Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SEMATECH to conduct rigorous manufacturability assessments to enable high volume manufacturing readiness of 3D technology: ISMI to develop Equipment Maturity Assessments to provide valuable data on the test and production readiness of emerging 3D equipment

Abstract:
To enable high-volume production readiness of 3D-based products, SEMATECH's 3D Interconnect and Manufacturability programs will be conducting Equipment Maturity Assessments (EMAs) of several critical 3D tools during 2012 to establish functional equipment capabilities and address high volume manufacturing maturity issues. The assessment is a cooperative effort among experts from SEMATECH's 3D program, ISMI's EMA team, and the supplier.

SEMATECH to conduct rigorous manufacturability assessments to enable high volume manufacturing readiness of 3D technology: ISMI to develop Equipment Maturity Assessments to provide valuable data on the test and production readiness of emerging 3D equipment

Albany, NY | Posted on January 16th, 2012

3D integration is introducing several new process steps primarily on the wafer backside and between chip makers fab processes and packaging. These include temporary bonding to handle wafers, wafer thinning, through-silicon via (TSV) reveal, re-distribution layers (RDL), wafer or die bonding, and wafer release. Compared to existing fab tools, these new processes and the accompanying tools are relatively immature and need a comprehensive understanding of tool performances to prepare for high volume manufacturing (HVM).

Based on its decade long experience with wafer size transition programs, ISMI has refined and extended its Equipment Maturity Assessment tool to provide a systematic, rigorous assessment of semiconductor equipment to determine test readiness as well as production or HVM readiness.

During the EMA process, experts from SEMATECH's 3D IC program and ISMI's EMA team will evaluate performance characteristics in several developing 3D equipment and provide performance management tool solutions that will detect manufacturability issues in advance of manufacturing insertion. Additionally, a broader HVM readiness assessment can be performed to extend an existing EMA test program.

"3D is a major industry transition. ISMI has successfully applied the EMA methodology to two major wafer size transitions," said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect program. "SEMATECH's 3D program members and supplier partners will benefit by applying this methodology to refine tools and accelerate the readiness of HVM introduction of 3D interconnects."

"The EMA aims to ensure that enough information is collected to make a sound judgment about the amount of testing to which equipment should be subjected during demonstration testing," said Sanjay Rajguru, director of ISMI. "Our EMA team will be working with SEMATECH's technical programs to produce valuable characterization information on critical tools that IC makers and suppliers can use to detect manufacturability issues in early development phases."

SEMATECH's programs are pragmatic and value-driven, to help members develop processes and materials to reduce costs and maximize their return on investment. SEMATECH's 3D Program delivers robust 300 mm equipment and process technology solutions for high-volume TSV manufacturing. At the same time, ISMI works cooperatively with semiconductor manufacturers on developing innovative manufacturing capabilities to solve common productivity, cost and cycle time challenges in semiconductor factories and equipment.

To learn more about conducting EMAs for suppliers of wafer backside processing equipment, contact .

####

About SEMATECH
SEMATECH®, the international consortium of leading semiconductor device, equipment, and materials manufacturers, this year celebrates 25 years of excellence in accelerating the commercialization of technology innovations into manufacturing solutions. Through our unwavering commitment to foster collaboration across the nanoelectronics industry, we help our members and partners address critical industry transitions, drive technical consensus, pull research into the industry mainstream, improve manufacturing productivity, and reduce risk and time to market.

ISMI is a global alliance of the world’s major semiconductor manufacturers, dedicated to reducing cost per wafer and ultimately cost per die, through cooperative programs focused on manufacturing effectiveness. ISMI is a wholly-owned subsidiary of SEMATECH.

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related Links

Twitter:

Related News Press

News and information

Bosch announces high-performance MEMS acceleration sensors for wearables June 27th, 2017

Nanometrics to Participate in the 9th Annual CEO Investor Summit 2017: Accredited investor and publishing research analyst event held concurrently with SEMICON West and Intersolar 2017 in San Francisco June 27th, 2017

NMRC, University of Nottingham chooses the Quorum Q150 coater for its reliable and reproducible film thickness when coating samples with iridium June 27th, 2017

Picosun’s ALD solutions enable novel high-speed memories June 27th, 2017

Chip Technology

Nanometrics to Participate in the 9th Annual CEO Investor Summit 2017: Accredited investor and publishing research analyst event held concurrently with SEMICON West and Intersolar 2017 in San Francisco June 27th, 2017

New TriboLab CMP Provides Cost-Effective Characterization of Chemical Mechanical Wafer Polishing Processes: Bruker Updates Industry-Standard CP-4 Platform for Most Flexible and Reliable Testing June 27th, 2017

Atomic imperfections move quantum communication network closer to reality June 25th, 2017

Research accelerates quest for quicker, longer-lasting electronics: UC Riverside-led research makes topological insulators magnetic well above room temperatures June 25th, 2017

Nanoelectronics

Research accelerates quest for quicker, longer-lasting electronics: UC Riverside-led research makes topological insulators magnetic well above room temperatures June 25th, 2017

GLOBALFOUNDRIES on Track to Deliver Leading-Performance 7nm FinFET Technology: New 7LP technology offers 40 percent performance boost over 14nm FinFET June 13th, 2017

Seeing the invisible with a graphene-CMOS integrated device June 6th, 2017

IBM Research Alliance Builds New Transistor for 5nm Technology: Less than two years since announcing a 7nm test chip, scientists have achieved another breakthrough June 5th, 2017

Announcements

Bosch announces high-performance MEMS acceleration sensors for wearables June 27th, 2017

Nanometrics to Participate in the 9th Annual CEO Investor Summit 2017: Accredited investor and publishing research analyst event held concurrently with SEMICON West and Intersolar 2017 in San Francisco June 27th, 2017

NMRC, University of Nottingham chooses the Quorum Q150 coater for its reliable and reproducible film thickness when coating samples with iridium June 27th, 2017

Picosun’s ALD solutions enable novel high-speed memories June 27th, 2017

Tools

Nanometrics to Participate in the 9th Annual CEO Investor Summit 2017: Accredited investor and publishing research analyst event held concurrently with SEMICON West and Intersolar 2017 in San Francisco June 27th, 2017

NMRC, University of Nottingham chooses the Quorum Q150 coater for its reliable and reproducible film thickness when coating samples with iridium June 27th, 2017

New TriboLab CMP Provides Cost-Effective Characterization of Chemical Mechanical Wafer Polishing Processes: Bruker Updates Industry-Standard CP-4 Platform for Most Flexible and Reliable Testing June 27th, 2017

Researchers developed nanoparticle based contrast agent for dual modal imaging of cancer June 21st, 2017

Alliances/Trade associations/Partnerships/Distributorships

U.S. Air Force Research Lab Taps IBM to Build Brain-Inspired AI Supercomputing System: Equal to 64 million neurons, new neurosynaptic supercomputing system will power complex AI tasks at unprecedented speed and energy efficiency June 23rd, 2017

Cambridge Nanotherm partners with Inabata for global sales and distribution June 20th, 2017

Thought Leaders and Experts Join National Graphene Association Advisory Board June 16th, 2017

Microsoft, Purdue collaborate to advance quantum computing May 30th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project