Home > News > Applied Materials: Patterning Requires Innovative Metrology
February 28th, 2008
Applied Materials: Patterning Requires Innovative Metrology
Abstract:
Experiments were done with wafers using CDs of various sizes (500 to 40 nm). A trend was discovered that indicated larger features tend to shrink at a fairly constant number of nanometers. "However, we're now in the threshold where feature size is in the order of the excitation volume, and not only is the shrink accelerated, but more of it takes place within one measurement, especially at higher voltages," Bunday said. "This means that as features grow smaller, it'll become necessary to go to lower voltages and lower doses for accurate results. Many manufacturers have been going to higher voltages to get a constant shrink. This may soon become a problem."
Source:
semiconductor.net
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