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Home > Press > Leti Scientists Participating in Sessions on Med Tech, Automotive Technologies, MEMS, Si-photonics and Lithography at SEMICON Europa: Teams also Will Demonstrate Technology Advances in Telecom, Data Fusion, Energy, Silicon Photonics and 3D Integration

Abstract:
Scientists at Leti, an institute of CEA Tech, will give four presentations at SEMICON Europa, Oct. 25-27, in Grenoble, and Leti’s Patterning Program Manager Laurent Pain will chair a session on lithography. Leti also will present multiple product demos in a wide range of fields that showcase how its advanced technology has gone from research to final product.

Leti Scientists Participating in Sessions on Med Tech, Automotive Technologies, MEMS, Si-photonics and Lithography at SEMICON Europa: Teams also Will Demonstrate Technology Advances in Telecom, Data Fusion, Energy, Silicon Photonics and 3D Integration

Grenoble, France | Posted on October 18th, 2016

Presentations include:

Tuesday, Oct. 25
10:20 a.m. TechARENA 1: Med-tech Session – “MEMS sensors for cell, and exosomes characterization, a new paradigm for cancer diagnosis”, by Vincent Agache, Leti

11:35 a.m. TechARENA 1: Automotive Session – “CEA Tech innovations in the fields of sensors, computing and communication solutions for highly dependable and secured systems”, by Thierry Collette, Leti

Wednesday, Oct. 26
12:45 p.m. TechARENA 2: MEMS Session – “Strategy to address key MEMS challenges”, by Jean-Philippe Polizzi, Leti

Thursday, Oct. 27
11:10 a.m. TechARENA 1: Silicon Photonics Session – “MIRPHAB: a pilot line offering fabrication of mid-IR sensors”, by Sergio Nicoletti, Leti

10:15 a.m. -1:20 p.m. TechARENA 2: Lithography Session chaired by Laurent Pain, Leti

Leti experts will be at booth 1523 to present product demonstrations in the fields of telecommunications, data fusion, energy, imaging, Leti 3S, silicon photonics & 3D integration, and silicon technologies, some of which feature “Leti-Inside” technology.

Key demos include:

· Σfusion – demo featuring real-time, low-power date fusion for autonomous vehicles
· 3DNOC integrated circuit – a heterogeneous multi-core IC using an in-house 3D network-on-chip design with robust and easy-to-integrate asynchronous 3D links between dies
· Multigas analysis system – a NEMS-based multi-gas analyzer with “Leti Inside” technology industrialized by APIX Analytics with more than 1,000 NEMS-array detectors

####

About Leti
As one of three advanced-research institutes within the CEA Technological Research Division, Leti serves as a bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. It is committed to creating innovation and transferring it to industry. Backed by its portfolio of 2,800 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched 59 startups. Its 8,500m˛ of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. With a staff of more than 1,900, Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Follow us on www.leti.fr and @CEA_Leti.

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