Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > SEMATECH and Lasertec Partner at UAlbany NanoCollege

Abstract:
Partnership to Develop TSV Solutions for Chip-Stacking Applications

SEMATECH and Lasertec Partner at UAlbany NanoCollege

Albany, NY and Yokohama, Japan | Posted on July 7th, 2010

Lasertec Corporation of Japan has joined SEMATECH's 3D Interconnect Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, and will partner with SEMATECH to develop robust, cost-effective process metrology technology solutions for readying high-volume via-mid through-silicon via (TSV) manufacturing.

The collaboration between Lasertec and researchers from SEMATECH's 3D interconnect program will include investigations and comparisons of 3D TSV depth metrology schemes. This work is necessary not only for TSV RIE process control, but also for providing critical feed forward data for wafer thinning and TSV expose processes.

To facilitate this work, Lasertec will place a 300 mm TSV infrared (IR) etch metrology tool in SEMATECH's 3D R&D Center, providing advanced measurement capabilities that will enable accurate, repeatable TSV depth measurements over a range of TSV dimensions.

"We are pleased to welcome Lasertec to the 3D program." said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "Our common goal is to address the technical challenges of via-mid TSV technology. The metrology expertise of Lasertec combined with the capability of the TSV 300-IR will fill an important gap in our integration scheme. Together, we will provide our Member Companies with a world class TSV depth metrology solution capable of addressing today's needs as well as tomorrow's aggressive dimensions."

"Lasertec is looking forward to contributing our expertise in the fields of metrology and inspection to further explore innovative metrology capabilities that will make 3D TSVs commercially viable," said Hal Kusunose, CTO of Lasertec. "Our cutting-edge TSV 300-IR tool will allow SEMATECH researchers and SEMATECH's Member Companies to address important metrology challenges of TSV technology."

"The leading-edge research and development that is critical for commercializing innovative TSV technologies will be further enhanced by the addition of Lasertec to CNSE's Albany NanoTech Complex," said Richard Brilla, CNSE Vice President for Strategy, Alliances and Consortia. "This new collaboration builds on the SEMATECH-CNSE partnership to support the advanced technology needs of our global corporate partners and the nanoelectronics industry."

Through-silicon via technology is a method of combining integrated circuits in a vertical stack to enable high functionality and performance with low power consumption in a small footprint. While employing many standard chip processes, TSVs present several new technical and logistical challenges which are being addressed by SEMATECH.

Launched three years ago, SEMATECH's 3D program was established at CNSE's Albany NanoTech Complex to deliver robust 300 mm equipment and process technology solutions for high-volume through-silicon via (TSV) manufacturing. To accelerate progress, the program's engineers have been actively engaging with leading edge equipment and materials suppliers and leveraging their expertise to ready TSV technology. Eventually, 3D interconnects will provide cost-effective ways to integrate diverse CMOS technologies and chips with emerging technologies such as micro and nano electromechanical systems (MEMS, NEMS) and bio-chips.

####

About Lasertec
Lasertec (Lasertec Corporation; Head Office at Kohoku-ku, Yokohama, Japan; President: Osamu OKABAYASHI), established in 1960, is a leading supplier of innovative semiconductor, LCD and PV related inspection and measurement equipment worldwide. Product line includes TSV etching depth inspection system, wafer inspection/review system, EUVL mask blank inspection system, photomask inspection system, photomask haze removal system, color filter repair system, PV cell conversion efficiency distribution measurement system and various types of confocal laser microscopes. To support this diverse product base, Lasertec has strategically-located sales and service offices worldwide. Lasertec is a publicly held company listed on JASDAQ. For more information, go to: www.lasertec.co.jp.

For more information, please click here

Contacts:
Erica McGill
SEMATECH Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © Lasertec

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Texas A&M Chemist Says Trapped Electrons To Blame For Lack Of Battery Efficiency: Forget mousetraps — today’s scientists will get the cheese if they manage to build a better battery June 28th, 2016

Building a smart cardiac patch: 'Bionic' cardiac patch could one day monitor and respond to cardiac problems June 28th, 2016

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

Yale researchers’ technology turns wasted heat into power June 27th, 2016

Academic/Education

JPK’s NanoWizard® AFM and ForceRobot® systems are being used in the field of medical diagnostics in the Supersensitive Molecular Layer Laboratory of POSTECH in Korea June 21st, 2016

Weizmann Institute of Science Presents: Weizmann Wonder Wander - 4G - is Online June 21st, 2016

NanoLabNL boosts quality of research facilities as Dutch Toekomstfonds invests firmly June 10th, 2016

The Institute for Transfusion Medicine at the University Hospital of Duisburg-Essen in Germany uses the ZetaView from Particle Metrix to quantify extracellular vesicles June 7th, 2016

Chip Technology

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

GraphExeter illuminates bright new future for flexible lighting devices June 23rd, 2016

Soft decoupling of organic molecules on metal June 23rd, 2016

Particle zoo in a quantum computer: First experimental quantum simulation of particle physics phenomena June 23rd, 2016

Nanoelectronics

Soft decoupling of organic molecules on metal June 23rd, 2016

Tailored DNA shifts electrons into the 'fast lane': DNA nanowire improved by altering sequences June 22nd, 2016

Scientists engineer tunable DNA for electronics applications June 21st, 2016

Novel energy inside a microcircuit chip: VTT developed an efficient nanomaterial-based integrated energy June 10th, 2016

Announcements

Texas A&M Chemist Says Trapped Electrons To Blame For Lack Of Battery Efficiency: Forget mousetraps — today’s scientists will get the cheese if they manage to build a better battery June 28th, 2016

Building a smart cardiac patch: 'Bionic' cardiac patch could one day monitor and respond to cardiac problems June 28th, 2016

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

Yale researchers’ technology turns wasted heat into power June 27th, 2016

Alliances/Trade associations/Partnerships/Distributorships

FEI and University of Liverpool Announce QEMSCAN Research Initiative: University of Liverpool will utilize FEI’s QEMSCAN technology to gain a better insight into oil and gas reserves & potentially change the approach to evaluating them June 22nd, 2016

French Research Team Helps Extend MRI Detection of Diseases & Lower Health-Care Costs: CEA, INSERM and G2ELab Brings Grenoble Region’s Expertise In Advanced Medicine & Magnetism Applications to H2020 IDentIFY Project June 21st, 2016

Research showing why hierarchy exists will aid the development of artificial intelligence June 13th, 2016

UK NANOSAFETY GROUP publishes 2nd Edition of guidance to support safe working with nanomaterials May 30th, 2016

Research partnerships

Superheroes are real: Ultrasensitive nonlinear metamaterials for data transfer June 25th, 2016

Soft decoupling of organic molecules on metal June 23rd, 2016

FEI and University of Liverpool Announce QEMSCAN Research Initiative: University of Liverpool will utilize FEI’s QEMSCAN technology to gain a better insight into oil and gas reserves & potentially change the approach to evaluating them June 22nd, 2016

Tailored DNA shifts electrons into the 'fast lane': DNA nanowire improved by altering sequences June 22nd, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic