Home > News > Toshiba ready for 65 nm fabrication in first half 2005
February 20th, 2004
Toshiba ready for 65 nm fabrication in first half 2005
Abstract:
Toshiba Corp. has completed its 300mm wafer fab in Oita, Kyushu, and intends to lead the industry with fabrication of chips on a 65 nm process line in the first half of next year. The 65-nm process will be for volume production. Part of the new fab's capacity will be allocated to the virtual joint venture fab with Sony Corp. Toshiba and Sony respectively invested 42 billion yen (about $389 million) for the virtual fab.
Source:
EETimes
Bookmark:
| Related News Press |
Chip Technology
Metasurfaces smooth light to boost magnetic sensing precision January 30th, 2026
Beyond silicon: Electronics at the scale of a single molecule January 30th, 2026
Lab to industry: InSe wafer-scale breakthrough for future electronics August 8th, 2025
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||