Home > News > Standards may move inside the process chamber
April 12th, 2005
Standards may move inside the process chamber
Abstract:
Paolo Gargini, Intel Fellow and chairman of the International Technology Roadmap for Semiconductors organization, said that standardization may have to go much further than in the past to allow nanotechnology to be developed on 450-mm diameter wafers.
Source:
EETimes
| Related News Press |
Chip Technology
Metasurfaces smooth light to boost magnetic sensing precision January 30th, 2026
Beyond silicon: Electronics at the scale of a single molecule January 30th, 2026
Lab to industry: InSe wafer-scale breakthrough for future electronics August 8th, 2025
Announcements
Decoding hydrogen‑bond network of electrolyte for cryogenic durable aqueous zinc‑ion batteries January 30th, 2026
COF scaffold membrane with gate‑lane nanostructure for efficient Li+/Mg2+ separation January 30th, 2026
|
|
||
|
|
||
| The latest news from around the world, FREE | ||
|
|
||
|
|
||
| Premium Products | ||
|
|
||
|
Only the news you want to read!
Learn More |
||
|
|
||
|
Full-service, expert consulting
Learn More |
||
|
|
||