Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Bruker Launches ContourSP 3D Optical Microscope for PCB Industry: Large-Format Metrology System Debuts to Over $5 Million in Orders

Abstract:
Bruker announced today that it has launched the ContourSP large panel metrology system, which more than doubles the measurement throughput of the high-density interconnect (HDI) substrates in multi-chip modules (MCM) over previous generation SP models used by the semiconductor packaging industry. Specifically designed to measure each layer of the printed circuit board (PCB) panels during manufacturing, the gage-capable ContourSP assures the minimum recipe development time, highest yield, maximum up-time, and lowest cost per measured panel in production. These features have already led to over $5 million in orders by several leading HDI/MCM PCB manufacturers.

Bruker Launches ContourSP 3D Optical Microscope for PCB Industry: Large-Format Metrology System Debuts to Over $5 Million in Orders

Tucson, AZ | Posted on December 10th, 2013

"Demand for Bruker's fifth generation SP model continues to build as early adoption customers enjoy the advanced capabilities and ease of use offered by the ContourSP," said Mark R. Munch, Ph.D., President of the Bruker MAT Group. "By doubling the throughput and adding new proprietary measurement capabilities, our customers are able to achieve maximum productivity in this era of ever smaller line widths and tighter tolerances in the PCB industry."

"Not only is the ContourSP much faster than other systems at performing these precise measurements, but we've added a number of productivity enhancing features," added Kent Heath, Senior Director of Marketing for Bruker's Stylus and Optical Business. "The new Vision64® operator interface with multi-processing features multi-region analysis, automatic re-measurement, and our proprietary Dynamic Signal Segmentation (DSS) analysis, making the ContourSP the most comprehensive tool available."

About ContourSP

Based on white light interferometry, the ContourSP incorporates decades of packaging and panel measurement experience to provide unprecedented speed, metrology capability, reliability, serviceability, and manufacturing readiness for 3D critical dimension measurements in MCM and HDI PCB applications. Bruker's high-performance 3D optical microscopes feature Vision64 operating and analysis software, and the industry's most intuitive, modular user interface to deliver user-level-customization capabilities for the widest possible range of surface profiling metrology applications. The ContourSP also utilizes Bruker's revolutionary gantry-based design and integrated workstation to support up to 600x600-millimeter samples in a highly compact footprint.

####

About Bruker Corporation
Bruker Corporation is a leading provider of high-performance scientific instruments and solutions for molecular and materials research, as well as for industrial and applied analysis.

For more information, please click here

Contacts:
Stephen Hopkins, Marketing Communications
Bruker Nano Surfaces Division
3400 East Britannia Drive, Suite 150, Tucson, AZ 85706
T: +1 (520) 741-1044 x1022

Copyright © Bruker Corporation

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Atomic imperfections move quantum communication network closer to reality June 25th, 2017

Research accelerates quest for quicker, longer-lasting electronics: UC Riverside-led research makes topological insulators magnetic well above room temperatures June 25th, 2017

U.S. Air Force Research Lab Taps IBM to Build Brain-Inspired AI Supercomputing System: Equal to 64 million neurons, new neurosynaptic supercomputing system will power complex AI tasks at unprecedented speed and energy efficiency June 23rd, 2017

Rice U. chemists create 3-D printed graphene foam June 22nd, 2017

Imaging

Researchers developed nanoparticle based contrast agent for dual modal imaging of cancer June 21st, 2017

Cambridge Nanotherm partners with Inabata for global sales and distribution June 20th, 2017

GLOBALFOUNDRIES Launches 7nm ASIC Platform for Data Center, Machine Learning, and 5G Networks FX-7TM offering leverages the company’s 7nm: FinFET process to deliver best in class IP and Solutions June 13th, 2017

The Zeiss Global Centre in the School of Engineering at the University of Portsmouth uses Deben µXCT stages to characterise the structural competence of biological structures June 13th, 2017

Chip Technology

Atomic imperfections move quantum communication network closer to reality June 25th, 2017

Research accelerates quest for quicker, longer-lasting electronics: UC Riverside-led research makes topological insulators magnetic well above room temperatures June 25th, 2017

U.S. Air Force Research Lab Taps IBM to Build Brain-Inspired AI Supercomputing System: Equal to 64 million neurons, new neurosynaptic supercomputing system will power complex AI tasks at unprecedented speed and energy efficiency June 23rd, 2017

Alloying materials of different structures offers new tool for controlling properties June 19th, 2017

Announcements

Atomic imperfections move quantum communication network closer to reality June 25th, 2017

Research accelerates quest for quicker, longer-lasting electronics: UC Riverside-led research makes topological insulators magnetic well above room temperatures June 25th, 2017

U.S. Air Force Research Lab Taps IBM to Build Brain-Inspired AI Supercomputing System: Equal to 64 million neurons, new neurosynaptic supercomputing system will power complex AI tasks at unprecedented speed and energy efficiency June 23rd, 2017

Rice U. chemists create 3-D printed graphene foam June 22nd, 2017

New-Contracts/Sales/Customers

Park Systems Introduces Park NX12 for Unsurpassed Affordable High Resolution NanoScale Imaging Required for Advanced Analytical Chemistry, Materials Research, and Multi-User Facility June 5th, 2017

UnitySC Announces Wafer Thinning Inspection System; Win from Power Semiconductor IDM for Automotive: Leading IDM Selects New 4See Series Automated Defect Inspection Platform for Power Semiconductor Automotive Applications May 11th, 2017

JPK selects compact tensile stage from Deben for their NanoWizard® AFM platform to broaden capabilities for materials characterisation February 22nd, 2017

Cetim Facility Receives Bruker Contour CMM Dimensional Analysis System: New Optical Coordinate Measurement Technology Enables High-Precision 3D Scanning November 16th, 2016

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project