Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Presto Engineering Offering Semiconductor Test

Abstract:
Company Brings Labless Business Model to Europe Via Acquisition of Equipment and Infrastructure from NXP

Presto Engineering Offering Semiconductor Test

San Jose, CA | Posted on February 16th, 2010

Presto Engineering Inc., a pioneer of the labless business model for bringing semiconductor products into volume production, announced today the opening of its new services hub in Caen, France. The new hub, which includes equipment and infrastructure acquired from NXP Semiconductors' facility in Caen, offers comprehensive failure analysis and reliability testing for semiconductor companies in Europe and Israel.

The hub will be operated by Presto Engineering Europe. The recently formed subsidiary has named Patrick Poirier director of operations at the new facility and Neji Sanaa director of sales.

Presto's state-of-the-art capabilities include enhanced RF and 3D-integration expertise and advanced test, reliability, fault-isolation and failure-analysis services. By outsourcing these steps, chip companies are able to cut costs and free resources for their core business.

Bringing an advanced chip design into silicon requires a variety of advanced test and analytical techniques. Presto's Design Success Analysis™ offering eases this process by providing first-silicon validation, as well as characterization of new processes, new designs, and process transfers. Capabilities include comprehensive custom ATE hardware interfaces (such as load modules, probe cards, DUT cards and thermal interfaces) and product-engineering services.

More broadly, Presto can proactively and reactively address a variety of design-to-manufacturing challenges. Presto's product debug services include ATE-coupled in-silicon analytical capabilities, with extensive backside silicon analysis; additional release-acceleration offerings include reliability services. The company's hubs can also maximize the utility of expensive test chips and engineering, validating simulation results and characterizing timing, power, leakage, and other parameters.

"This new facility is the springboard for Presto's expansion into Europe and our introduction of the labless model to that key market, which includes some of the world's top fabless design houses, fab lines, and other members of the semiconductor community," said Michel Villemain, CEO of Presto Engineering.

"For the first time, European chip companies have access to a state-of-the-art lab with a staff of highly skilled engineers and technology specialists offering advanced outsourced test and analysis capabilities," said operations director Poirier. "We are open for business and we invite Europe's diverse chip companies to meet with us and see how we can help assure the success of their next product."

Poirier has more than 20 years of experience in the electronics and microelectronics industries, including management positions with Philips/NXP. From 2005 to 2010, he oversaw the NXP Semiconductors reliability and failure analysis lab. At NXP, he and Jean-Noël Palazin led the lab externalization project that resulted in the acquisition by Presto. Palazin, with 33 years experience at various management positions with Philips and NXP, will continue to serve Presto Engineering Europe as a consultant in charge of External relations and Partnerships.

Sanaa, director of sales for Presto Engineering Europe, has more than 21 years of management experience in ATE. In more than a dozen years at Schlumberger, he worked with all the company's ATE products. In 2000, Sanaa was named head of Schlumberger's services and DCG application business unit. In 2005, he headed the combined service business units of NPTest and Credence, which had annual revenue of $20 million from business in Europe, North America and Asia.

Meet with Presto Engineering Europe at DATE2010 Conference in Germany

Presto Engineering Europe will exhibit at the Design, Automation & Test in Europe (DATE) conference in Dresden, Germany, March 8-12. Attendees are invited to visit Stand No. 8 to meet with Presto personnel for an in-depth technical discussion of the services available at its European hub.

####

About Presto Engineering
Presto Engineering introduced the labless business model to the semiconductor industry in 2007 when it acquired Cypress Semiconductor’s product-engineering lab. The company helps IDMs and fabless customers improve new device predictability and speed to market by complementing their internal resources with comprehensive chip test and analysis. Supported by unique technical skills and extensive industry experience, Presto’s product-engineering services include RF and 3D integration and state-of-the-art ATE, reliability testing, failure analysis and fault isolation. The company recently expanded into Europe by acquiring lab infrastructure of NXP Semiconductor in Caen, France, and establishing a subsidiary Presto Engineering Europe. Presto Engineering, an ISO 9001 company, is based in San Jose, Calif.

