Home > News > Nanodevice connections leap forward
July 1st, 2004
Nanodevice connections leap forward
Abstract:
Until now, making contact to nanowires and nanotubes in electronic devices has meant using lithography to define metal electrodes. But this means that the contacts must be relatively large. Now, researchers at Harvard University, US, have come up with an integrated contact and interconnection method that overcomes this inherent size constraint. The technique transforms selected regions of silicon nanowires into metallic nickel silicide. (more on earlier article)
Source:
Nanotechweb
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