Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > SEMATECH and Lasertec Partner at UAlbany NanoCollege

Abstract:
Partnership to Develop TSV Solutions for Chip-Stacking Applications

SEMATECH and Lasertec Partner at UAlbany NanoCollege

Albany, NY and Yokohama, Japan | Posted on July 7th, 2010

Lasertec Corporation of Japan has joined SEMATECH's 3D Interconnect Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, and will partner with SEMATECH to develop robust, cost-effective process metrology technology solutions for readying high-volume via-mid through-silicon via (TSV) manufacturing.

The collaboration between Lasertec and researchers from SEMATECH's 3D interconnect program will include investigations and comparisons of 3D TSV depth metrology schemes. This work is necessary not only for TSV RIE process control, but also for providing critical feed forward data for wafer thinning and TSV expose processes.

To facilitate this work, Lasertec will place a 300 mm TSV infrared (IR) etch metrology tool in SEMATECH's 3D R&D Center, providing advanced measurement capabilities that will enable accurate, repeatable TSV depth measurements over a range of TSV dimensions.

"We are pleased to welcome Lasertec to the 3D program." said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "Our common goal is to address the technical challenges of via-mid TSV technology. The metrology expertise of Lasertec combined with the capability of the TSV 300-IR will fill an important gap in our integration scheme. Together, we will provide our Member Companies with a world class TSV depth metrology solution capable of addressing today's needs as well as tomorrow's aggressive dimensions."

"Lasertec is looking forward to contributing our expertise in the fields of metrology and inspection to further explore innovative metrology capabilities that will make 3D TSVs commercially viable," said Hal Kusunose, CTO of Lasertec. "Our cutting-edge TSV 300-IR tool will allow SEMATECH researchers and SEMATECH's Member Companies to address important metrology challenges of TSV technology."

"The leading-edge research and development that is critical for commercializing innovative TSV technologies will be further enhanced by the addition of Lasertec to CNSE's Albany NanoTech Complex," said Richard Brilla, CNSE Vice President for Strategy, Alliances and Consortia. "This new collaboration builds on the SEMATECH-CNSE partnership to support the advanced technology needs of our global corporate partners and the nanoelectronics industry."

Through-silicon via technology is a method of combining integrated circuits in a vertical stack to enable high functionality and performance with low power consumption in a small footprint. While employing many standard chip processes, TSVs present several new technical and logistical challenges which are being addressed by SEMATECH.

Launched three years ago, SEMATECH's 3D program was established at CNSE's Albany NanoTech Complex to deliver robust 300 mm equipment and process technology solutions for high-volume through-silicon via (TSV) manufacturing. To accelerate progress, the program's engineers have been actively engaging with leading edge equipment and materials suppliers and leveraging their expertise to ready TSV technology. Eventually, 3D interconnects will provide cost-effective ways to integrate diverse CMOS technologies and chips with emerging technologies such as micro and nano electromechanical systems (MEMS, NEMS) and bio-chips.

####

About Lasertec
Lasertec (Lasertec Corporation; Head Office at Kohoku-ku, Yokohama, Japan; President: Osamu OKABAYASHI), established in 1960, is a leading supplier of innovative semiconductor, LCD and PV related inspection and measurement equipment worldwide. Product line includes TSV etching depth inspection system, wafer inspection/review system, EUVL mask blank inspection system, photomask inspection system, photomask haze removal system, color filter repair system, PV cell conversion efficiency distribution measurement system and various types of confocal laser microscopes. To support this diverse product base, Lasertec has strategically-located sales and service offices worldwide. Lasertec is a publicly held company listed on JASDAQ. For more information, go to: www.lasertec.co.jp.

For more information, please click here

Contacts:
Erica McGill
SEMATECH Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © Lasertec

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Design of micro and nanoparticles to improve treatments for Alzheimers and Parkinsons: At the Faculty of Pharmacy of the UPV/EHU-University of the Basque Country encapsulation techniques are being developed to deliver correctly and effectively certain drugs October 20th, 2014

Physicists build reversible laser tractor beam October 20th, 2014

Removal of Limitations of Composites at Superheat Temperatures October 20th, 2014

1980s aircraft helps quantum technology take flight October 20th, 2014

Academic/Education

First Canada Excellence Research Chair gets $10 million from the federal government for oilsands research at the University of Calgary: Federal government announces prestigious research chair to study improving oil production efficiency October 19th, 2014

Raytheon, UMass Lowell open on-campus research institute: Industry leader’s researchers to collaborate with faculty, students to move key technologies forward through first-of-its-kind partnership October 11th, 2014

SUNY Colleges of Nanoscale Science and Engineering and National Institute for Occupational Safety and Health Announce Expanded Partnership October 2nd, 2014

Yale University and Leica Microsystems Partner to Establish Microscopy Center of Excellence: Yale Welcomes Scientists to Participate in Core Facility Opening and Super- Resolution Workshops October 20 Through 31, 2014 September 30th, 2014

Chip Technology

Superconducting circuits, simplified: New circuit design could unlock the power of experimental superconducting computer chips October 18th, 2014

3DXNano™ ESD Carbon Nanotube 3D Printing Filament - optimized for demanding 3D printing applications in the semi-con and electronics industry October 16th, 2014

Future computers could be built from magnetic 'tornadoes' October 14th, 2014

Australian teams set new records for silicon quantum computing October 12th, 2014

Nanoelectronics

Future computers could be built from magnetic 'tornadoes' October 14th, 2014

Aledia’s Nanowire LED Technology Endorsed By 2014 Physics Nobel Prize Winner: Hiroshi Amano Serves on Company’s Scientific Advisory Board October 13th, 2014

Fast, cheap nanomanufacturing: Arrays of tiny conical tips that eject ionized materials could fabricate nanoscale devices cheaply October 4th, 2014

SUNY Colleges of Nanoscale Science and Engineering and National Institute for Occupational Safety and Health Announce Expanded Partnership October 2nd, 2014

Announcements

Design of micro and nanoparticles to improve treatments for Alzheimers and Parkinsons: At the Faculty of Pharmacy of the UPV/EHU-University of the Basque Country encapsulation techniques are being developed to deliver correctly and effectively certain drugs October 20th, 2014

Physicists build reversible laser tractor beam October 20th, 2014

Removal of Limitations of Composites at Superheat Temperatures October 20th, 2014

1980s aircraft helps quantum technology take flight October 20th, 2014

Alliances/Partnerships/Distributorships

European Commission opens the gate towards the implementation of Nanomedicine Translation Hub October 16th, 2014

IRLYNX and CEA-Leti to Streamline New CMOS-based Infrared Sensing Modules Dedicated to Human-activities Characterization October 15th, 2014

New VDMA Association "Electronics, Micro and Nano Technologies" founded: Inaugural Meeting in Frankfurt/Main, Germany October 15th, 2014

VDMA photonics steering committee with new members stronger than ever October 14th, 2014

Research partnerships

IRLYNX and CEA-Leti to Streamline New CMOS-based Infrared Sensing Modules Dedicated to Human-activities Characterization October 15th, 2014

Scientists Map Key Moment in Assembly of DNA-Splitting Molecular Machine: Crucial steps and surprising structures revealed in the genesis of the enzyme that divides the DNA double helix during cell replication October 15th, 2014

Unique catalysts for hydrogen fuel cells synthesized in ordinary kitchen microwave oven October 14th, 2014

Bio-inspired 'nano-cocoons' offer targeted drug delivery against cancer cells October 14th, 2014

NanoNews-Digest
The latest news from around the world, FREE





  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE