- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
June 7th, 2007
A different approach to the potential replacement of copper interconnects using carbon nanotubes has been revealed by researchers at Rensselaer Polytechnic Institute. Denser ‘forests' of nanotube clusters have been demonstrated that show better promise of being able to handle high current density, and improved resistance to electromigration than copper.
James Jiam-Qiang Lu, associate professor of physics and electrical engineering at Rensselaer, together with his research associate Zhengchun Liu, decided to investigate how to "densify" carbon nanotube bundles after they are already grown. He detailed the results of the post-growth densification project on June 6 at the Institute of Electrical and Electronics Engineers' International Interconnect Technology Conference (IITC) in Burlingame, California.
|Related News Press|
New reaction for the synthesis of nanostructures July 21st, 2016
Research team led by NUS scientists develop plastic flexible magnetic memory device: Novel technique to implant high-performance magnetic memory chip on a flexible plastic surface without compromising performance July 21st, 2016
Easier, faster, cheaper: A full-filling approach to making nanotubes of consistent quality: Approach opens a straightforward route for engineering the properties of single-wall carbon nanotubes July 19th, 2016
Scientists glimpse inner workings of atomically thin transistors July 21st, 2016
'Green' electronic materials produced with synthetic biology July 16th, 2016
Graphene photodetectors: Thinking outside the 2-D box July 21st, 2016