Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SVTC, Amerimade Technology and Shanghai Sinyang Semiconductor Materials Form Partnership to Expand Advanced Electroplating Process Capabilities: Innovative partnership provides SVTC customers access to advanced electroplating processes in the area of through-silicon via (TSV) —

Abstract:
SVTC Technologies, the premier innovation partner for accelerating nanotechnology development and commercialization, announced today that it is partnering with Amerimade Technology and Shanghai Sinyang Semiconductor Materials to advance process development and production readiness for electroplating applications. This unique combination of engineering expertise, production knowhow, chemistry products and electroplating equipment provides customers access to advanced electroplating development capabilities supporting through-silicon via (TSV) technology and continues an ongoing SVTC strategy to create an ecosystem of partners that enables comprehensive value-added solutions for customers.

SVTC, Amerimade Technology and Shanghai Sinyang Semiconductor Materials Form Partnership to Expand Advanced Electroplating Process Capabilities: Innovative partnership provides SVTC customers access to advanced electroplating processes in the area of through-silicon via (TSV) —

San Jose, CA | Posted on October 19th, 2011

Similar to signal vias used in printed circuit boards, TSVs allow for signals to pass through the silicon substrate — a major advantage over traditional packaging and chip-to-chip interconnect schemes. TSVs enable advanced packaging technologies such as 3D IC integration where multiple chips can be stacked on top of each other for improved packaging density and improved signal performance. TSV technology is also critical for next-generation microelectromechanical systems (MEMS).

Given the advanced nature of TSV technology, many manufacturers do not have the process expertise nor tool sets required to develop the electroplated film solutions required for leading-edge devices and packaging. This partnership delivers over 95,000 square feet of state-of-the-art cleanroom, staffed 24/7, with a highly versed engineering team provided by SVTC, powered by electroplating tool sets and knowhow from Amerimade and chemical solutions from Shanghai Sinyang. In addition to providing manufacturers access to these vital technologies, this partnership focuses on developing new electroplating processes.

"SVTC is committed to providing our customers with the most innovative nanotechnology development and commercialization services for next-generation devices," said Wilbur Catabay, Vice President Technology Solutions for SVTC Technologies. "Working with both Shanghai Sinyang and Amerimade Technology will help our customers accelerate process development and demonstrate production readiness for 3D IC and MEMS technology."

The genesis of the partnership arose from each partner's long-standing familiarity with the other's experience, capability, competence and success in their respective business areas. Customers can expect to receive a broad range of solutions from process demonstrations to a robust commercialization process that can take an idea, demonstrate its value as a proof of concept, and then drive the capability of its processes and integration to production readiness.

"Our technology partnership with SVTC represents an outstanding combination of Amerimade's many years of success with the engineering and manufacturing of electroplating equipment for the semiconductor, MEMS, data storage and life science markets, with SVTC's compelling concept-to-commercialization business model and Shanghai Sinyang's chemical expertise," said Mark Blaze, VP of Customer Operations from Amerimade Technology. "We believe the partnership will have immediate and positive impact on our customers' ability to rapidly and successfully develop and adopt electroplating solutions for their products."

SVTC Technologies provides a complete range of solutions through in-house capabilities and a network of service and production partners. Based on years of hands-on, collaborative experience, SVTC continues to assemble an ecosystem of valued partners that provides a full complement of specialized services and enables a broad array of technology development capabilities.

####

About SVTC Technologies
SVTC Technologies provides development and commercialization services for innovative semiconductor process-based technologies and products, cost effectively and in an IP-secure manner. Through facilities in San Jose, California and Austin, Texas, SVTC serves customers in rapidly growing markets such as MEMS, microfluidics, high voltage, and TSV that are used in a wide array of industries such as semiconductor fabrication, life science, aerospace and defense, consumer mobility and clean energy. SVTC offers a suite of leading-edge equipment and services, including full-scale 8-inch and 12-inch process capabilities, advanced CMOS and non-CMOS equipment, analytical services, development support tools and commercialization services. SVTC is ISO 9001, ISO 13485 and ITAR registered. SVTC's investors include Oak Hill Capital Partners, Tallwood Venture Capital and the company's management and employees. SVTC is an equal opportunity employer.

