Home > News > Immersion could extend to 22-nm node
January 28th, 2004
Immersion could extend to 22-nm node
Abstract:
Taiwan Semiconductor Manufacturing Corp. plans to introduce immersion lithography for critical layers of the 65-nm node, starting in the middle of 2005, said Burn Lin, senior director of the micropatterning technology division at TSMC.
Source:
EETimes
Related News Press |
Chip Technology
New method cracked for high-capacity, secure quantum communication July 5th, 2024
Diamond glitter: A play of colors with artificial DNA crystals May 17th, 2024
Oscillating paramagnetic Meissner effect and Berezinskii-Kosterlitz-Thouless transition in cuprate superconductor May 17th, 2024
![]() |
||
![]() |
||
The latest news from around the world, FREE | ||
![]() |
![]() |
||
Premium Products | ||
![]() |
||
Only the news you want to read!
Learn More |
||
![]() |
||
Full-service, expert consulting
Learn More |
||
![]() |