Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > CEA-Leti Launches Open 3D™ Initiative: New Global Offer Includes Design, Layout, Testing and Packaging on Leti Platforms

Abstract:
CEA-Leti today announced the launch of a major new platform that provides industrial and academic partners with a global offer of mature 3D innovative technologies for their advanced products and research projects.

CEA-Leti Launches Open 3D™ Initiative: New Global Offer Includes Design, Layout, Testing and Packaging on Leti Platforms

Grenoble, France | Posted on January 31st, 2012

To help its partners solve key technology challenges, Leti's Open 3D™ global offer includes 3D design, layout, technologies including interconnections, TSV and components assembly, reliability tests and final packaging for components or systems achievement.

The Open 3D™ platform includes Leti's proven "off-the-shelf" 3D technologies that provides decisive advantages in performance, form factor and cost for a wide range of markets like bio/medical, aeronautics and space, consumer applications, defense and security, or fundamental research.

The platform enables customers to achieve proof of concept with a small quantity of wafers or prototyping with a larger quantity. The offer is based on limited mature technologies in order to ensure moderate costs, short cycle times and performances corresponding to the initial technical requirements of Leti customers.

Open 3D™ also operates directly on active wafers with embedded components or on passive wafers for interposer technologies.

"Open 3D leverages Leti's proven 3D expertise and infrastructure for collaborations that address new applications and markets, as a key new part of Leti's mission to create innovation and transfer it to industry," said Laurent Malier, CEO of Leti. "Our partners will include laboratories, universities and international research institutes as well as fabless chip companies and niche market manufacturers and integrators."

Operated on the Minatec Campus in Grenoble with Leti teams and technological platforms, Open 3D™ is fully operational for 200mm wafers and will be operational in 2012 for 300mm wafers. Modules offered in the platform's technology catalogue include:

- Through silicon vias (TSV) with aspect ratios to 1:3
- Interconnects for chips to wafers based on micro-bumps technology
- Interconnects for chips to substrates based on bumps technology
- Redistribution layers (RDL)
- Under-bump metallurgy (UBM)
- Temporary bonding, thinning and debonding
The technology catalogue will be regularly enriched with new technological modules that correspond with new 3D mature technologies and customer requirements.

####

About CEA-Leti
CEA is a French research and technology organization, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC campus, CEA-Leti operates 8,000-m² state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,400 employees, CEA-Leti trains more than 190 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,700 patent families.
Visit www.leti.fr.

For more information, please click here

Contacts:
Technical contact:
CEA-Leti
David Henry
+33 4 38 78 96 88


Media Contact:
CEA-Leti
Thierry Bosc
+33 4 38 78 31 95


Weber Shandwick
Eric Chauvelot / Robert Ba
+33 1 47 59 56 57 / 38 75


Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

MIG Takes a Roll-Up-Your-Sleeves Approach with Revamped MEMS/Sensors Technical Event -- MIG welcomes technologists to MEMS Technical Congress, emphasizes working groups and breakout sessions on emerging MEMS & sensors, tech transfer and integration March 6th, 2015

Phenom-World announces the Phenom XL, world’s fastest desktop SEM to handle large samples March 6th, 2015

Air Bearing Stage / Systems Introduced by PI at Photonics West March 6th, 2015

Consistent Scalable Functionalised Graphene Capacity March 5th, 2015

Chip Technology

French Institutes IRT Nanoelec and CMP Team up to Offer World’s First Service for Post-process 3D Technologies on Multi-Project-Wafer March 5th, 2015

Experiment and theory unite at last in debate over microbial nanowires: New model and experiments settle debate over metallic-like conductivity of microbial nanowires in bacterium March 4th, 2015

Magnetic vortices in nanodisks reveal information: Researchers from Dresden and Jülich use microwaves to read out information from smallest storage devices March 4th, 2015

The taming of magnetic vortices: Unified theory for skyrmion-materials March 3rd, 2015

Nanoelectronics

New nanowire structure absorbs light efficiently: Dual-type nanowire arrays can be used in applications such as LEDs and solar cells February 25th, 2015

Ultra-thin nanowires can trap electron 'twisters' that disrupt superconductors February 24th, 2015

Improved fire detection with new ultra-sensitive, ultraviolet light sensor February 17th, 2015

Nanotechnology facility planned in Lund, Sweden: A production facility for start-ups in the field of nanotechnology may be built in the Science Village in Lund, a world-class research and innovation village that is also home to ESS, the European Spallation Source February 15th, 2015

Announcements

MIG Takes a Roll-Up-Your-Sleeves Approach with Revamped MEMS/Sensors Technical Event -- MIG welcomes technologists to MEMS Technical Congress, emphasizes working groups and breakout sessions on emerging MEMS & sensors, tech transfer and integration March 6th, 2015

Phenom-World announces the Phenom XL, world’s fastest desktop SEM to handle large samples March 6th, 2015

Air Bearing Stage / Systems Introduced by PI at Photonics West March 6th, 2015

Get ready for NanoDays! March 5th, 2015

Alliances/Partnerships/Distributorships

French Institutes IRT Nanoelec and CMP Team up to Offer World’s First Service for Post-process 3D Technologies on Multi-Project-Wafer March 5th, 2015

American Chemical Society Presidential Symposia: nanoscience, international chemistry March 5th, 2015

Keysight Technologies Shifts to Direct Sales of High-Performance Products in North America March 3rd, 2015

Cambrios and Heraeus Jointly Create New, High-Conductivity Transparent Conductors: Two Companies' Combined Products Dramatically Extend Flexible Substrate Capabilities for Next-Generation Mass-Market Technology Products March 3rd, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE