Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Silicon Integrated Nanophotonics

Artistí concept of 3D silicon processor chip with optical IO layer featuring on-chip nanophotonic network.  Courtesy IBM.
Artistí concept of 3D silicon processor chip with optical IO layer featuring on-chip nanophotonic network. Courtesy IBM.

Abstract:
Development of on-chip optical interconnects for future multi-core processors

Silicon Integrated Nanophotonics

Yorktown Heights, NY | Posted on March 6th, 2010

The ultimate goal of this project is to develop a technology for on-chip integration of ultra-compact nanophotonic circuits for manipulating the light signals, similar to the way electrical signals are manipulated in computer chips. Nanoscale silicon photonics circuits are being developed to enable the integration of complete optical systems on a monolithic semiconductor chip that would eventually allow to overcome severe constraints of today's mostly copper I/O interconnects.

The current tendency in high performance computing systems is to increase the parallelism in processing at all levels utilizing multithreads, increasing the number of chips in racks and blades, as well as increasing the number of cores on a chip. The scaling of overall system performance that soon might approach Exaflop/s is, however, out of balance with respect to limited available bandwidth for shuttling ExaBytes of data across the system, between the racks, chips and cores.

Optics is destined to be utilized in data centers since optical communications can meet the large bandwidth demands of high-performance computing systems by bringing the immense advantages of high modulation rates and parallelism of wavelength division multiplexing. As it already happened in long-haul communications decades ago when optical fibers replaced copper cables, the copper cables that connect racks in the datacenters are started now to being replaced by optical fibers. Following the same trend optics can become competitive with copper at shorter and shorter distances eventually leading to optical on-board and may be even on-chip communications.

This future 3D-integated chip consists of several layers connected with each other with very dense and small pitch interlayer vias. The lower layer is a processor itself with many hundreds of individual cores. Memory layer (or layers) are bonded on top to provide fast access to local caches. On top of the stack is the Photonic layer with many thousands of individual optical devices (modulators, detectors, switches) as well as analogue electrical circuits (amplifiers, drivers, latches, etc.). The key role of a photonic layer is not only to provide point-to-point broad bandwidth optical link between different cores and/or the off-chip traffic, but also to route this traffic with an array of nanophotonic switches. Hence it is named Intra-chip optical network (ICON).

Silicon photonics offers high density integration of individual optical components on a single chip. Strong light confinement enables dramatic scaling of the device area and allows unprecedented control over optical signals. Silicon nanophotonic devices have immense capacity for low-loss, high-bandwidth data processing. Fabrication of silicon photonics system in the complementary metal-oxide-semiconductor (CMOS)-compatible silicon-on-insulator platform also results in further integration of optical and electrical circuitry. Following the Moore's scaling laws in electronics, dense chip-scale integration of optical components can bring the price and power per a bit of transferred data low enough to enable optical communications in high performance computing systems.

To meet these stringent requirements and utilize fully all the benefits of optics an innovative engineering is necessary at all levels starting from the design of individual devices to the overall architecture of high-performance computing system. Nanoscale silicon photonics circuits that are being developed within this project are targeted to enable the monolithic integration of complete optical systems on a semiconductor chip.

More: www.research.ibm.com/photonics/publications/ecoc_tutorial_2008.pdf

####

For more information, please click here

Contacts:
Main operator
(914) 945-3000

Copyright © IBM

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Building a smart cardiac patch: 'Bionic' cardiac patch could one day monitor and respond to cardiac problems June 28th, 2016

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

Yale researchersí technology turns wasted heat into power June 27th, 2016

FEI Launches Helios G4 DualBeam Series for Materials Science: The Helios G4 DualBeam Series features new capabilities to enable scientists and engineers to answer the most demanding and challenging scientific questions June 27th, 2016

Possible Futures

Building a smart cardiac patch: 'Bionic' cardiac patch could one day monitor and respond to cardiac problems June 28th, 2016

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

Yale researchersí technology turns wasted heat into power June 27th, 2016

Superheroes are real: Ultrasensitive nonlinear metamaterials for data transfer June 25th, 2016

Chip Technology

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

GraphExeter illuminates bright new future for flexible lighting devices June 23rd, 2016

Soft decoupling of organic molecules on metal June 23rd, 2016

Particle zoo in a quantum computer: First experimental quantum simulation of particle physics phenomena June 23rd, 2016

Nanoelectronics

Soft decoupling of organic molecules on metal June 23rd, 2016

Tailored DNA shifts electrons into the 'fast lane': DNA nanowire improved by altering sequences June 22nd, 2016

Scientists engineer tunable DNA for electronics applications June 21st, 2016

Novel energy inside a microcircuit chip: VTT developed an efficient nanomaterial-based integrated energy June 10th, 2016

Announcements

Building a smart cardiac patch: 'Bionic' cardiac patch could one day monitor and respond to cardiac problems June 28th, 2016

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

Yale researchersí technology turns wasted heat into power June 27th, 2016

FEI Launches Helios G4 DualBeam Series for Materials Science: The Helios G4 DualBeam Series features new capabilities to enable scientists and engineers to answer the most demanding and challenging scientific questions June 27th, 2016

Photonics/Optics/Lasers

Superheroes are real: Ultrasensitive nonlinear metamaterials for data transfer June 25th, 2016

Russian physicists create a high-precision 'quantum ruler': Physicists have devised a method for creating a special quantum entangled state June 25th, 2016

Marrying superconductors, lasers, and Bose-Einstein condensates: Chapman University Institute for Quantum Studies (IQS) member Yutaka Shikano, Ph.D., recently had research published in Scientific Reports June 20th, 2016

A new trick for controlling emission direction in microlasers June 20th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic