Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Indian Institute of Technology, Bombay, Selects EV Group Systems for Micro-Fabricated Sensor Research and Development Project

Abstract:
EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced it has received an order from the Indian Institute of Technology (IIT), Bombay, for two of EVG's MEMS-focused systems. IIT Bombay purchased the EVG620TB bond and mask aligner and EVG501 wafer bonder for a new Indian government-supported automotive MEMS R&D project being pursued in close cooperation with the Indian Institute of Science, Bangalore, which previously purchased the same EVG equipment. The new EVG systems are slated for installation this month in IIT Bombay's Mumbai facility.

Indian Institute of Technology, Bombay, Selects EV Group Systems for Micro-Fabricated Sensor Research and Development Project

ST. FLORIAN, Austria | Posted on February 5th, 2008

According to estimates by Phoenix-based market research and consulting firm Semiconductor Partners, the MEMS market will reach US$10 billion by 2011. Automotive MEMS represent the second largest segment within the overall MEMS market, after IT peripherals, with the number of MEMS devices per vehicle expected to increase by approximately one-third over the same period.

"We created the Centre of Excellence in Nanoelectronics at IIT Bombay for the specific purpose of conducting research in nano-scale devices and micro-fabricated sensors, and we are pleased to note that it is considered one of India's leading laboratories in this field," said Prof. V. Ramgopal Rao, Chief Investigator for the Nanoelectronics Centre Project, IIT Bombay. "We selected the EVG equipment for the Nanoelectronics Centre facility based on the strong recommendation of our partner organization in Bangalore. This synergy between the two institutes will facilitate our R&D activities, and help ensure the highest possible quality of results."

According to Herwig Kirchberger, EVG Business Development Manager, "The rapid rate of growth of India's technology infrastructure is driving demand for ongoing technology exploration and development. Partnering with this prestigious research institute provides EV Group with an exciting opportunity to leverage its technological leadership in the MEMS market to ensure that the region's efforts in this sector produce useful results that can ultimately be transferred to production-level automotive applications."

The EVG620TB performs precise wafer/substrate alignment with 1 micron alignment accuracy for wafer-bonding applications. It features a high-resolution, bottom-side split-field microscope and special capabilities to support MEMS processing requirements, including bond alignment for double and triple stacks, and universal align/bond chucks to transfer aligned wafers to wafer-bonding systems in the EVG500 family.

The EVG501 performs anodic, thermo-compression, fusion bonding or low-temperature plasma bonding via a single, universal bond chamber in which the top and bottom of the wafer are heated independently to compensate for different coefficients of thermal expansion. The system can support all MEMS wafer sizes and materials up to 150mm, with full support for fragile or bowed wafers, and is designed for ease of transfer from R&D to volume production.

About IIT Bombay

IIT Bombay was established in 1958, at Powai, a northern suburb of Mumbai. Today, the Institute is recognized as one of the centers of academic excellence in the country. IIT Bombay also places considerable emphasis on research and development work. The Institute plays a very significant role in diverse facets of R&D, keeping pace with the rapidly expanding frontiers of knowledge, national needs and global developments. Its pre-eminent position at the cutting edge of research is reflected in its impressive catalog of research projects, funded by national/international and government agencies and industries. More information can be found at www.iitb.ac.in.

####

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for chip packaging and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. The company's vertical infrastructure allows EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.
EVG is a registered trademark of EV Group. All other trademarks or registered trademarks mentioned in this release are the property of their respective holders.

For more information, please click here

Contacts:
EV Group
E. Thallner GmbH
DI Erich Thallner Strasse 1
A-4782 St.Florian/Inn
Phone: +43 7712 5311 0
Fax: +43 7712 5311 4600

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Nanoscale worms provide new route to nano-necklace structures March 29th, 2015

Solving molybdenum disulfide's 'thin' problem: Research team increases material's light emission by twelve times March 29th, 2015

A first glimpse inside a macroscopic quantum state March 28th, 2015

DFG to Establish One Clinical Research Unit and Five Research Units: New Projects to Investigate Complications in Pregnancy, Particle Physics, Nanoparticles, Implants and Transport Planning / Approximately 13 Million Euros in Funding for an Initial Three-Year Period March 28th, 2015

Chip Technology

State-of-the-art online system unveiled to pinpoint metrology software accuracy March 27th, 2015

SUNY POLY CNSE to Host First Ever Northeast Semi Supply Conference (NESCO) Conference Will Connect New and Emerging Innovators in the Northeastern US and Canada with Industry Leaders and Strategic Investors to Discuss Future Growth Opportunities in NYS March 25th, 2015

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

Building shape inspires new material discovery March 24th, 2015

Announcements

Nanoscale worms provide new route to nano-necklace structures March 29th, 2015

Solving molybdenum disulfide's 'thin' problem: Research team increases material's light emission by twelve times March 29th, 2015

A first glimpse inside a macroscopic quantum state March 28th, 2015

DFG to Establish One Clinical Research Unit and Five Research Units: New Projects to Investigate Complications in Pregnancy, Particle Physics, Nanoparticles, Implants and Transport Planning / Approximately 13 Million Euros in Funding for an Initial Three-Year Period March 28th, 2015

Tools

LAMDAMAP 2015 hosted by the University March 26th, 2015

FEI Technology Award of the German Neuroscience Society Goes to Benjamin Judkewitz of the University of Berlin: Bi-annual award honors excellence in brain research during the German Neuroscience Society’s Annual Meeting, held 18-21 March 2015 March 26th, 2015

Square ice filling for a graphene sandwich March 26th, 2015

Nanorobotic agents open the blood-brain barrier, offering hope for new brain treatments March 25th, 2015

New-Contracts/Sales/Customers

Industrial Nanotech, Inc. Announces Next Large Order from the Oil and Gas Industry March 26th, 2015

United Nanotech Innovations Lists Materials for Trade on INSCX™ Exchange and Appoints Fullerex as Merchant February 17th, 2015

Virginia Tech Purchases Two Bruker Fluorescence Microscope Solutions: High-Speed Instruments Combine to Cover Wide Optical Resolution Range February 10th, 2015

Nano Labs Announces the Opportunity to Submit the POLEC Liquid Cement Product for Test Trials to Be Used in the Construction of the New International Airport of Mexico City (NAICM) February 2nd, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE