Home > News > Canadian Nano Fab Selects SUSS Wafer Bonder
December 1st, 2006
Canadian Nano Fab Selects SUSS Wafer Bonder
Abstract:
SUSS MicroTec. (FWB:SMH) (GER:SMH), a leading supplier of precision manufacturing and test equipment for the semiconductor and emerging markets announced today that the University of Alberta's NanoFab has selected its new ELAN CB6L wafer bonding equipment for its research and production activities.
Source:
businesswire.com
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