Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Asahi Kasei Orders IQ Aligner UV-NIL System From EV Group for Advanced Materials Development for High-Resolution Wafer-Level Optics: System to Include EVG's Monolithic Lens Molding (MLM) Technology to Support Production of More Compact, Higher-quality Lens Stacks

Abstract:
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Asahi Kasei E-Materials Corporation, the core operating company of the Asahi Kasei Group for electronics materials, energy materials, photosensitive materials and epoxy resins, has purchased an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG. The IQ Aligner, a flexible platform designed to enable multiple steps in the manufacture of wafer-level cameras, will be used by Asahi Kasei to develop materials critical for enabling high-resolution wafer-level optics (which are used in a wide variety of applications, such as smart phones and pico projectors).

Asahi Kasei Orders IQ Aligner UV-NIL System From EV Group for Advanced Materials Development for High-Resolution Wafer-Level Optics: System to Include EVG's Monolithic Lens Molding (MLM) Technology to Support Production of More Compact, Higher-quality Lens Stacks

Chiba City, Japan | Posted on December 7th, 2011

"As a leading provider of high-clarity, high-heat-resistant materials for optical and display components used in mobile electronics equipment, Asahi Kasei places great importance on research and development of new materials to better serve the rapidly growing mobile device market," stated Mr. Shoichi Furukawa, General Manager, Electronics Materials Division, for Asahi Kasei. "We purchased EVG's IQ Aligner to support our research and development efforts because it is the de-facto industry standard for UV-NIL, which is a critical enabler of wafer-level optics. We anticipate that the IQ Aligner, and the close cooperation with EVG's process teams, will significantly contribute to our development of new and unique materials that will help enable our customers' next-generation products."

In wafer-level camera production, glass substrates are typically used as carrier and spacer wafers for the lenses, which are composed of an optical polymer material. The different material characteristics of these components limit resolution and picture quality, which hinder the scalability and quality of the camera modules. EVG's Monolithic Lens Molding (MLM) process—an option available on its IQ Aligner system—overcomes this limitation by eliminating the need for glass substrates. Instead, the polymer is molded between two stamps and then cured with UV exposure by EVG's IQ Aligner system. By omitting the glass substrates, wafer-level optics manufacturers face fewer constraints on the optic and lens stack design—enabling the production of thinner lens wafers and significantly shorter optical stacks. In addition, since the IQ Aligner molds the micro-lenses using a room-temperature UV-NIL process versus thermal imprinting, a high degree of precision alignment is achieved between the various elements in the optical lens stack—maximizing device performance.

"As the market for mobile devices continues to evolve rapidly, new solutions are needed to support the production of increasingly sophisticated wafer-level optics that are being integrated into these consumer products," stated Paul Lindner, executive technology director, EVG. "Asahi Kasei is a recognized leader in advancing materials and chemistry technology, and we are pleased that they have selected our IQ Aligner system to develop the next generation of materials that will be integrated into the advanced optical lens stacks and help fuel the growth of the wafer-level camera market."

####

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.

About Asahi Kasei E-materials

Asahi Kasei E-materials is the core operating company of the Asahi Kasei Group, established in April 2009 to consolidate businesses for electronics materials, energy materials, photosensitive materials, and epoxy resins to create better value for customers through synergy of product and service.

Asahi Kasei E-materials holds dominant market share for materials such as photo sensitive polyimide "Pimel™", ultra thin glass fablic, epoxy latent curing agent "Novacure™", photosensitive dry film resist "Sunfort™", photo mask anti dust film "Pellicles™" and separator membrane for lithium-ion rechargeable batteries "Hipore™".

Asahi Kasei E-materials' R&D system enables speedy development of unique and advanced electronics materials through close attention to customer voice and collaboration with key market players.

For more information, please click here

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Creation of 'Rocker' protein opens way for new smart molecules in medicine, other fields December 18th, 2014

How does enzymatic pretreatment affect the nanostructure and reaction space of lignocellulosic biomass? December 18th, 2014

Silicon Valley-Based Foresight Valuation Launches STR-IP™, a New Initiative for Startups to Discover the Value of Their Intellectual Property December 18th, 2014

Iranian Scientists Use Nanotechnology to Increase Power, Energy of Supercapacitors December 18th, 2014

MEMS

MEMS Industry Group's 10th Annual Executive Conference Showcases Rapid Innovation in MEMS/Sensors: Emphasizes Spirit of Collaboration, Supporting First Open-Source Algorithm Community, New Standardization Efforts November 10th, 2014

MEMS & Sensors Technology Showcase: Finalists Announced for MEMS Executive Congress US 2014 October 23rd, 2014

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

Carbyne morphs when stretched: Rice University calculations show carbon-atom chain would go metal to semiconductor July 21st, 2014

Chip Technology

Switching to spintronics: Berkeley Lab reports on electric field switching of ferromagnetism at room temp December 17th, 2014

Pb islands in a sea of graphene magnetise the material of the future December 16th, 2014

Stanford team combines logic, memory to build a 'high-rise' chip: Today circuit cards are laid out like single-story towns; Futuristic architecture builds layers of logic and memory into skyscraper chips that would be smaller, faster, cheaper -- and taller December 15th, 2014

Stacking two-dimensional materials may lower cost of semiconductor devices December 11th, 2014

Announcements

Creation of 'Rocker' protein opens way for new smart molecules in medicine, other fields December 18th, 2014

How does enzymatic pretreatment affect the nanostructure and reaction space of lignocellulosic biomass? December 18th, 2014

Silicon Valley-Based Foresight Valuation Launches STR-IP™, a New Initiative for Startups to Discover the Value of Their Intellectual Property December 18th, 2014

Iranian Scientists Use Nanotechnology to Increase Power, Energy of Supercapacitors December 18th, 2014

Tools

Switching to spintronics: Berkeley Lab reports on electric field switching of ferromagnetism at room temp December 17th, 2014

ORNL microscopy pencils patterns in polymers at the nanoscale December 17th, 2014

Unraveling the light of fireflies December 17th, 2014

DELMIC reports on applications of their SPARC technology at the Chalmers University of Technology in Gothenburg, Sweden December 16th, 2014

Events/Classes

Bruker Introduces BioScope Resolve High-Resolution BioAFM System: Featuring PeakForce Tapping for Quantitative Bio-Mechanical Property Mapping December 16th, 2014

TCL Launches World’s Most Advanced TV in the World’s Largest Market: New Quantum Dot TVs with Color IQ™ Optics Deliver OLED-Quality Color at a Fraction of the Price December 15th, 2014

Stanford team combines logic, memory to build a 'high-rise' chip: Today circuit cards are laid out like single-story towns; Futuristic architecture builds layers of logic and memory into skyscraper chips that would be smaller, faster, cheaper -- and taller December 15th, 2014

PETA science consortium to present at Society for Risk Analysis meeting December 10th, 2014

New-Contracts/Sales/Customers

DELMIC reports on applications of their SPARC technology at the Chalmers University of Technology in Gothenburg, Sweden December 16th, 2014

Industrial Nanotech, Inc. Expands Government and Defense Projects December 10th, 2014

Iran Exports Nanodrugs to Syria November 24th, 2014

Tesla NanoCoatings Increasing Use of SouthWest NanoTechnologies Carbon Nanotubes (CNTs) for its Infrastructure Coatings and Paints: High Quality SMW™ Specialty Multi-wall Carbon Nanotubes Incorporated into Teslan®-brand coatings used by Transportation, Oil and Gas Companies November 19th, 2014

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE