Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > LatticeGear Sells First LatticeAx 300 Cleaving System to X-FAB: LatticeAx 300 provides fast, accurate cross-sectioning of samples for analysis — more accurately than manual methods and faster and less expensively than automated systems

Abstract:
LatticeGear, a manufacturer of cost-effective cleaving solutions for semiconductor, solar and general materials analysis, announced today that it has shipped the first of its new LatticeAx™ 300 cleaving systems to X-FAB Silicon Foundries, a leading analog/mixed signal specialty foundry based in Erfurt, Germany.

LatticeGear Sells First LatticeAx 300 Cleaving System to X-FAB: LatticeAx 300 provides fast, accurate cross-sectioning of samples for analysis — more accurately than manual methods and faster and less expensively than automated systems

Beaverton, OR | Posted on June 9th, 2014

According to Ekkehart Brandstädt, X-FAB's failure analysis team leader, "The LatticeAx is filling our need for cleaving accuracy and repeatability that goes beyond what can be achieved manually. It is less expensive, yet provides higher throughput, than automated microcleaving. With LatticeAx, which we often use for MEMS wafers with complicated structures, our lab is processing more cross-sections while using the lower throughput, automated microcleaver for jobs that require sub-micron accuracy. The introduction of the LatticeAx into our workflow has improved the total productivity and reduced the cost-per-cleave in our failure analysis lab."

Manufacturers of semiconductors, solar cells, MEMS and other microelectronic devices use LatticeGear products to cross-section samples with high accuracy and quality for imaging in a scanning electron microscope (SEM). LatticeGear's flagship product line, the LatticeAx, uses a shallow indent and slow cleave method. Manual approaches, which use a scribe mark to initiate the cleave, are fast and inexpensive, but offer limited accuracy and reliability. Automated systems with image processing and robotics can cleave to sub-micron accuracy, but are expensive, slow and pose many sample restrictions. The LatticeAx 300 reliably delivers ten-micrometer placement accuracy in just five minutes at a fraction of the cost of automated systems.

LatticeGear's Efrat Moyal, Co-founder, states, "The key to the accuracy and quality of LatticeAx 300 is the integration of the controlled indentation and cleaving process with an advanced vision package and precise movement in X/Y. A manual scribe mark is essentially a scratch, and on the microscopic level, it is composed of many micro fractures that can initiate cleaves in slightly different locations and directions. The LatticeAx micro indenter uses a precisely-controlled shape and pressure to initiate an accurate, predictable, high-quality cleave.

Efrat adds, "We complete the cleave by applying carefully-controlled pressure to the wafer. You can actually hear the cleave progress as it splits the wafer - very different from the sharp crack you hear with a manual cleave. We have even made very high-quality cleaves in non-crystalline substrates, such as glass, which we can only attribute to the repeatability and control of the indenting and cleaving process."

####

About LatticeGear, LLC
LatticeGear provides cleaving solutions that offer high productivity and throughput, and enable customers to obtain superior analytical results. Its cleaving tools and accessories that offer a low cost-of-ownership (COO) with a high return on investment for the semiconductor, solar and general materials markets. Customers are able to seamlessly turn whole wafers into prepared samples that are suitable for analysis using scanning electron microscopy (SEM), atomic force microscopy (AFM), surface analysis and optical-based equipment, or for further sample preparation in a focused ion beam (FIB), broad beam polishing / milling, or using mechanical tools. LatticeGear’s flagship product, the patent-pending LatticeAx™, features a new ‘Indent and Cleave’ methodology that bridges the gap between manual scribing and fully-automated cleaving. It addresses the market need for uniform, repeatable, accurate and high-quality cleaving results at lower capital and COO costs. For more information visit: www.latticegear.com.

About X-FAB

X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt, Dresden and Itzehoe (Germany); Lubbock, Texas (US); and Kuching, Sarawak (Malaysia). It employs approximately 2,400 people worldwide. It manufactures wafers based on advanced modular CMOS and BiCMOS processes with technologies ranging from 1.0 to 0.13 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors. For more information, please visit www.xfab.com.

For more information, please click here

Contacts:
Company Contact
Efrat Moyal
LatticeGear, LLC
408.455.0475


Agency Contact
Sandy Fewkes
MindWrite Communications
408.224.4024

Copyright © LatticeGear, LLC

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Arrowhead to Present at BioCentury's NewsMakers in the Biotech Industry Conference September 19th, 2014

SouthWest NanoTechnologies (SWeNT) Receives NIST Small Business Innovation Research (SBIR) Phase 1 Award to Produce Greater than 99% Semiconducting Single-Wall Carbon Nanotubes September 19th, 2014

Toward optical chips: A promising light source for optoelectronic chips can be tuned to different frequencies September 19th, 2014

New research points to graphene as a flexible, low-cost touchscreen solution September 19th, 2014

Chip Technology

SouthWest NanoTechnologies (SWeNT) Receives NIST Small Business Innovation Research (SBIR) Phase 1 Award to Produce Greater than 99% Semiconducting Single-Wall Carbon Nanotubes September 19th, 2014

Toward optical chips: A promising light source for optoelectronic chips can be tuned to different frequencies September 19th, 2014

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

‘Small’ transformation yields big changes September 16th, 2014

Announcements

Arrowhead to Present at BioCentury's NewsMakers in the Biotech Industry Conference September 19th, 2014

SouthWest NanoTechnologies (SWeNT) Receives NIST Small Business Innovation Research (SBIR) Phase 1 Award to Produce Greater than 99% Semiconducting Single-Wall Carbon Nanotubes September 19th, 2014

Toward optical chips: A promising light source for optoelectronic chips can be tuned to different frequencies September 19th, 2014

New research points to graphene as a flexible, low-cost touchscreen solution September 19th, 2014

Tools

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

FEI Opens New Technology Center in Czech Republic: FEI expands its presence in Brno with the opening of a new, larger facility September 18th, 2014

New NPZ100-403 Piezo Stage from nPoint Inc. September 17th, 2014

Researchers Create World’s Largest DNA Origami September 11th, 2014

Energy

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

Rice rolls 'neat' nanotube fibers: Rice University researchers' acid-free approach leads to strong conductive carbon threads September 15th, 2014

Simple, Cost-Effective Method Proposed for Synthesizing Zinc Oxide Nanopigments September 15th, 2014

UT Arlington research uses nanotechnology to help cool electrons with no external sources September 11th, 2014

New-Contracts/Sales/Customers

Fullerex: Talga Resources Joins INSCX™ Exchange September 4th, 2014

Global Energy Systems Signs Master Sales Agreement with China Aviation Supplies Group September 4th, 2014

East China University of Science and Technology Purchases Nanonex Advanced Nanoimprint Tool NX-B200 July 30th, 2014

University of Manchester selects Anasys AFM-IR for coatings and corrosion research July 30th, 2014

Solar/Photovoltaic

Simple, Cost-Effective Method Proposed for Synthesizing Zinc Oxide Nanopigments September 15th, 2014

Indium/Copper Sulfide Compound Semi-Conductor Synthesized through New Method September 8th, 2014

Material development on the nanoscale: Doped graphene nanoribbons with potential September 8th, 2014

Layered graphene sandwich for next generation electronics September 8th, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE