Devices in Hiroshima, Japan. In a technical paper presented at that time, the company disclosed impressive BD180LV breakdown characteristics for 24V nLDMOS, noting, "The Ids-Vds curve shows very stable characteristics up to 27.5V with actual off-state and on-state breakdown voltages of 36V and 33V, respectively. At 5.0Vgs and 0.1Vds, the Rsp was 0.0145 ohms square millimeter - the lowest ever reported in the semiconductor industry." Since then, the Korean foundry has consistently improved its BD180LV process to maintain its best-in-class achievement.
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About Dongbu HiTek
Dongbu HiTek Co., Ltd. specializes in developing superb analog and mixed-signal processing technologies. The company adds high value to advanced ICs with a processing portfolio that encompasses Analog CMOS, BCDMOS, High Voltage CMOS, CMOS Power Amplifier (PA), CMOS Image Sensor (CIS), Display Driver IC (DDI), Touch Screen Controller IC and Embedded Flash technologies. With its best-in-class BCDMOS technology, the company manufactures power management chips that serve numerous applications ranging from home and handheld electronics to automotive and industrial systems. Currently processing technologies at nodes ranging from 0.35 microns to 90 nanometers, the company complements its world class foundry capabilities with top quality design support, prototype verification and packaging/module development. Headquartered in Seoul, Dongbu HiTek publicly trades its stock under 000990 on the Korea Stock Exchange.
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Contacts:
Dongbu HiTek USA
Elizabeth Estrella-Basilio
Phone: +1.408.238.8822
Copyright © Dongbu HiTek
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