For more information, please click here

Contacts:
Sarah-Lyle Dampoux
Loomis Group
+ 33 (0) 1 58 18 59 30

Richard Curtin
Presto Engineering, Inc.
+1 408 434 1808

Copyright © Presto Engineering

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Tough foam from tiny sheets: Rice University lab uses atom-thick materials to make ultralight foam July 29th, 2014

Zenosense, Inc. July 29th, 2014

Optimum inertial design for self-propulsion: A new study investigates the effects of small but finite inertia on the propulsion of micro and nano-scale swimming machines July 29th, 2014

A new way to make microstructured surfaces: Method can produce strong, lightweight materials with specific surface properties July 29th, 2014

Openings/New facilities/Groundbreaking/Expansion

Oxford Instruments Asylum Research Opens an Atomic Force Microscopy Demonstration Lab in Mumbai, India July 21st, 2014

Sono-Tek Corporation Announces New Clean Room Rated Laboratory Facility in China July 18th, 2014

Beneq is on the move! June 12th, 2014

NTU launches $30 million 3D printing research centre: New centre to establish $5 million joint-lab for 3D printing with industry leader SLM Solutions May 28th, 2014

Jobs

Secretary Vilsack Announces Partnership to Advance Commercial Potential of Cellulosic Nanomaterial from Wood December 11th, 2013

Cutting Away at the NRC's Research Capability December 6th, 2013

Project aims to mass-produce 'nanopetals' for sensors, batteries October 22nd, 2013

Governor Cuomo Announces 'Nano Utica' $1.5 Billion Public-Private Investment That Will Make the Mohawk Valley New York's Next Major Hub of Nanotech Research October 12th, 2013

Chip Technology

A*STAR and industry form S$200M semiconductor R&D July 25th, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

Nanometrics Announces Upcoming Investor Events July 22nd, 2014

Penn Study: Understanding Graphene’s Electrical Properties on an Atomic Level July 22nd, 2014

Nanoelectronics

A*STAR and industry form S$200M semiconductor R&D July 25th, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

3-D nanostructure could benefit nanoelectronics, gas storage: Rice U. researchers predict functional advantages of 3-D boron nitride July 15th, 2014

IBM Announces $3 Billion Research Initiative to Tackle Chip Grand Challenges for Cloud and Big Data Systems: Scientists and engineers to push limits of silicon technology to 7 nanometers and below and create post-silicon future July 10th, 2014

Announcements

Tough foam from tiny sheets: Rice University lab uses atom-thick materials to make ultralight foam July 29th, 2014

Zenosense, Inc. July 29th, 2014

Optimum inertial design for self-propulsion: A new study investigates the effects of small but finite inertia on the propulsion of micro and nano-scale swimming machines July 29th, 2014

A new way to make microstructured surfaces: Method can produce strong, lightweight materials with specific surface properties July 29th, 2014

Appointments/Promotions/New hires/Resignations/Deaths

ACS Biomaterials Science & Engineering™: Brand-new journal names editor July 29th, 2014

Organometallics welcomes new editor-in-chief: Paul Chirik, Ph.D. July 22nd, 2014

NSS Pays Tribute to Space Pioneer Frederick I. Ordway III July 7th, 2014

Harris & Harris Group Announces Changes to Its Legal Department June 9th, 2014

Events/Classes

WITec to host the 11th Confocal Raman Imaging Symposium from September 29th - October 1st in Ulm, Germany July 28th, 2014

FEI adds Phase Plate Technology and Titan Halo TEM to its Structural Biology Product Portfolio: New solutions provide the high-quality imaging and contrast necessary to analyze the 3D structure of molecules and molecular complexes July 28th, 2014

NNCO Announces an Interactive Webinar: Progress Review on the Coordinated Implementation of the National Nanotechnology Initiative 2011 Environmental, Health, and Safety Research Strategy July 23rd, 2014

Harris & Harris Group to Host Conference Call on Second-Quarter 2014 Financial Results on August 15, 2014 July 23rd, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE