Home > Press > The Eighteenth Annual International Conference on Composites/Nano Engineering (ICCE - 18)
Abstract:
ICCE-18 Anchorage, Alaska,USA, July 4-10, 2010
The Eighteenth Annual International Conference on Composites/Nano Engineering (ICCE - 18)
Anchorage, AK | Posted on February 7th, 2010
Message from ICCE Chairman
The ICCE conference is unique in that while it is an engineering conference, it has attracted numerous chemists, physicists and scientists from diverse fields in our efforts to promote interdisciplinary research on composites. Of particular concern is the challenge for materials engineers to understand the wide diversity of length scales ranging from nano to micro to macro and full scale and to question the validity of the theories or models which are known to be valid only in certain length scales. The ICCE is among the first composite materials conferences which take a leading vital role to bridge the gap between nano-chemistry and nano-engineering, and attracted hundreds of papers in this existing relatively new field of nano-composites engineering.
The ICCE conference will provide a forum for the exchange of information and ideas in virtually all areas composite materials research. The goals of the ICCE conference are:
1. To BRIDGE THE GAP between Materials Science, Mechanics and manufacturing of Composite Materials;
2. To encourage INTERDISCIPLINARY research bridging the gap between aerospace technology, bio-materials, chemistry, electronics, fluid mechanics, infrastructures, magnetic materials, nanotechnology, physics, powder metallurgy, sensors/actuators, among others and
3. to encourage LEVERAGING of composite materials research resources through joint research between participants and writing joint research proposals.
US$490 before May 26, 2010
Please submit paper title submitted to
Two-page short paper due June 4, 2010, each page two-column format.
####
Contacts:
Conference Chair
Professor David Hui
Department of Mechanical Engineering
University of New Orleans,
New Orleans, LA 70148
Tel: (504) 280 6652
Fax: (504) 280 6192
If you have a comment, please
Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Bookmark:
News and information
Beautiful "flowers" self-assemble in a beaker: Elaborate nanostructures blossom from a chemical reaction perfected at Harvard May 17th, 2013
Artificial Forest for Solar Water-Splitting: Berkeley Lab Researchers Report First Fully Integrated Artificial Photosynthesis Nanosystem May 17th, 2013
Moth-Inspired Nanostructures Take the Color Out of Thin Films May 17th, 2013
NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013
Add boron for better batteries: Rice University theorists say graphene-boron mix shows promise for lithium-ion batteries May 17th, 2013
Physics
Scientists capture first direct proof of Hofstadter butterfly effect May 17th, 2013
RUB physicists let magnetic dipoles interact on the nanoscale for the first time: 'Of great technical interest for future hard disk drives' May 15th, 2013
New principle may help explain why nature is quantum May 15th, 2013
Cold atoms for quantum technology May 12th, 2013
Graphene joins the race to redefine the ampere May 12th, 2013
Chemistry
Iranian Scientists Use Pomegranate Juice to Produce Copper Iodide Nanostructure May 14th, 2013
Chemistry breakthrough sheds new light on illness and health May 12th, 2013
Sensors
Advancements and developments of solid-state nanopores sensors May 16th, 2013
Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013
Physicists discover a new kind of friction: Friction in the nano-world May 16th, 2013
HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013
Materials
Advancements and developments of solid-state nanopores sensors May 16th, 2013
Physicists discover a new kind of friction: Friction in the nano-world May 16th, 2013
Squishy hydrogels may be the ticket for studying biological effects of nanoparticles May 15th, 2013
Pitt Chemists Demonstrate Nanoscale Alloys So Bright They Could Have Potential Medical Applications: “Think about a particle that will not only help researchers detect cancer sooner but be used to treat the tumor, too.” May 15th, 2013
Announcements
Artificial Forest for Solar Water-Splitting: Berkeley Lab Researchers Report First Fully Integrated Artificial Photosynthesis Nanosystem May 17th, 2013
Moth-Inspired Nanostructures Take the Color Out of Thin Films May 17th, 2013
NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013
Scientists capture first direct proof of Hofstadter butterfly effect May 17th, 2013
Aerospace/Space
Moth-Inspired Nanostructures Take the Color Out of Thin Films May 17th, 2013
Lifeboat publishes its first book: The Lifeboat Foundation has published its first book, "The Human Race to the Future: What Could Happen -- and What to Do" May 14th, 2013
UC Santa Barbara History Professor's Book Elucidates, Celebrates ‘Visioneers' May 14th, 2013
Over 20 Exhibitors To Present At International Space Development Conference May 13th, 2013
Events/Classes
Interactive Printed Products – New Applications Enabled by Organic and Printed Electronics May 16th, 2013
Nanometrics Announces Upcoming Investor Events May 14th, 2013
INSCX™ exchange to present a nanotechnology-based Emission Reduction Programme, Ankara, Turkey, June 2013 May 14th, 2013
VDMA: New “Photonics Industry Report 2013” presented May 14th, 2013
Alliances/Partnerships/Distributorships
NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013
Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013
HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013
Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013