Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Record number of papers at SPIE Advanced Lithography conference reports imec’s progress in advanced lithography

EUV resists are steadily improving and now nicely resolve 27nm LS on the EUV ADT.
EUV resists are steadily improving and now nicely resolve 27nm LS on the EUV ADT.

Abstract:
At next week's SPIE Advanced Lithography Conference (www.spie.org) being held February 22 - 26 in San Jose, California, imec technologists will contribute a record number of over 30 papers showing their newest breakthroughs in advanced semiconductor lithography research.

While imec pushes 193nm to its limits by investigating cost-effective double patterning methods and by source mask optimization for 22nm half pitch, most research has been shifted to EUVL (extreme ultraviolet lithography). Today, EUV is the most promising cost-effective method for insertion at the 22nm node and approaches preproduction at imec by the end of 2010.

Record number of papers at SPIE Advanced Lithography conference reports imec’s progress in advanced lithography

Leuven, Belgium | Posted on February 16th, 2010

EUV approaches preproduction at imec by end 2010

With the installation of Hamatech's MaskTrack Pro photomask cleaning system, imec is now ready to start its research on EUV mask cleaning. Pristine, defect-free masks at point-of-exposure have become a critical issue in the advancement of EUVL. Since EUV masks have no protecting pellicle, each time they are handled, a risk for extra defects due to particle formation exists. As the only research facility with a complete mask integrity infrastructure, imec will now start with some of its key core partners research on innovative mask cleaning technology to make sure that EUV masks are always clean before they are loaded into the scanner. Apart from contamination by particles, potential (photon-induced) organic contamination will also be studied. This unique research will enable to develop processes of record (PORs) for EUV mask cleaning, which will allow to accelerate total process development for yielding manufacturing based on EUV lithography.

Currently, imec is developing EUV process technology by applying ASML's EUV alpha demo tool (ADT); its successor, the EUV preproduction tool (ASML NXE:3100), is scheduled for installation in Q4 2010. Using the ADT, progress has been made on many aspects of EUV Lithography and preparation for the NXE:3100 is on-going.

And promising progress has been achieved in EUV resist performance. Imec now has resists to pattern 27nm features on the alpha demo tool and is confident that suitable resists for 22nm and later on 16nm are within reach on future exposure tools. A set-up to quantify resist outgassing became operational and is now used routinely in material screening and to qualify materials for ADT exposures.

Pushing 193nm lithography towards 22nm

Imec achieved major progress in the cost reduction of double patterning. Imec compares and evaluates chemicals and techniques for litho-process-litho-etch solutions as cost effective alternatives to the litho-etch-litho-etch process. By avoiding the etch step the process cost can be reduced. First results showed a litho-process-litho-etch solution as a viable process, in the first place for designs with a repeated, regular geometry, such as memory ICs. Today, resulting from a lot of research on intelligent design split, imec also reports that litho-process-litho-etch double patterning is a suitable and cost-effective technology for random logic application at 32nm half pitch. And very good critical dimension uniformity (CDU) of the first and second patterns has been measured down to 26nm half pitch.

Imec also started a program on source mask optimization including diffractive optical elements and flexible illuminators to further push 193nm to its limits. With source mask optimization, the illumination shape is tailored to the specific layout to be printed, improving in that way the resolution and process margins to some extent. These results show the potential to push 193nm lithography towards the 22nm node.

"I'm very proud that our lithography research team has achieved these amazing results over the last year. Thanks to their efforts and our unique infrastructure which we expand dependent on the technology needs, we are on track for cost-effective double patterning for the 32nm half pitch node and to introduce EUV at 22nm;" said Kurt Ronse, director advanced lithography program at imec.

####

About imec
Imec is a world-leading independent research center in nanoelectronics and nanotechnology.

Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China and Japan.

Its staff of more than 1,650 people include over 550 industrial residents and guest researchers. In 2008, imec's revenue (P&L) was 270 million euro.

For more information, please click here

Contacts:
imec: Katrien Marent
Director of External Communications
T: +32 16 28 18 80
Mobile : +32 474 30 28 66

Copyright © imec

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

The Pocket Project will develop a low-cost and accurate point-of-care test to diagnose Tuberculosis: ICN2 holds a follow-up meeting of the Project on September 18th - 19th September 18th, 2014

New non-invasive technique could revolutionize the imaging of metastatic cancer September 17th, 2014

Toward making lithium-sulfur batteries a commercial reality for a bigger energy punch September 17th, 2014

Recruiting bacteria to be technology innovation partners: September 17th, 2014

Chip Technology

‘Small’ transformation yields big changes September 16th, 2014

UT Arlington research uses nanotechnology to help cool electrons with no external sources September 11th, 2014

Excitonic Dark States Shed Light on TMDC Atomic Layers: Berkeley Lab Discovery Holds Promise for Nanoelectronic and Photonic Applications September 11th, 2014

Researchers Create World’s Largest DNA Origami September 11th, 2014

Nanoelectronics

Rice rolls 'neat' nanotube fibers: Rice University researchers' acid-free approach leads to strong conductive carbon threads September 15th, 2014

Excitonic Dark States Shed Light on TMDC Atomic Layers: Berkeley Lab Discovery Holds Promise for Nanoelectronic and Photonic Applications September 11th, 2014

Researchers Create World’s Largest DNA Origami September 11th, 2014

Material development on the nanoscale: Doped graphene nanoribbons with potential September 8th, 2014

Announcements

The Pocket Project will develop a low-cost and accurate point-of-care test to diagnose Tuberculosis: ICN2 holds a follow-up meeting of the Project on September 18th - 19th September 18th, 2014

Scientists refine formula for nanotube types: Rice University theorists determine factors that give tubes their chiral angles September 17th, 2014

New non-invasive technique could revolutionize the imaging of metastatic cancer September 17th, 2014

Toward making lithium-sulfur batteries a commercial reality for a bigger energy punch September 17th, 2014

Interviews/Book Reviews/Essays/Reports/Podcasts/Journals

Scientists refine formula for nanotube types: Rice University theorists determine factors that give tubes their chiral angles September 17th, 2014

New non-invasive technique could revolutionize the imaging of metastatic cancer September 17th, 2014

Toward making lithium-sulfur batteries a commercial reality for a bigger energy punch September 17th, 2014

Recruiting bacteria to be technology innovation partners: September 17th, 2014

Events/Classes

PEN Inc. Chairman, Scott Rickert, Will Webcast a Live Company Update September 25, 1 PM EDT September 17th, 2014

Dolomite to launch Meros TCU-100 temperature controller at Lab-on-a-Chip & Microarray World Congress September 15th, 2014

Seeking Nanoscale Defenses for Biological and Chemical Threats: WPI co-organizes a NATO workshop to improve the detection and decontamination of biological and chemical agents September 13th, 2014

PETA science consortium experts to present at international nanotechology workshop: PETA International Science Consortium, Ltd., Is a Sponsor of Nano Risk Analysis II September 12th, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE