Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system

Abstract:
GLOBALFOUNDRIES today announced that it has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14™ integrated design system for application-specific integrated circuits (ASICs).

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system

Santa Clara, CA | Posted on August 9th, 2017

The 2.5D ASIC solution includes a stitched interposer capability to overcome lithography limitations and a two terabits per second (2Tbps) multi-lane HBM2 PHY, developed in partnership with Rambus, Inc. Building on the 14nm FinFET demonstration, the solution will be integrated on the company’s next-generation FX-7™ ASIC design system built on GF’s 7nm FinFET process technology.

“With the tremendous advances in interconnect and packaging technology that has occurred in recent years, the line between wafer processing and packaging has blurred,” said Kevin O’Buckley, vice president of ASIC product development at GF. “Incorporating 2.5D packaging into ASIC design boosts performance beyond scaling and is a natural evolution of our capabilities. It enables us to support our customers in a one-stop end-to-end fashion, from product design all the way through manufacturing and testing.”

The Rambus memory PHY is aimed at high-end networking and data center applications performing the most data-intensive tasks in systems requiring low-latency and high-bandwidth. The PHY is compliant with the JEDEC JESD235 HBM2 standard, supporting data rates up to 2Gbps per data pin, enabling a total bandwidth of 2Tbps.

“We strive to deliver comprehensive HBM PHY technologies that will enable data center and networking solution providers to meet today’s most demanding workloads and take advantage of compelling market opportunities,” said Luc Seraphin, senior vice president and general manager, Memory and Interfaces Division at Rambus. “Our collaboration with GF combines our HBM2 PHY with their 2.5D packaging and FX-14 ASIC design system and provides a fully-integrated solution for the industry’s fastest-growing applications.”

FX-14 and FX-7 are complete ASIC design solutions that take advantage of GF’s experience in volume production with FinFET process technology. They comprise functional modules based on the industry’s broadest and deepest intellectual property (IP) portfolio, which makes possible unique solutions for next-generation wired/5G wireless networking, cloud/data center servers, machine learning/deep neural networks, automotive, and aerospace/defense applications. GF is one of only two companies in the world that delivers best-in-class IP plus advanced memory and packaging solutions.

####

About GLOBALFOUNDRIES
GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Development Company.

For more information, please click here

Copyright © GLOBALFOUNDRIES

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Silk could improve sensitivity, flexibility of wearable body sensors August 20th, 2017

The power of perovskite: OIST researchers improve perovskite-based technology in the entire energy cycle, from solar cells harnessing power to LED diodes to light the screens of future electronic devices and other lighting applications August 18th, 2017

Gold nanostars and immunotherapy vaccinate mice against cancer: New treatment cures, vaccinates mouse in small proof-of-concept study August 18th, 2017

Researchers printed graphene-like materials with inkjet August 17th, 2017

Hardware

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Atomic discovery opens door to greener, faster, smaller electronic circuitry: Scientists find way to correct communication pathways in silicon chips, making them perfect July 27th, 2017

First Capacitive Transducer with 13nm Gap July 27th, 2017

Tokyo Institute of Technology research: Antiaromatic molecule displays record electrical conductance July 19th, 2017

Possible Futures

Silk could improve sensitivity, flexibility of wearable body sensors August 20th, 2017

The power of perovskite: OIST researchers improve perovskite-based technology in the entire energy cycle, from solar cells harnessing power to LED diodes to light the screens of future electronic devices and other lighting applications August 18th, 2017

Gold nanostars and immunotherapy vaccinate mice against cancer: New treatment cures, vaccinates mouse in small proof-of-concept study August 18th, 2017

Researchers printed graphene-like materials with inkjet August 17th, 2017

Chip Technology

Silk could improve sensitivity, flexibility of wearable body sensors August 20th, 2017

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Surprise discovery in the search for energy efficient information storage August 10th, 2017

Nanoelectronics

GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry’s First Automotive FPCU to Boost Performance for Hybrid and Electric Vehicles: Silicon Mobility and GF’s 55nm LPx -enabled platform, with SST’s highly-reliable SuperFlash® memory technology, boosts automotive performance, ene August 3rd, 2017

Scientists discover new magnet with nearly massless charge carriers July 29th, 2017

Atomic discovery opens door to greener, faster, smaller electronic circuitry: Scientists find way to correct communication pathways in silicon chips, making them perfect July 27th, 2017

Tokyo Institute of Technology research: Antiaromatic molecule displays record electrical conductance July 19th, 2017

Announcements

Silk could improve sensitivity, flexibility of wearable body sensors August 20th, 2017

The power of perovskite: OIST researchers improve perovskite-based technology in the entire energy cycle, from solar cells harnessing power to LED diodes to light the screens of future electronic devices and other lighting applications August 18th, 2017

Gold nanostars and immunotherapy vaccinate mice against cancer: New treatment cures, vaccinates mouse in small proof-of-concept study August 18th, 2017

Researchers printed graphene-like materials with inkjet August 17th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project