Home > News > FEI Completes Installation of DA 300HP
November 20th, 2005
FEI Completes Installation of DA 300HP
Abstract:
FEI Company (Nasdaq: FEIC) has completed the first Japanese installation of its advanced DA 300HP DualBeam(TM) system for automated in-fab defect analysis extendable to the 45nm design node.
Source:
prnewswire
| Related News Press |
Chip Technology
A reusable chip for particulate matter sensing April 17th, 2026
Metasurfaces smooth light to boost magnetic sensing precision January 30th, 2026
Nanoelectronics
Lab to industry: InSe wafer-scale breakthrough for future electronics August 8th, 2025
Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023
Key element for a scalable quantum computer: Physicists from Forschungszentrum Jülich and RWTH Aachen University demonstrate electron transport on a quantum chip September 23rd, 2022
Reduced power consumption in semiconductor devices September 23rd, 2022
Announcements
A fundamentally new therapeutic approach to cystic fibrosis: Nanobody repairs cellular defect April 17th, 2026
UC Irvine physicists discover method to reverse ‘quantum scrambling’ : The work addresses the problem of information loss in quantum computing system April 17th, 2026
Tools
Metasurfaces smooth light to boost magnetic sensing precision January 30th, 2026
From sensors to smart systems: the rise of AI-driven photonic noses January 30th, 2026
Japan launches fully domestically produced quantum computer: Expo visitors to experience quantum computing firsthand August 8th, 2025
|
|
||
|
|
||
| The latest news from around the world, FREE | ||
|
|
||
|
|
||
| Premium Products | ||
|
|
||
|
Only the news you want to read!
Learn More |
||
|
|
||
|
Full-service, expert consulting
Learn More |
||
|
|
||