Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > AI Technology, Inc. (AIT) Releases COOL-PAD™ CPR (Conformal Pad) 7154: Second Generation (US Patent 6,496,373): COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance

Abstract:
AI Technology, Inc. (AIT) introduces COOL-PAD™ CPR7154, a new class of thermal interface material that dispenses like a thermal pad, but performs with characteristics like that of a grease or gel when device temperatures increase to above 45°C. COOL-PAD™ CPR7154 is optimized to accommodate large areas with different heights and gaps of less than 3-mil along its interfacing area. It is filled with a modified oxide mixture and is electrically insulating at normal voltage. It is designed to have high compressibility as applied in comparison to traditional thermal pads. Once the device temperature reaches 45°C, COOL-PAD™ CPR7154 will "melt-flow" to fill even the smallest of trapped air along the interface between the device and heat-sink or heat-spreader.

AI Technology, Inc. (AIT) Releases COOL-PAD™ CPR (Conformal Pad) 7154: Second Generation (US Patent 6,496,373): COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance

Princeton Jct., NJ | Posted on March 31st, 2014

COOL-PAD™ CPR7154 is semi-tacky on both sides for optimum thermal transfer performance. COOL-PAD™ CPR7154 has high thermal conductivity and low Tg characteristics that impose minimum thermal stress on bonded parts during thermal cycling or shock testing. While COOL-PAD™ has some intrinsic tack strength, it is not designed for bonding. A mechanical fastener must be used to provide assembly integrity.

A mechanical fastener of 5 psi or more is recommended to provide intimate contact between the COOL-PAD™ and the interfacing surface. Because COOL-PAD™ is compressible, it will fill in uneven height differentials and warps between the mating surfaces. The ultimate performance of COOL-PAD™ is achieved after the first cycle of melt-flow phase-change at 45°C or automatically when the device heats up during operation or with externally applied heat if the device is not anticipated to reach 45°C .

COOL-PAD™ CPR7154 is designed for thermal interface applications to withstand the worst of temperature and moisture exposure in outdoor LED luminaire applications with modules from Philips, Cree, Bridgelux, etc. Of course, the same phase-change pad works great for CPU and GPU in Xbox360, Play Station, and other game consoles. COOL-PAD™ CPR7154 is also ideal for CPU modules and graphic card interfaces in laptops and desktops such as Asus, Samsung, BenQ, Foxconn and other OEM.

####

About AI Technology, Inc. (AIT)
Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology has been one of the leading forces in development and patented applications of advanced materials and adhesive solutions for electronic interconnection and packaging. AI Technology now has one of the highest reliability adhesives and underfills for die bonding for the largest dies, stack-chip packaging with dicing die-attach film (DDAF), flip-chip bonding and underfilling and high temperature die bonding for single and multiple-chip modules for applications beyond 230°C. The company continues to provide the best adhesive solution for component and substrate bonding for both military and commercial applications.
AIT’s thermal interface material solutions, including our patented phase-change thermal pads, thermal greases and gels and thermal adhesives have set many bench marks of performance and reliability for power semiconductors, modules, computers and communication electronics.

For more product information visit:   www.aitechnology.com/products/thermalinterface/thermelec/
For an application analysis: www.aitechnology.com/analysis/

For more information, please click here

Contacts:
70 Washington Rd.
Princeton Jct. NJ 08550
P: (609) 799 – 9388
F: (609) 799 – 9308
Contact:

Media Contact: 
Amy Grossman
(609) 799-9388

Copyright © AI Technology, Inc. (AIT)

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

GLOBALFOUNDRIES Announces Availability of 45nm RF SOI to Advance 5G Mobile Communications: Optimized RF features deliver high-performance solutions for mmWave beam forming applications in 5G smartphones and base stations February 22nd, 2017

EmTech Asia breaks new barriers with potential applications of space exploration with NASA and MIT February 22nd, 2017

JPK selects compact tensile stage from Deben for their NanoWizard® AFM platform to broaden capabilities for materials characterisation February 22nd, 2017

Molecular phenomenon discovered by advanced NMR facility: Cutting edge technology has shown a molecule self-assembling into different forms when passing between solution state to solid state, and back again - a curious phenomenon in science - says research by the University of Wa February 22nd, 2017

Hardware

Strem Chemicals and Dotz Nano Ltd. Sign Distribution Agreement for Graphene Quantum Dots Collaboration February 21st, 2017

Particles from outer space are wreaking low-grade havoc on personal electronics February 19th, 2017

Metallic hydrogen, once theory, becomes reality: Harvard physicists succeed in creating 'the holy grail of high-pressure physics' January 28th, 2017

For this metal, electricity flows, but not the heat: Berkeley-led study finds law-breaking property in vanadium dioxide that could lead to applications in thermoelectrics, window coatings January 26th, 2017

Chip Technology

GLOBALFOUNDRIES Announces Availability of 45nm RF SOI to Advance 5G Mobile Communications: Optimized RF features deliver high-performance solutions for mmWave beam forming applications in 5G smartphones and base stations February 22nd, 2017

Strem Chemicals and Dotz Nano Ltd. Sign Distribution Agreement for Graphene Quantum Dots Collaboration February 21st, 2017

Particles from outer space are wreaking low-grade havoc on personal electronics February 19th, 2017

Liquid metal nano printing set to revolutionize electronics: Creating integrated circuits just atoms thick February 18th, 2017

Announcements

GLOBALFOUNDRIES Announces Availability of 45nm RF SOI to Advance 5G Mobile Communications: Optimized RF features deliver high-performance solutions for mmWave beam forming applications in 5G smartphones and base stations February 22nd, 2017

EmTech Asia breaks new barriers with potential applications of space exploration with NASA and MIT February 22nd, 2017

JPK selects compact tensile stage from Deben for their NanoWizard® AFM platform to broaden capabilities for materials characterisation February 22nd, 2017

Molecular phenomenon discovered by advanced NMR facility: Cutting edge technology has shown a molecule self-assembling into different forms when passing between solution state to solid state, and back again - a curious phenomenon in science - says research by the University of Wa February 22nd, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project