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February 17th, 2004
Nanometrics Announces Integration of NanoOCD
Abstract:
Nanometrics, Inc. today announced that it has entered into an integrated metrology agreement with Lam Research Corporation. Under the agreement, Lam has integrated a Nanometrics' NanoOCD/DUV 9010b film thickness mapping module into a CMP tool for post copper CMP erosion, oxide thickness and residue measurements. The NanoOCD/DUV 9010b has been qualified by Lam for monitoring of dielectric film thickness, erosion and copper residue.
Source:
Businesswire
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