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Home > Press > Advanced Electronic Packaging - International Technology & Market Trends

Abstract:
Reportlinker.com announces that a new market research report is available in its catalogue

Advanced Electronic Packaging - International Technology & Market Trends

New York, NY | Posted on February 2nd, 2010

With the burgeoning demand for portable devices, demand for advanced electronic packaging for accommodating the integrated circuits that support the aforesaid devices is on rise. Decreasing device size demands low cost electronic packages that are capable of rendering high speed, finer pitch, higher pin count and reliable interconnects. Despite the fact that higher pin count increases cost, manufacturers are finding ways to deliver the most cost effective advanced electronic packages to address the needs of the industry.

www.reportlinker.com/p0164532/Advanced-Electronic-Packaging---International-Technology--Market-Trends.html

Advanced Electronic Packaging industry has grown to a position where its technology has outpaced the semiconductor technology, the parent industry it addresses. Increasing silicon complexity and integration has made it mandatory for packaging technology to provide finer lead pitch, higher I/O counts, improved heat dissipation, and rapid, reliable interconnect. Simultaneously, the industry is also pushing towards decreased printed circuit board area and complexity, which is exerting further pressure on packaging requirements.

These and other market data and trends are presented in "Advanced Electronic Packaging: International Technology & Market Trends" by BizAcumen, Inc. Our reports are designed to be most comprehensive in geographic coverage and vertical market analyses.

ADVANCED ELECTRONIC PACKAGING BMR-7004

CONTENTS

1. METHODOLOGY 1

Study Reliability and Reporting Limitations 1

Disclaimers 2

Quantitative Techniques & Reporting Level 3

2. CURRENT AND FUTURE ANALYSIS 4

Industry Faces Challenging Times 4

3. INDUSTRY OVERVIEW 5

A Brief Insight 5

Market Share Scenario 7

4. TRENDS AND ISSUES 8

Suppliers Outsource Packaging To Curtail Costs 8

BGAs on a Tremendous Growth Path 8

Glue Logic Makers Move to Advanced Packaging 9

Contractors Move Towards High Pin-Count Packages 9

Wafer Scale Packaging Anticipated to Cut Costs 9

Disparity in Scale Sizes - A Reason for Concern 10

Miniaturization Impels Adoption of Wafer- Level Chip Scale

Packaging 10

Challenges Facing Assembly and Packaging 11

Technology Trends 11

5. GROWTH DRIVERS 12

Portable Equipment Drives Growth in Flip Chips 12

Drivers for Electronic Packaging Technologies 12

Shrinking Die Sizes to Drive New Packaging Technologies 13

Factors Driving Growth in the Chip Scale Packaging Market 13

Market Technology Drivers by Major End- Use Sectors 14

6. PRODUCT FACTS 14

Ball Grid Arrays 14

Chip Scale Packaging (CSP) 14

Multi Chip Modules (MCM) 14

7. CORPORATE DEVELOPMENTS 16

Telit Introduces M2M BGA Module 16

TSI Group Acquires Three Los Angeles Based Brazing and

Machining Businesses 16

Ferro Creates New Electronic Packaging Materials Unit 16

A Group of US Based Investors Establish Chip-Packaging Plant

in Vietnam 16

Blackstone Acquires Klockner 16

Micronic Gets Another Asian Customer for FPS5100 Laser Pattern

Generator 17

RJR Polymers Introduces LCP Compatible Epoxies 17

8. MAJOR PLAYERS 17

Advanced Semiconductor Engineering Group (Taiwan) 17

ASAT Holdings Limited (Hong Kong) 17

Amkor Technology Inc. (US) 18

ASM International NV (The Netherlands) 18

ASM Pacific Technology Ltd (Hong Kong) 18

CARSEM (Malaysia) 18

Chipbond Technology Corp (Taiwan) 18

ChipMos Technologies (Taiwan) 19

FlipChip International (US) 19

Fujitsu Ltd (Japan) 19

NEC Electronics Corporation (Japan) 19

Orient Semiconductor Electronics (Taiwan) 19

Siliconware Precision Industries Co., Ltd. (Taiwan) 20

STATS ChipPAC Ltd. (Singapore) 20

Tessera, Inc. (US) 20

Toshiba America Electronic Components Inc. (US) 20

9. MARKET ANALYTICS 21

10. THE UNITED STATES 25

Chip Manufacturers - Looking for Greener Pastures 25

11. CANADA 26

12. JAPAN 27

Weakness in the Industry Structure 27

Japanese Companies on Comeback Trial 27

13. EUROPE 29

a. France 31

b. Germany 32

c. Italy 33

d. The United Kingdom 34

e. Rest of Europe 35

14. ASIA-PACIFIC 36

A Brief Review 36

China - A Promising Market 36

Taiwan - Looking Ahead 36

15. REST OF WORLD 38

EXHIBITS

Table 1: Percentage Breakdown of Semiconductor Capital

Equipment Manufacturers in the World - 2005

Table 2: Percentage Breakdown of Semiconductor Plastic

Packaging Materials Market in the World - 2005

Table 3: Advanced Electronic Packaging Technology Trends (2010 &

Table 4: Percentage Breakdown of Laminate Substrate Market by

Technology in the World - 2005

Table 5: Percentage Breakdown of Leading Fabless Packaging

Techniques in the World - 2005

Table 6: Percentage Breakdown Leading Foundry Manufacturing

Regions in the World - 2005

Table 7: Percentage Breakdown of Leading IC Socket

Manufacturers in the World - 2005

Table 8: Percentage Breakdown of Leading CSP Substrate

Suppliers in the World - 2005

Table 9: Percentage Breakdown of Leading Chip Packaging

Manufacturers in the World - 2005

Table 10: Trends in Flip Chip Production Worldwide (2005):

Percentage Breakdown by End Product

Table 11: Global Advanced Electronic Packaging Market by

Region for the Period 2007-2015 (Sales in US$ Million)

Table 12: Percentage Breakdown of Global Advanced Electronic

Packaging Market by Region for the Years 2008 & 2012

Table 13: Global Ball Grid Arrays Market by Region for the

Period 2007-2015 (Sales in US$ Million)

Table 14: Percentage Breakdown of Global Ball Grid Arrays

Market by Region for the Years 2008 & 2012

Table 15: Global Chip Scale Packages Market by Region for the

Period 2007- 2015 (Sales in US$ Million)

Table 16: Percentage Breakdown of Global Chip Scale Packages

Market by Region for the Years 2008 & 2012

Table 17: Global Multi Chip Modules Market by Region for the

Period 2007-2015 (Sales in US$ Million)

Table 18: Percentage Breakdown of Global Multi Chip Modules

Market by Region for the Years 2008 & 2012

Table 19: Advanced Electronic Packaging Market by Product

Segment in the US: 2007-2015 (Sales in US$ Million)

Table 20: Percentage Breakdown of Advanced Electronic

Packaging Market by Product Segment in the US for the Years

2008 & 2012

Table 21: Advanced Electronic Packaging Market by Product

Segment in Canada: 2007-2015 (Sales in US$ Million)

Table 22: Percentage Breakdown of Advanced Electronic

Packaging Market by Product Segment in Canada for the Years

2008 & 2012

Table 23: Advanced Electronic Packaging Market by Product

Segment in Japan: 2007-2015 (Sales in US$ Million)

Table 24: Percentage Breakdown of Advanced Electronic

Packaging Market by Product Segment in Japan for the Years

2008 & 2012

Table 25: Advanced Electronic Packaging Market by Region in

Europe: 2007-2015 (Sales in US$ Million)

Table 26: Percentage Breakdown of Advanced Electronic

Packaging Market by Region in Europe for the Years 2008 & 2012

Table 27: Advanced Electronic Packaging Market by Product

Segment in Europe: 2007-2015 (Sales in US$ Million)

Table 28: Percentage Breakdown of Advanced Electronic

Packaging Market by Product Segment in Europe for the Years

2008 & 2012

Table 29: Advanced Electronic Packaging Market by Product

Segment in France: 2007-2015 (Sales in US$ Million)

Table 30: Percentage Breakdown of Advanced Electronic

Packaging Market by Product Segment in France for the Years

2008 & 2012

Table 31: Advanced Electronic Packaging Market by Product

Segment in Germany: 2007-2015 (Sales in US$ Million)

Table 32: Percentage Breakdown of Advanced Electronic

Packaging Market by Product Segment in Germany for the Years

2008 & 2012

Table 33: Advanced Electronic Packaging Market by Product

Segment in Italy: 2007-2015 (Sales in US$ Million)

Table 34: Percentage Breakdown of Advanced Electronic

Packaging Market by Product Segment in Italy for the Years

2008 & 2012

Table 35: Advanced Electronic Packaging Market by Product

Segment in the UK: 2007-2015 (Sales in US$ Million)

Table 36: Percentage Breakdown of Advanced Electronic

Packaging Market by Product Segment in the UK for the Years

2008 & 2012

Table 37: Advanced Electronic Packaging Market by Product

Segment in Rest of Europe: 2007-2015 (Sales in US$ Million)

Table 38: Percentage Breakdown of Advanced Electronic

Packaging Market by Product Segment in Rest of Europe for the

Years 2008 & 2012

Table 39: Advanced Electronic Packaging Market by Product

Segment in Asia-Pacific: 2007-2015 (Sales in US$ Million)

Table 40: Percentage Breakdown of Advanced Electronic

Packaging Market by Product Segment in Asia-Pacific for the

Years 2008 & 2012

Table 41: Advanced Electronic Packaging Market by Product

Segment in Rest of World: 2007-2015 (Sales in US$ Million)

Table 42: Percentage Breakdown of Advanced Electronic

Packaging Market by Product Segment in Rest of World for the

Years 2008 & 2012

####

For more information, please click here

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Reportlinker

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