Nanotechnology Now





Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Ultratech Receives Follow-On, Multi-System Order for Laser Spike Annealing Systems From Major Logic

Abstract:
Ultratech, Inc., a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices, today announced that it has received a follow-on, multiple-system order for its laser spike anneal (LSA) tools from a major foundry in Asia.

Ultratech Receives Follow-On, Multi-System Order for Laser Spike Annealing Systems From Major Logic

San Jose, CA | Posted on February 8th, 2010

Ultratech's LSA100A systems will be used to support high-volume production for advanced logic devices in 2010. Based on Ultratech's proprietary long-wavelength annealing technology, the LSA100A provides significant cost of ownership, process uniformity, and process control advantages that make it an ideal tool for foundry manufacturing. Ultratech's LSA tools are currently being used in all major logic foundries.

Ultratech's Vice President of Laser Product Marketing, Jeff Hebb, Ph.D., noted, "Our foundry customers require a cost-effective, advanced annealing solution that has the flexibility to process many different product layouts while maintaining high product yields. The unique technology of the LSA100A system has demonstrated that it can meet these critical requirements in a foundry environment, and is also extendible to the next two technology generations. Our LSA system provides uniform temperature and uniform process results that are independent of the device layout. As a result, our foundry customers can feel confident that they will not experience yield issues when transferring LSA processes to new product designs, as many have done already. This follow-on, multi-system order further confirms the LSA100A system provides a low-risk solution for the foundries' advanced annealing requirements."

Certain of the statements contained herein, which are not historical facts and which can generally be identified by words such as "anticipates," "expects," "intends," "will," "could," "believes," "estimates," "continue," and similar expressions, are forward-looking statements under Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties, such as risks related to timing, delays, deferrals and cancellations of orders by customers, including as a result of semiconductor manufacturing capacity as well as our customers' financial condition and demand for semiconductors; cyclicality in the semiconductor and nanotechnology industries; general economic and financial market conditions including impact on capital spending, as well as difficulty in predicting changes in such conditions; rapid technological change and the importance of timely product introductions; customer concentration; our dependence on new product introductions and market acceptance of new products and enhanced versions of our existing products; lengthy sales cycles, including the timing of system installations and acceptances; lengthy and costly development cycles for laser-processing and lithography technologies and applications; integration, development and associated expenses of the laser processing operation; pricing pressures and product discounts; high degree of industry competition; intellectual property matters; changes in pricing by us, our competitors or suppliers; international sales; timing of new product announcements and releases by us or our competitors; ability to volume produce systems and meet customer requirements; sole or limited sources of supply; effect of capital market fluctuations on our investment portfolio; ability and resulting costs to attract or retain sufficient personnel to achieve our targets for a particular period; dilutive effect of employee stock option grants on net income per share, which is largely dependent upon our achieving and maintaining profitability and the market price of our stock; mix of products sold; outcome of litigation; manufacturing variances and production levels; timing and degree of success of technologies licensed to outside parties; product concentration and lack of product revenue diversification; inventory obsolescence; asset impairment; changes to financial accounting standards; effects of certain anti-takeover provisions; future acquisitions; volatility of stock price; foreign government regulations and restrictions; business interruptions due to natural disasters or utility failures; environmental regulations; and any adverse effects of terrorist attacks in the United States or elsewhere, or government responses thereto, or military actions in Iraq, Afghanistan and elsewhere, on the economy, in general, or on our business in particular. Such risks and uncertainties are described in Ultratech's SEC reports including its Annual Report on Form 10-K filed for the year ended December 31, 2008 and Quarterly Report on Form 10Q for the quarter ended October 3, 2009. Due to these and additional factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. These forward-looking statements are based on management's current beliefs and expectations, some or all of which may prove to be inaccurate, and which may change. We undertake no obligation to revise or update any forward-looking statements to affect any event or circumstance that may arise after the date of this release.

####

About Ultratech
Ultratech, Inc. (NasdaqGM: UTEK) designs, manufactures and markets photolithography and laser processing equipment. Founded in 1979, the company's market-leading advanced lithography products deliver high throughput and production yields at a low, overall cost of ownership for bump packaging of integrated circuits and high-brightness LEDs. A pioneer of laser processing, Ultratech developed laser spike anneal technology, which increases device yield, improves transistor performance and enables the progression of Moore's Law for 65-nm and below production of state-of-the-art consumer electronics. Visit Ultratech online at: www.ultratech.com.

For more information, please click here

Contacts:
3050 Zanker Road
San Jose, CA 95134
(800) 222-1213
(408) 321-8835
(408) 325-6444 Fax

Copyright © Ultratech

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Conversion of Greenhouse Gases to Syngas in Presence of Nanocatalysts in Iran May 22nd, 2015

New Antibacterial Wound Dressing in Iran Can Display Replacement Time May 22nd, 2015

Haydale Named Lead Sponsor for Cambridge Graphene Festival May 22nd, 2015

Simulations predict flat liquid May 21st, 2015

Chip Technology

Nanometrics Announces Live Webcast of Upcoming Investor and Analyst Day May 20th, 2015

Sandia researchers first to measure thermoelectric behavior by 'Tinkertoy' materials May 20th, 2015

Defects can 'Hulk-up' materials: Berkeley lab study shows properly managed damage can boost material thermoelectric performances May 20th, 2015

GLOBALFOUNDRIES Offers New Low-Power 28nm Solution for High-Performance Mobile and IoT Applications: Technology is the first in the industry to provide design enablement support optimized to meet low power requirements of RF SoCs May 20th, 2015

Nanoelectronics

Random nanowire configurations increase conductivity over heavily ordered configurations May 16th, 2015

Channeling valleytronics in graphene: Berkeley Lab researchers discover 1-D conducting channels in bilayer graphene May 6th, 2015

A better way to build DNA scaffolds: McGill researchers devise new technique to produce long, custom-designed DNA strands May 6th, 2015

Surface matters: Huge reduction of heat conduction observed in flat silicon channels April 23rd, 2015

Announcements

Conversion of Greenhouse Gases to Syngas in Presence of Nanocatalysts in Iran May 22nd, 2015

New Antibacterial Wound Dressing in Iran Can Display Replacement Time May 22nd, 2015

Haydale Named Lead Sponsor for Cambridge Graphene Festival May 22nd, 2015

INSIDDE: Uncovering the real history of art using a graphene scanner May 21st, 2015

Tools

Nanometrics Announces Live Webcast of Upcoming Investor and Analyst Day May 20th, 2015

Taking control of light emission: Researchers find a way of tuning light waves by pairing 2 exotic 2-D materials May 20th, 2015

DELMIC announces a workshop hosted by Phenom World on Integrated CLEM to be held on Wednesday June 24th at the Francis Crick Institute (Lincoln Inn Fields Laboratory). May 19th, 2015

DiATOME enables surface preparation for AFM and FIB May 19th, 2015

New-Contracts/Sales/Customers

Argonne chooses Beneqs TFS 500 Atomic Layer Deposition System: Modularity and flexibility make for a natural choice May 14th, 2015

New JEOL E-Beam Lithography System to Enhance Quantum NanoFab Capabilities May 6th, 2015

FEI Partners With the George Washington University to Equip New Science & Engineering Hall: Suite of new high-performance microscopes will be used for cutting-edge experiments at GWs new research facility April 29th, 2015

Renishaw Raman systems used to study 2D materials at Boston University, Massachusetts, USA. April 28th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project