Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > EV Group Launches ZoneBOND™ Capable Equipment and Open Platform for Temporary Bonding Materials

Abstract:
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched a suite of groundbreaking temporary bonding and debonding (TB/DB) equipment modules that support ZoneBOND™ technology. In parallel, EVG has opened its TB/DB equipment platform to enable the use of a wide range of adhesives from various suppliers to give customers the most flexible choice of bonding materials. Today's announcement comes on the heels of last week's agreement between EV Group and Brewer Science, which allows both companies to commercialize ZoneBOND™ technology.

EV Group Launches ZoneBOND™ Capable Equipment and Open Platform for Temporary Bonding Materials

St. Florian, Austria | Posted on October 26th, 2011

EVG's new EZR® and EZD® modules can be easily integrated in EVG's high-volume manufacturing equipment platforms such as the EVG®850 Series automated temporary bonding and debonding systems. The new EVG EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) modules will begin shipping to industrial customers before the end of 2011. Fraunhofer IZM ASSID (All Silicon System Integration Dresden), a world leader in advanced semiconductor R&D, already received EZR® and EZD® modules earlier this year for ZoneBOND™ processes and materials qualification as part of a joint development agreement with EVG.

In an equally important move, EVG will, through an open materials platform approach, establish a stronger supply chain for its market leading TB/DB technologies. EVG plans to qualify a wide range of adhesives from various materials suppliers for the ZoneBOND™ process. In support of this effort, EVG has defined standard test procedures that allow for fast and reliable qualification of additional adhesives. EVG will disclose the initial, new materials suppliers supporting the ZoneBOND™ process shortly.

"Integrating ZoneBOND™ technology into our field-proven, high-volume temporary bonding/debonding platform is an important part of EVG's efforts to not only ensure our customers have access to the most advanced technology available, but also to continue driving the commercialization of 3D ICs," stated Markus Wimplinger, corporate technology development and IP director for EVG. "A key advantage of our EZR® and EZD® modules is their ability to support a variety of adhesive materials, which in turn, provides our customers with increased flexibility during thin wafer processing."

####

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.

About ZoneBOND™ Technology

ZoneBOND™ technology provides a breakthrough approach for temporary wafer bonding, thin wafer processing, and debonding applications—overcoming the last remaining limitations associated with thin wafer processing. Benefits of ZoneBOND™ technology include: the use of silicon, glass and other carriers; compatibility with existing, field-proven adhesive platforms; and the ability to debond at room temperature with virtually no vertical force being applied to the device wafer. To support grinding and backside processing at high temperatures and to allow for low-force carrier separation, ZoneBOND™ defines two distinctive zones on the carrier wafer surface with strong adhesion in the perimeter (edge zone) and minimal adhesion in the center zone. As a result, low separation force is only required for carrier separation once the polymeric edge adhesive has been removed by solvent dissolution or other means.

Thorsten Matthias, director of business development for EV Group, will provide further insight into the ZoneBOND™ approach during the upcoming webcast, "3D is a Reality in High-volume Manufacturing," to be held Thursday, October 27, at 10:00 a.m. Central European Time (CET). For more information and to register, visit: www.i-micronews.com/consult_webcast.asp?uid=63

For more information, please click here

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

NMTI announces breakthrough solutions for HAMR nanoantenna for next-generation ultra-high density magnetic storage November 21st, 2014

Leica Microsystems Presents Universal Hybrid Detector for Single Molecule Detection and Imaging at SfN and ASCB: Leica HyD SMD - the Optimal Detector for Precise and Reliable SMD data November 20th, 2014

Silver Nanoparticles Produced in Iran from Forest Plants Extract November 20th, 2014

Nano Sorbents Able to Remove Pollutions Caused by Oil Derivatives November 20th, 2014

MEMS

MEMS Industry Group's 10th Annual Executive Conference Showcases Rapid Innovation in MEMS/Sensors: Emphasizes Spirit of Collaboration, Supporting First Open-Source Algorithm Community, New Standardization Efforts November 10th, 2014

MEMS & Sensors Technology Showcase: Finalists Announced for MEMS Executive Congress US 2014 October 23rd, 2014

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

Carbyne morphs when stretched: Rice University calculations show carbon-atom chain would go metal to semiconductor July 21st, 2014

Chip Technology

Nanometrics Announces Upcoming Investor Events November 19th, 2014

A novel method for identifying the body’s ‘noisiest’ networks November 19th, 2014

Researchers create & control spin waves, lifting prospects for enhanced info processing November 17th, 2014

VDMA Electronics Production Equipment: Growth track for 2014 and 2015 confirmed: Business climate survey shows robust industry sector November 14th, 2014

Announcements

NMTI announces breakthrough solutions for HAMR nanoantenna for next-generation ultra-high density magnetic storage November 21st, 2014

Leica Microsystems Presents Universal Hybrid Detector for Single Molecule Detection and Imaging at SfN and ASCB: Leica HyD SMD - the Optimal Detector for Precise and Reliable SMD data November 20th, 2014

Silver Nanoparticles Produced in Iran from Forest Plants Extract November 20th, 2014

Nano Sorbents Able to Remove Pollutions Caused by Oil Derivatives November 20th, 2014

Tools

Leica Microsystems Presents Universal Hybrid Detector for Single Molecule Detection and Imaging at SfN and ASCB: Leica HyD SMD - the Optimal Detector for Precise and Reliable SMD data November 20th, 2014

Nanometrics Announces Upcoming Investor Events November 19th, 2014

Two sensors in one: Nanoparticles that enable both MRI and fluorescent imaging could monitor cancer, other diseases November 18th, 2014

Field-emission plug-and-play solution for microwave electron guns: To simplify the electron emission mechanism involved in microwave electron guns, a team of researchers has created and demonstrated a field-emission plug-and-play solution based on ultrananocrystalline diamond November 18th, 2014

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More












ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE