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April 4th, 2006

IMEC, Ghent University Create Bendable Ultra-Thin Chips

Abstract:
Leuven, Belgium-based nanoelectronics and nanotechnology research center IMEC and its associated laboratory INTEC of the University of Ghent jointly developed a new process flow for ultra-thin chip packages resulting in bendable packaged chips of only 50 micron thickness that allows embedding packaged chips empowering smart, highly-integrated, flexible electronic systems for a wide variety of applications.

Source:
reed-electronics.com

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