Home > News > Direct writing in three dimensions
August 16th, 2004
Direct writing in three dimensions
Abstract:
The ability to pattern materials in three dimensions is critical for several emerging technologies, including photonics, microfluidics, microelectromechanical systems, and biomaterials. Direct-write assembly allows one to design and rapidly fabricate materials in complex three-dimensional shapes without the need for expensive tooling, dies, or lithographic masks. Here, recent advances in ink and laser writing techniques are reviewed with an emphasis on the push toward finer feature sizes.
Source:
ScienceDirect
Bookmark:
| Related News Press |
Chip Technology
Metasurfaces smooth light to boost magnetic sensing precision January 30th, 2026
Beyond silicon: Electronics at the scale of a single molecule January 30th, 2026
Lab to industry: InSe wafer-scale breakthrough for future electronics August 8th, 2025
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||