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Nanometrics Incorporated (Nasdaq: NANO), a leading provider of advanced process control metrology systems used primarily in the fabrication of semiconductors, high-brightness LEDs, data storage devices and solar photovoltaics, today announced that a leading semiconductor foundry has ordered a UniFire(TM) 7900 metrology system for advanced 3D wafer-scale packaging process control. This initial system will be delivered in the fourth quarter of 2010 to enable the foundry's transition from development to high volume manufacturing in 2011.
"We are excited to announce that the UniFire has been selected by a leading foundry customer for their next-generation advanced packaging applications," commented Dr. Michael Darwin, vice president of the UniFire and Materials Characterization groups at Nanometrics. "The UniFire is an enabling metrology system in the rapidly growing wafer-scale packaging segment and has been adopted by multiple customers for through-silicon-via (TSV) process control, with measurements including critical dimensions (CD), depth and topography. The deployment of advanced packaging technologies such as TSV and micro-bump formation will enable cost and performance advantages for next-generation devices. These emerging applications provide growth opportunities for Nanometrics, with new manufacturing process steps requiring additional optical metrology solutions."
"This win is indicative of our strategy to grow the company through acquisitions of leading-edge products and technologies that expand our business into emerging and high-growth market segments," commented Tim Stultz, president and chief executive officer of Nanometrics. "The UniFire enables us to offer new and enabling technology to our established logic and memory customers while increasing our penetration of leading foundry customers. As we look forward, the incremental market opportunity for advanced wafer-scale packaging process meaningfully expands our served markets and business growth outlook."
The UniFire has been put into production for both front-end-of-line and back-end-of-line semiconductor and magnetic device manufacturing processes, and for applications including advanced packaging, lithography, etch, chemical mechanical polishing (CMP) and thin film deposition. The UniFire is capable of high precision measurement of two-dimensional and three-dimensional structures for depth, CD, profile, and film thickness control for advanced device manufacturing processes.
Forward Looking Statements
This press release contains forward-looking statements including, but not limited to, statements regarding the expected delivery and capabilities of the UniFire platform, and the ability of the company to expand its served markets and customer penetration through acquisitions. Although Nanometrics believes that the expectations reflected in the forward-looking statements are reasonable, expectations regarding system delivery, toolcapabilities, acquisition strategy and the company's ability to outperform the overall industry are subject to a number of risks, including changes in customer spending plans, deployment of advanced wafer-scale packaging processes, worldwide economic conditions and the qualification and market adoption of the UniFire. For additional information and considerations regarding the risks faced by Nanometrics, see its annual report on Form 10-K for the year ended January 2, 2010 as filed with the Securities and Exchange Commission, as well as other periodic reports filed with the SEC from time to time. Nanometrics disclaims any obligation to update information contained in any forward-looking statement.
Nanometrics is a leading provider of advanced, high-performance process control metrology systems used primarily in the fabrication of semiconductors, high-brightness LEDs, data storage devices and solar photovoltaics. Nanometrics’ automated and integrated metrology systems measure critical dimensions, device structures, overlay registration, topography and various thin film properties, including film thickness as well as optical, electrical and material properties. The company’s process control solutions are deployed throughout the fabrication process, from front-end-of-line substrate manufacturing, to high-volume production of semiconductors and other devices, to advanced wafer-scale packaging applications. Nanometrics’ systems enable device manufacturers to improve yields, increase productivity and lower their manufacturing costs. The company maintains its headquarters in Milpitas, California, with sales and service offices worldwide. Nanometrics is traded on NASDAQ Global Market under the symbol NANO.
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