Home > News > Research dishes out flexible computer chips
July 18th, 2006
Research dishes out flexible computer chips
Abstract:
New thin-film semiconductor techniques invented by University of Wisconsin-Madison engineers promise to add sensing, computing and imaging capability to an amazing array of materials.
A team led by electrical and computer engineer Zhenqiang (Jack) Ma and materials scientist Max Lagally have developed a process to remove a single-crystal film of semiconductor from the substrate on which it is built. This thin layer (only a couple of hundred nanometers thick) can be transferred to glass, plastic or other flexible materials, opening a wide range of possibilities for flexible electronics. In addition, the semiconductor film can be flipped as it is transferred to its new substrate, making its other side available for more components. This doubles the possible number of devices that can be placed on the film.
Source:
University of Wisconsin-Madison
Bookmark:
| Related News Press |
Possible Futures
Decoding hydrogen‑bond network of electrolyte for cryogenic durable aqueous zinc‑ion batteries January 30th, 2026
COF scaffold membrane with gate‑lane nanostructure for efficient Li+/Mg2+ separation January 30th, 2026
Chip Technology
Metasurfaces smooth light to boost magnetic sensing precision January 30th, 2026
Beyond silicon: Electronics at the scale of a single molecule January 30th, 2026
Lab to industry: InSe wafer-scale breakthrough for future electronics August 8th, 2025
Announcements
Decoding hydrogen‑bond network of electrolyte for cryogenic durable aqueous zinc‑ion batteries January 30th, 2026
COF scaffold membrane with gate‑lane nanostructure for efficient Li+/Mg2+ separation January 30th, 2026
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||