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Home > Press > Imec solves metallization issues in advanced interconnects for the sub-1X technology node

Image: Mn-based barrier deposition
Image: Mn-based barrier deposition

Abstract:
Imec has developed a Manganese (Mn)-based self-formed barrier (SFB) process that significantly improves Resistance Capacitance (RC) performance, via resistance and reliability in advanced interconnects. It provides excellent adhesion, film conformality, intrinsic barrier property and reduced line resistance. This technology paves the way towards interconnect Cu metallization into the 7nm node and beyond.

Imec solves metallization issues in advanced interconnects for the sub-1X technology node

San Francisco, CA | Posted on July 2nd, 2013

With continuous interconnect scaling, the wire resistance per unit length increases, which has a detrimental impact on the device performance (RC). Moreover, when reducing the dimensions with conventional barrier layers, an increased loss of copper (Cu) cross sectional area is observed, resulting in high resistance and decreased interconnect lifetime (electro-migration and time dependent dielectric breakdown - EM and TDDB). To overcome these interconnect metallization issues when scaling beyond the 1X technology node, imec's R&D program on advanced interconnect technology explores new barrier and seed materials as well as novel deposition and filling techniques. The Mn-based SFB was demonstrated to be an attractive candidate for future interconnect technology. At module level, Mn-based SFB resulted in a 40% increase in RC benefits at 40nm half pitch compared to conventional barrier and good lifetime performance (comparable to TaN/Ta reference).

These results were achieved in cooperation with imec's key partners in its core CMOS programs Globalfoundries, INTEL, Micron, Panasonic, Samsung, TSMC, Elpida, SK hynix, Fujitsu and Sony.

Imec exhibits at SEMICON West, July 9-11, 2013. To learn more about imec, please visit booth 1741, South hall.

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About IMEC
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China, India and Japan. Its staff of more than 2,000 people includes more than 650 industrial residents and guest researchers. In 2012, imec's revenue (P&L) totaled 320 million euro. Further information on imec can be found at www.imec.be.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shanghai) Co. Ltd.) and imec India (Imec India Private Limited).

For more information, please click here

Contacts:
Marrissa Meyer
Business Technology
[ f o r m u l a ]
Formula PR, Inc.
1215 Cushman Avenue
San Diego, CA 92110
Office 619-234-0345
Cell 619-929-6177

Copyright © IMEC

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