About Amerimade Technology:

Amerimade Technology Inc. designs, manufactures and provides long-term field support for an expansive array of wet chemical processing systems. Based in Livermore, CA, Amerimade applies 20 years of experience to deliver equipment solutions that meet the unique needs of every customer, whether manual systems for R&D, or fully automated systems for high volume production and processes, including plating (electrolytic and electro-less, single element and alloy, magnetic and non magnetic), wet etching, stripping, cleaning, pattern develop, electro-etch and electro-polish. Industries served include semiconductor, MEMS, data storage, life sciences and PV solar. Amerimade provides compatibility with the complete range of SEMI-standard wafers as well as virtually all other substrates and devices requiring wet chemical processing and custom fixtures. Field support is provided through Uptime Semiconductor Equipment Services, our wholly-owned services division. More information can be found at www.amerimade.com.

About Shanghai Sinyang Semiconductor Materials:

Shanghai Sinyang Semiconductor Materials Co., Ltd is a leading-edge technology company, concentrating on research and development, design, and manufacturing of advanced chemicals for the electronics industry. The company is mainly involved in electronics, semiconductor manufacturing, packaging test and assembly, solar cell manufacturing and avionics. Shanghai Sinyang is focused on chemical solutions supporting through-silicon vias, micro-bumping, MEMS, solar cells and other wafer-level plating. The company also develops ultra-pure materials and chemicals for wafer-level wet processes such as photoresist stripping and cleaning. More information can be found at www.sinyang.com.cn.

For more information, please click here

Contacts:
SVTC Technologies
Rich Brossart
Sr. Director of Marketing

408-240-7252

Amerimade Technologies, Inc.
Mark Blaze
VP – Customer Operations

925-243-2305

Shanghai Sinyang Semiconductor Materials
Wenyan Zhi
VP – Marketing & Sales

+86 138-0198-2015

Copyright © SVTC Technologies

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

The power of perovskite: OIST researchers improve perovskite-based technology in the entire energy cycle, from solar cells harnessing power to LED diodes to light the screens of future electronic devices and other lighting applications August 18th, 2017

Gold nanostars and immunotherapy vaccinate mice against cancer: New treatment cures, vaccinates mouse in small proof-of-concept study August 18th, 2017

Researchers printed graphene-like materials with inkjet August 17th, 2017

Candy cane supercapacitor could enable fast charging of mobile phones August 17th, 2017

MEMS

First Capacitive Transducer with 13nm Gap July 27th, 2017

Bosch announces high-performance MEMS acceleration sensors for wearables June 27th, 2017

Smart multi-layered magnetic material acts as an electric switch: New study reveals characteristic of islands of magnetic metals between vacuum gaps, displaying tunnelling electric current March 1st, 2017

Engineers shrink microscope to dime-sized device February 17th, 2017

Chip Technology

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Surprise discovery in the search for energy efficient information storage August 10th, 2017

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

Announcements

The power of perovskite: OIST researchers improve perovskite-based technology in the entire energy cycle, from solar cells harnessing power to LED diodes to light the screens of future electronic devices and other lighting applications August 18th, 2017

Gold nanostars and immunotherapy vaccinate mice against cancer: New treatment cures, vaccinates mouse in small proof-of-concept study August 18th, 2017

Researchers printed graphene-like materials with inkjet August 17th, 2017

Candy cane supercapacitor could enable fast charging of mobile phones August 17th, 2017

Tools

Scientists from the University of Manchester and Diamond Light Source work with Deben to develop and test a new compression stage to study irradiated graphite at elevated temperatures August 15th, 2017

FRITSCH • Milling and Sizing! Innovations at POWTECH 2017 - Hall 2 • Stand 227 August 9th, 2017

New Quattro Field Emission ESEM Emphasizes Versatility and Ease of Use: Thermo Scientific Quattro ESEM allows materials science researchers to study nanoscale structure in almost any material under a range of environmental conditions August 8th, 2017

Thermo Fisher Scientific’s New Talos F200i S/TEM Delivers Flexible, High-Performance Imaging: New compact S/TEM can be configured to meet specific imaging and analytical requirements for materials characterization in research laboratories August 8th, 2017

Alliances/Trade associations/Partnerships/Distributorships

Oxford Instruments Plasma Technology announces a new partner in Korea August 15th, 2017

Moving at the Speed of Light: University of Arizona selected for high-impact, industrial demonstration of new integrated photonic cryogenic datalink for focal plane arrays: Program is major milestone for AIM Photonics August 10th, 2017

Technology Companies Join Forces for TEM Imaging and Analysis August 3rd, 2017

GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks: Integrated solution leverages GF’s 22FDX® technology to decrease power, area, and cost for NB-IoT and LTE-M applications July 14th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project