- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
Home > Press > SEMATECH to conduct rigorous manufacturability assessments to enable high volume manufacturing readiness of 3D technology: ISMI to develop Equipment Maturity Assessments to provide valuable data on the test and production readiness of emerging 3D equipment
To enable high-volume production readiness of 3D-based products, SEMATECH's 3D Interconnect and Manufacturability programs will be conducting Equipment Maturity Assessments (EMAs) of several critical 3D tools during 2012 to establish functional equipment capabilities and address high volume manufacturing maturity issues. The assessment is a cooperative effort among experts from SEMATECH's 3D program, ISMI's EMA team, and the supplier.
3D integration is introducing several new process steps primarily on the wafer backside and between chip makers fab processes and packaging. These include temporary bonding to handle wafers, wafer thinning, through-silicon via (TSV) reveal, re-distribution layers (RDL), wafer or die bonding, and wafer release. Compared to existing fab tools, these new processes and the accompanying tools are relatively immature and need a comprehensive understanding of tool performances to prepare for high volume manufacturing (HVM).
Based on its decade long experience with wafer size transition programs, ISMI has refined and extended its Equipment Maturity Assessment tool to provide a systematic, rigorous assessment of semiconductor equipment to determine test readiness as well as production or HVM readiness.
During the EMA process, experts from SEMATECH's 3D IC program and ISMI's EMA team will evaluate performance characteristics in several developing 3D equipment and provide performance management tool solutions that will detect manufacturability issues in advance of manufacturing insertion. Additionally, a broader HVM readiness assessment can be performed to extend an existing EMA test program.
"3D is a major industry transition. ISMI has successfully applied the EMA methodology to two major wafer size transitions," said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect program. "SEMATECH's 3D program members and supplier partners will benefit by applying this methodology to refine tools and accelerate the readiness of HVM introduction of 3D interconnects."
"The EMA aims to ensure that enough information is collected to make a sound judgment about the amount of testing to which equipment should be subjected during demonstration testing," said Sanjay Rajguru, director of ISMI. "Our EMA team will be working with SEMATECH's technical programs to produce valuable characterization information on critical tools that IC makers and suppliers can use to detect manufacturability issues in early development phases."
SEMATECH's programs are pragmatic and value-driven, to help members develop processes and materials to reduce costs and maximize their return on investment. SEMATECH's 3D Program delivers robust 300 mm equipment and process technology solutions for high-volume TSV manufacturing. At the same time, ISMI works cooperatively with semiconductor manufacturers on developing innovative manufacturing capabilities to solve common productivity, cost and cycle time challenges in semiconductor factories and equipment.
To learn more about conducting EMAs for suppliers of wafer backside processing equipment, contact .
SEMATECH®, the international consortium of leading semiconductor device, equipment, and materials manufacturers, this year celebrates 25 years of excellence in accelerating the commercialization of technology innovations into manufacturing solutions. Through our unwavering commitment to foster collaboration across the nanoelectronics industry, we help our members and partners address critical industry transitions, drive technical consensus, pull research into the industry mainstream, improve manufacturing productivity, and reduce risk and time to market.
ISMI is a global alliance of the world’s major semiconductor manufacturers, dedicated to reducing cost per wafer and ultimately cost per die, through cooperative programs focused on manufacturing effectiveness. ISMI is a wholly-owned subsidiary of SEMATECH.
For more information, please click here
257 Fuller Road, Suite 2200
Albany, NY 12203
Copyright © SEMATECHIf you have a comment, please Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
|Related News Press|
News and information
The quantum middle man July 2nd, 2015
Emergence of a 'devil's staircase' in a spin-valve system July 1st, 2015
Exagan Raises €5.7 Million to Produce High-efficiency GaN-on-Silicon Power-switching Devices on 200mm Wafers: Leti-and-Soitec Spinout Focused on Becoming Leading European Source Of GaN Devices for Solar, Automotive, Telecoms and Infrastructure June 25th, 2015
Nanowires could be the LEDs of the future June 25th, 2015
Leti to Present Solutions to New Applications Using 3D Technologies at SEMICON West LetiDay Event, July 14: Leti Experts also Will Speak at TechXPOT Session on MEMS and STS Session on Lithography Cost-and-Productivity Issues Below 14nm June 22nd, 2015
Clues to inner atomic life from subtle light-emission shifts: Hyperfine structure of light absorption by short-lived cadmium atom isotopes reveals characteristics of the nucleus that matter for high precision detection methods July 3rd, 2015
Dyesol Joins Solliance as an Industrial Partner June 17th, 2015