Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SemiLEDs Orders Multiple Ultratech Lithography Systems for Advanced LED Manufacturing

Abstract:
Ultratech, Inc.(NASDAQ:UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices, today announced it received a multiple-system order from U.S.-based SemiLEDs Corp. A leading supplier of high-brightness, laser-emitting diodes (HBLEDs), SemiLEDs will use Ultratech's Star 100 lithography tools for its white light, HBLED, high-power, UVC LED and other advanced lighting applications at its manufacturing facility in Hsinchu, Taiwan. Ultratech's advanced lithography expertise is enabling SemiLEDs to grow its position in this burgeoning market as the industry shifts from conventional lithography to projection stepper lithography technology for advanced LED production.

SemiLEDs Orders Multiple Ultratech Lithography Systems for Advanced LED Manufacturing

San Jose, CA | Posted on October 14th, 2008

SemiLEDs Corporation Chairman and CEO Trung Tri Doan explained, "With improved alignment and resolution of the Star 100 Ultratech stepper system, we will start volume production of our advanced UVA high-power LED product family (365nm/395nm/405nm), with output optical power as high as 350mW per mm2. This new family of UVC high-power LED products will enable new LED applications that could only be dreamed of -- polymer curing such as inkjet printers, sanitation, semiconductor processes, medical applications such as dental, cancer treatment, tanning, etc. The MvPLED blue product family has seen a 15 percent improvement in performance; the new class of SemiLEDs Solid State Lighting devices (SL-SSL) 120lumens/watt will help accelerate the adoption of solid-state lighting. We selected Ultratech's lithography steppers based on the tools' high reliability and low cost of ownership. In addition to being a leader in advanced lithography solutions, Ultratech combines technology expertise and outstanding customer service to support our LED manufacturing requirements. As a valued partner, Ultratech will continue to play an integral role as advanced LED device volumes grow, and we continue to expand our worldwide leadership position."

"While this multi-system order demonstrates our ability to provide lithography systems that enable greater economic value to emerging markets, it also reinforces Ultratech's focus on energy conservation," noted Ultratech Chairman and CEO Arthur W. Zafiropoulo. "Today, lighting utilizes approximately 20 percent of global energy. As a result, the industry is transitioning to HBLEDs, which have a long life and use only a fraction of energy compared to incandescent and fluorescent lighting. With energy conservation driving up demand, HBLED leaders such as SemiLEDs are increasingly turning to stepper-based projection lithography due to its cost and yield advantages. We look forward to furthering our relationship with SemiLEDs and delivering lithography solutions that advance our customers' competitive advantage in this growing market."

The Star 100

The Star 100 lithography system is used by the leading HBLED and laser diode manufacturers and is designed to be easily integrated into a broad range of fabs with varying equipment types and wafer sizes. The tool's resolution, depth of focus, proprietary alignment system, and substrate handling capability combine to provide high productivity, reliability, flexibility, and cost-of-ownership advantages critical for advanced and emerging markets as they move toward high-volume production.

Certain of the statements contained herein, which are not historical facts and which can generally be identified by words such as "anticipates," "expects," "intends," "will," "could," "believes," "estimates," "continue," and similar expressions, are forward-looking statements under Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties, such as risks related to our dependence on new product introductions and market acceptance of new products and enhanced versions of our existing products; lengthy sales cycles, including the timing of system installations and acceptances; lengthy and costly development cycles for laser-processing and lithography technologies and applications; integration, development and associated expenses of the laser processing operation; delays, deferrals and cancellations of orders by customers; cyclicality in the semiconductor and nanotechnology industries; general economic and financial market conditions including impact on capital spending; pricing pressures and product discounts; high degree of industry competition; intellectual property matters; changes to financial accounting standards; changes in pricing by us, our competitors or suppliers; customer concentration; international sales; timing of new product announcements and releases by us or our competitors; ability to volume produce systems and meet customer requirements; sole or limited sources of supply; ability and resulting costs to attract or retain sufficient personnel to achieve our targets for a particular period; dilutive effect of employee stock option grants on net income per share, which is largely dependent upon us achieving and maintaining profitability and the market price of our stock; mix of products sold; rapid technological change and the importance of timely product introductions; outcome of litigation; manufacturing variances and production levels; timing and degree of success of technologies licensed to outside parties; product concentration and lack of product revenue diversification; inventory obsolescence; asset impairment; effects of certain anti-takeover provisions; future acquisitions; volatility of stock price; foreign government regulations and restrictions; business interruptions due to natural disasters or utility failures; environmental regulations; and any adverse effects of terrorist attacks in the United States or elsewhere, or government responses thereto, or military actions in Iraq, Afghanistan and elsewhere, on the economy, in general, or on our business in particular. Such risks and uncertainties are described in Ultratech's SEC reports including its Annual Report on Form 10-K filed for the year ended December 31, 2007 and Quarterly Report on Form 10Q for the quarter ended June 28, 2008. Due to these and additional factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. These forward-looking statements are based on management's current beliefs and expectations, some or all of which may prove to be inaccurate, and which may change. We undertake no obligation to revise or update any forward-looking statements to affect any event or circumstance that may arise after the date of this release.

