Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > GE Scientists Demonstrate Breakthrough Thermal Material System to Enable Faster Computing

Abstract:
Develops prototype substrate for high-speed electronics that conducts heat better than copper.

GE Scientists Demonstrate Breakthrough Thermal Material System to Enable Faster Computing

Niskayuna, NY | Posted on March 15th, 2011

Faster laptops, more advanced radar systems and better aviation and naval electronic control systems all potential benefits of new technology

Scientists in GE's Global Research Center have demonstrated an advanced thermal material system that could pave the way to faster computing and higher performing electronic systems. Leveraging technologies developed under GE's Nanotechnology Advanced Technology Program, they have fabricated a prototype substrate that can cool electronic devices such as a laptop computer twice as well as copper.

Since the dawn of the electronics age, copper has been a preferred material to cool electronics because of its favorable heat conducting properties. But as electronic systems become more advanced, they are generating more and more heat. Too much heat can limit the overall performance of these systems, impacting computing speed and processing power. New breakthrough materials will be needed to enable more advanced systems and applications.

The development of GE's prototype substrate, which utilizes phase-change-based heat transfer, is part of a four year, $6 million program funded by the Defense Advanced Research Program Agency (DARPA, Contract # No. N66001-08-C-2008). As the leading organization of the program, GE Global Research has been collaborating with GE Intelligent Platforms, the Air Force Research Laboratory, and University of Cincinnati on the project.

Dr. Tao Deng, a senior scientist at GE Global Research and the project leader, said, "As electronics become more advanced, we are approaching the point where conventional materials like copper can't take the heat. For computing to go faster and electronics systems to become more capable, better cooling solutions such as GE's prototype substrate will be required to allow this to happen."

Deng added, "In demonstrations, GE's prototype substrate has functioned effectively in a variety of electronics application environments. We also subjected it to harsh conditions during testing and found it could successfully operate in extremely high gravity applications."

Deng noted that GE's prototype operated in conditions experiencing more than 10 times the normal force of gravity. By comparison, this gravity force is more than twice the maximum force experienced on the world's fastest roller coasters.

How it Works
GE's phase-change based prototype substrate can be applied to computer chips and a variety of different electronic components. It acts as a cooling mechanism that spreads or dissipates the heat generated in electronic systems to keep components cool.

During testing at the Air Force Research laboratories, GE's research team successfully demonstrated a prototype substrate that was measured to have at least twice the thermal conductivity as copper at only one-fourth of its weight. In addition, the prototype successfully operated in a condition that was more than 10 times normal gravity.

With high thermal conductivity, low weight, and high "G" acceleration performance, this substrate could work well in a variety of different systems, ranging from laptop computers to larger scale, more sophisticated computing systems that run the avionics and electronic control systems on board jetliners and other aircraft.

In collaboration with various agencies from the US government, GE Global Research has been developing several advanced thermal technologies. Besides the DARPA effort, Dr. Deng is also leading a team, supported by Air Force Research Laboratory, to develop advanced thermal solutions for high-speed flight in a 1.5-year, $1 MM effort. These efforts will build a total thermal solution platform to serve multiple GE businesses, including GE Aviation, GE Energy, and GE Intelligent Platforms.

####

About GE Global Research
GE Global Research (ge.com/research) is the hub of technology development for all of GE's businesses. Our scientists and engineers redefine what’s possible, drive growth for our businesses, and find answers to some of the world’s toughest problems. We innovate 24 hours a day, with sites in Niskayuna, New York; Bangalore, India; Shanghai, China; Munich, Germany; and our newest location in Rio de Janeiro, Brazil. Connect with our technologists at edisonsdesk.com and twitter.com/edisonsdesk.

Distribution Statement “A” (Approved for Public Release, Distribution Unlimited)

For more information, please click here

Contacts:
Todd Alhart
GE Global Research
518-387-7914
alhart[.]research.ge.com

Copyright © Newswire Today

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Harris & Harris Group to Host Conference Call on Second-Quarter 2014 Financial Results on August 15, 2014 July 23rd, 2014

UCF Nanotech Spinout Developing Revolutionary Battery Technology: Power the Next Generation of Electronics with Carbon July 23rd, 2014

Deadline Announced for Registration in 7th Int'l Nanotechnology Festival in Iran July 23rd, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

Chip Technology

A Crystal Wedding in the Nanocosmos July 23rd, 2014

Nanometrics Announces Upcoming Investor Events July 22nd, 2014

Penn Study: Understanding Graphene’s Electrical Properties on an Atomic Level July 22nd, 2014

NUS scientists use low cost technique to improve properties and functions of nanomaterials: By 'drawing' micropatterns on nanomaterials using a focused laser beam, scientists could modify properties of nanomaterials for effective applications in photonic and optoelectric applicat July 22nd, 2014

Nanoelectronics

A Crystal Wedding in the Nanocosmos July 23rd, 2014

3-D nanostructure could benefit nanoelectronics, gas storage: Rice U. researchers predict functional advantages of 3-D boron nitride July 15th, 2014

IBM Announces $3 Billion Research Initiative to Tackle Chip Grand Challenges for Cloud and Big Data Systems: Scientists and engineers to push limits of silicon technology to 7 nanometers and below and create post-silicon future July 10th, 2014

Carbodeon enables 20 percent increase in polymer thermal filler conductivity with 0.03 wt.% nanodiamond additive at a lower cost than with traditional fillers: Improved materials and processes enable nanodiamond cost reductions of up to 70 percent for electronics and LED app July 9th, 2014

Discoveries

UCF Nanotech Spinout Developing Revolutionary Battery Technology: Power the Next Generation of Electronics with Carbon July 23rd, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

Nano-sized Chip "Sniffs Out" Explosives Far Better than Trained Dogs: TAU researcher's groundbreaking sensor detects miniscule concentrations of hazardous materials in the air July 23rd, 2014

NIST shows ultrasonically propelled nanorods spin dizzyingly fast July 22nd, 2014

Announcements

Harris & Harris Group to Host Conference Call on Second-Quarter 2014 Financial Results on August 15, 2014 July 23rd, 2014

UCF Nanotech Spinout Developing Revolutionary Battery Technology: Power the Next Generation of Electronics with Carbon July 23rd, 2014

Deadline Announced for Registration in 7th Int'l Nanotechnology Festival in Iran July 23rd, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE