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EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that three European universities -- Southampton University, University of Ulster and Technische Universitat Braunschweig -- have placed orders for multiple EVG systems. These follow-on order wins for leading-edge MEMS research are for next-generation EVG systems, totaling in excess of US$2.9 million.
Notably, the United Kingdom (UK)-based Southampton University purchased the largest photolithography/MEMS equipment order by a university in the UK for The Southampton Nanofabrication Centre ( www.southampton-nanofab.com/ ) -- its new state-of-the art cleanroom set to open this fall -- equipping the organization with the most comprehensive manufacturing capability in the MEMS field of any UK educational institution. Tools purchased include several of EVG's most versatile systems for photolithography and MEMS manufacturing ideal for a research environment: the 150 coater with spin and spray coat capability; the 6200TR automatic topside microscope aligner; the 620T microscope aligner for training students in aligner techniques and processes; the 620TB manual load top and bottom-side microscope aligner for MEMS applications, such as creating microchannels by photo techniques and aligning wafers prior to bonding; and the 501 bonder for laminating dry film on to substrates prior to processing and wafer bonding. Shipment and installation of the tools will take place upon the completion of the clean room construction scheduled for this fall.
The University of Ulster and the Institute for Microtechnology at Technische Universitat Braunschweig each purchased an EVG620T -- a manual load topside microscope aligner -- for their respective MEMS R&D efforts. The EVG620 is EV Group's leading precision mask and bond aligner system from its EVG600 series. This versatile system is highly flexible enabling users to scale from R&D to high-volume production, and to adjust the tool for various application requirements. Both systems have been shipped and installed.
"These universities are engaging in leading-edge MEMS research efforts, and to be a part of enabling continued innovation in this field is very exciting for EVG," said Paul Lindner, executive technology director of EV Group. "The potential for knowledge transfer from R&D to high-volume production is tremendous, which fuels EVG's own ongoing commitment to R&D, so that we continue to deliver the most versatile and flexible solutions needed to perpetuate the cycle of innovation."
About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.
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