- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
Partnership to Develop TSV Solutions for Chip-Stacking Applications
Lasertec Corporation of Japan has joined SEMATECH's 3D Interconnect Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, and will partner with SEMATECH to develop robust, cost-effective process metrology technology solutions for readying high-volume via-mid through-silicon via (TSV) manufacturing.
The collaboration between Lasertec and researchers from SEMATECH's 3D interconnect program will include investigations and comparisons of 3D TSV depth metrology schemes. This work is necessary not only for TSV RIE process control, but also for providing critical feed forward data for wafer thinning and TSV expose processes.
To facilitate this work, Lasertec will place a 300 mm TSV infrared (IR) etch metrology tool in SEMATECH's 3D R&D Center, providing advanced measurement capabilities that will enable accurate, repeatable TSV depth measurements over a range of TSV dimensions.
"We are pleased to welcome Lasertec to the 3D program." said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "Our common goal is to address the technical challenges of via-mid TSV technology. The metrology expertise of Lasertec combined with the capability of the TSV 300-IR will fill an important gap in our integration scheme. Together, we will provide our Member Companies with a world class TSV depth metrology solution capable of addressing today's needs as well as tomorrow's aggressive dimensions."
"Lasertec is looking forward to contributing our expertise in the fields of metrology and inspection to further explore innovative metrology capabilities that will make 3D TSVs commercially viable," said Hal Kusunose, CTO of Lasertec. "Our cutting-edge TSV 300-IR tool will allow SEMATECH researchers and SEMATECH's Member Companies to address important metrology challenges of TSV technology."
"The leading-edge research and development that is critical for commercializing innovative TSV technologies will be further enhanced by the addition of Lasertec to CNSE's Albany NanoTech Complex," said Richard Brilla, CNSE Vice President for Strategy, Alliances and Consortia. "This new collaboration builds on the SEMATECH-CNSE partnership to support the advanced technology needs of our global corporate partners and the nanoelectronics industry."
Through-silicon via technology is a method of combining integrated circuits in a vertical stack to enable high functionality and performance with low power consumption in a small footprint. While employing many standard chip processes, TSVs present several new technical and logistical challenges which are being addressed by SEMATECH.
Launched three years ago, SEMATECH's 3D program was established at CNSE's Albany NanoTech Complex to deliver robust 300 mm equipment and process technology solutions for high-volume through-silicon via (TSV) manufacturing. To accelerate progress, the program's engineers have been actively engaging with leading edge equipment and materials suppliers and leveraging their expertise to ready TSV technology. Eventually, 3D interconnects will provide cost-effective ways to integrate diverse CMOS technologies and chips with emerging technologies such as micro and nano electromechanical systems (MEMS, NEMS) and bio-chips.
Lasertec (Lasertec Corporation; Head Office at Kohoku-ku, Yokohama, Japan; President: Osamu OKABAYASHI), established in 1960, is a leading supplier of innovative semiconductor, LCD and PV related inspection and measurement equipment worldwide. Product line includes TSV etching depth inspection system, wafer inspection/review system, EUVL mask blank inspection system, photomask inspection system, photomask haze removal system, color filter repair system, PV cell conversion efficiency distribution measurement system and various types of confocal laser microscopes. To support this diverse product base, Lasertec has strategically-located sales and service offices worldwide. Lasertec is a publicly held company listed on JASDAQ. For more information, go to: www.lasertec.co.jp.
For more information, please click here
SEMATECH Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
Copyright © LasertecIf you have a comment, please Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
|Related News Press|
News and information
The quantum middle man July 2nd, 2015
Emergence of a 'devil's staircase' in a spin-valve system July 1st, 2015
Exagan Raises €5.7 Million to Produce High-efficiency GaN-on-Silicon Power-switching Devices on 200mm Wafers: Leti-and-Soitec Spinout Focused on Becoming Leading European Source Of GaN Devices for Solar, Automotive, Telecoms and Infrastructure June 25th, 2015
Nanowires could be the LEDs of the future June 25th, 2015
Leti to Present Solutions to New Applications Using 3D Technologies at SEMICON West LetiDay Event, July 14: Leti Experts also Will Speak at TechXPOT Session on MEMS and STS Session on Lithography Cost-and-Productivity Issues Below 14nm June 22nd, 2015
Dyesol Joins Solliance as an Industrial Partner June 17th, 2015
Producing spin-entangled electrons July 2nd, 2015
Leti Announces Launch of First European Nanomedicine Characterisation Laboratory: Project Combines Expertise of 9 Partners in 8 Countries to Foster Nanomedicine Innovation and Facilitate Regulatory Approval July 1st, 2015