Home > News > Immersion could extend to 22-nm node
January 28th, 2004
Immersion could extend to 22-nm node
Abstract:
Taiwan Semiconductor Manufacturing Corp. plans to introduce immersion lithography for critical layers of the 65-nm node, starting in the middle of 2005, said Burn Lin, senior director of the micropatterning technology division at TSMC.
Source:
EETimes
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