Home > Press > Surface Characterisation in the Semiconductor Industry
![]() |
Abstract:
A new white paper on Surface Characterisation in the Semiconductor Industry, by Dr. Alan Brown, CERAM's Director of Development; available as a free download.
The paper:
* Outlines advantages of employing a range of modern surface characterisation techniques to obtain quantitative chemical and physical information on the structure and composition of semiconductor materials
* Demonstrates how data gained from these techniques can be used by process engineers, designers and failure analysts to optimise production yields, reduce failure rates and improve semiconductor device design.
Dr. Alan Brown explains: "Semiconductor device technology is continually being scaled to smaller dimensions which results in greater device density and higher switching speeds. With this advancement there has been a demand for new materials to counteract the effects of these shrinking dimensions. At the same time, developments in solar research and optoelectronics have also produced a new range of compound semiconductor-based devices with complex thin layer structures. Techniques that facilitate an analysis of surface composition and an understanding of their functionality are proving to be vital in supporting these technological developments."
To download the full white paper, visit www.ceram.com/semiconductor
####
For more information, please click here
Contacts:
Customer enquiries
+44(0)1782 764428
UK customers
0845 026 0902
Switchboard & accounts
+44(0)1782 764444
Copyright © CERAM
If you have a comment, please Contact us.Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
| Related News Press |
News and information
Decoding hydrogen‑bond network of electrolyte for cryogenic durable aqueous zinc‑ion batteries January 30th, 2026
COF scaffold membrane with gate‑lane nanostructure for efficient Li+/Mg2+ separation January 30th, 2026
Chip Technology
Metasurfaces smooth light to boost magnetic sensing precision January 30th, 2026
Beyond silicon: Electronics at the scale of a single molecule January 30th, 2026
Lab to industry: InSe wafer-scale breakthrough for future electronics August 8th, 2025
Nanoelectronics
Lab to industry: InSe wafer-scale breakthrough for future electronics August 8th, 2025
Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023
Key element for a scalable quantum computer: Physicists from Forschungszentrum Jülich and RWTH Aachen University demonstrate electron transport on a quantum chip September 23rd, 2022
Reduced power consumption in semiconductor devices September 23rd, 2022
Announcements
Decoding hydrogen‑bond network of electrolyte for cryogenic durable aqueous zinc‑ion batteries January 30th, 2026
COF scaffold membrane with gate‑lane nanostructure for efficient Li+/Mg2+ separation January 30th, 2026
Interviews/Book Reviews/Essays/Reports/Podcasts/Journals/White papers/Posters
Metasurfaces smooth light to boost magnetic sensing precision January 30th, 2026
COF scaffold membrane with gate‑lane nanostructure for efficient Li+/Mg2+ separation January 30th, 2026
|
|
||
|
|
||
| The latest news from around the world, FREE | ||
|
|
||
|
|
||
| Premium Products | ||
|
|
||
|
Only the news you want to read!
Learn More |
||
|
|
||
|
Full-service, expert consulting
Learn More |
||
|
|
||