About SemiLEDs: SemiLEDs Corporation is the only mass producer of metal-base LED chips in the world. It designs, develops, manufactures and sells high brightness light emitting diodes (HBLED) using proprietary technologies to enable high-performance, (120lumens/watt) and cost-effective, solid-state lighting solutions; it also manufactures UVA HBLED products (365nm, 395nm, 405nm) at optical power output up to 350mW per mm2. SemiLEDs is a U.S. corporation, with offices in Boise, Idaho and manufacturing operations in Hsinchu Science Park, Taiwan. For additional information, please visit www.semileds.com/ .

####

About Ultratech, Inc.
Ultratech, Inc. (NasdaqGM: UTEK) designs, manufactures and markets photolithography and laser processing equipment. Founded in 1979, Ultratech is a market leader in gold and solder bump lithography, in addition to being a pioneer of laser processing. Its advanced-packaging lithography systems deliver strong cost-of-ownership, repeatability and throughput advantages, and are widely used worldwide in the fabrication of semiconductors and FPDs. Ultratech's advanced laser processing technology is designed to enhance yields, while enabling a cost-effective transfer to 65-nm and below production, and is being integrated into the manufacturing lines of leading-edge semiconductor manufacturers.

For more information, please click here

Contacts:
Bruce R. Wright
Senior Vice President & CFO
or
Laura Rebouche
Vice President
Investor Relations
Marketing and Corporate Communications

both of Ultratech, Inc.
+1-408-321-8835
fax +1- 408-577-3379
or
Agency Contact
Angie Kellen
Senior Account Director
MCA
+1-650-968-8900
fax +1-650-968-8990

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Leti IEDM 2016 Paper Clarifies Correlation between Endurance, Window Margin and Retention in RRAM for First Time: Paper Presented at IEDM 2016 Offers Ways to Reconcile High-cycling Requirements and Instability at High Temperatures in Resistive RAM December 6th, 2016

Tokyo Institute of Technology research: 3D solutions to energy savings in silicon power transistors December 6th, 2016

Physicists decipher electronic properties of materials in work that may change transistors December 6th, 2016

Infrared instrumentation leader secures exclusive use of Vantablack coating December 5th, 2016

Display technology/LEDs/SS Lighting/OLEDs

Trace metal recombination centers kill LED efficiency: UCSB researchers warn that trace amounts of transition metal impurities act as recombination centers in gallium nitride semiconductors November 3rd, 2016

Diamond nanothread: Versatile new material could prove priceless for manufacturing: Would you dress in diamond nanothreads? It's not as far-fetched as you might think November 3rd, 2016

Researchers surprised at the unexpected hardness of gallium nitride: A Lehigh University team discovers that the widely used semiconducting material is almost as wear-resistant as diamonds October 31st, 2016

Inspiration from the ocean: An interdisciplinary team of researchers at UC Santa Barbara has developed a non-toxic, high-quality surface treatment for organic field-effect transistors October 18th, 2016

Announcements

Leti IEDM 2016 Paper Clarifies Correlation between Endurance, Window Margin and Retention in RRAM for First Time: Paper Presented at IEDM 2016 Offers Ways to Reconcile High-cycling Requirements and Instability at High Temperatures in Resistive RAM December 6th, 2016

Tokyo Institute of Technology research: 3D solutions to energy savings in silicon power transistors December 6th, 2016

Physicists decipher electronic properties of materials in work that may change transistors December 6th, 2016

Infrared instrumentation leader secures exclusive use of Vantablack coating December 5th, 2016

Tools

Deep insights from surface reactions: Researchers use Stampede supercomputer to study new chemical sensing methods, desalination and bacterial energy production December 2nd, 2016

Controlled electron pulses November 30th, 2016

Scientists shrink electron gun to matchbox size: Terahertz technology has the potential to enable new applications November 25th, 2016

News from Quorum: The Agricultural Research Service of the USDA uses a Quorum Cryo-SEM preparation system for the study of mites, ticks and other soft bodied organisms November 22nd, 2016

New-Contracts/Sales/Customers

Cetim Facility Receives Bruker Contour CMM Dimensional Analysis System: New Optical Coordinate Measurement Technology Enables High-Precision 3D Scanning November 16th, 2016

Industrial Nanotech, Inc. Announces Plans to Spin Off New Product Line to Major Paint Compan November 9th, 2016

Leti Provides New Low-noise Image Technology to French SME PYXALIS; Will Be Demonstrated at Vision 2016 in Stuttgart November 3rd, 2016

DryWired's Liquid Nanotint to be the first nano-insulation in a Federal building: 250,000 federal buildings, most with uninsulated glass October 12th, 2016

Printing/Lithography/Inkjet/Inks/Bio-printing

Bumpy surfaces, graphene beat the heat in devices: Rice University theory shows way to enhance heat sinks in future microelectronics November 29th, 2016

Engineers develop new magnetic ink to print self-healing devices that heal in record time November 7th, 2016

Iran to hold intl. school on application of nanomaterials in medicine September 20th, 2016

Tailored probes for atomic force microscopes: 3-D laser lithography enhances microscope for studying nanostructures in biology and engineering/ publication in Applied Physics Letters August 11th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project