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-- EV Group (EVG), a leading supplier of wafer bonding and thin-wafer processing equipment for advanced semiconductors, MEMS and nanotechnology, today announced that a major Austrian semiconductor manufacturer has selected and installed an EVG850TB fully automated temporary bonding system for high-volume processing of thin- and ultra-thin device wafers. The EVG bonder allows secure and reliable handling of high-value wafers while contributing to higher yield -- a key factor for future power device applications, consumer appliances and other semiconductor-based markets.
The growing need to reduce device power consumption is driving the need for thin- and ultra-thin wafers, requiring special processing techniques including, temporary bonding of wafers to a carrier substrate and de-bonding of wafers following back-grinding and other processing steps. The EVG bonding tool offers increased process flexibility as it allows for automated handling, cleaning, lamination and bonding of a back-thinned device wafer to carrier wafers with different intermediate materials used for temporary bonding.
Leveraging the EVG850TB's UTLRATHIN(R) Wafer Processing Technology enables the customer to expand its thin- and ultra-thin wafer processing capabilities, further increasing device yield for complex, fragile semiconductors, while adding process safety and reliability essential for high-volume production. According to a spokesperson, "Automatic processing of ultra-thin substrates in the thickness range of below 100 micron on various wafer sizes isn't an easy task. Increased diameter variations, as well as handling sensitivity and reduced wafer-edge quality from back grinding, substrate warping, fragile and brittle materials, all require a specialized know-how and a lot of experience to deal with an automated system platform. EVG has accepted the challenge and successfully achieved it."
Stefan Pargfrieder, business development manager of EV Group, noted, "This is the world's first system that can perfectly align and center carrier wafers, device wafers and dry laminated adhesive tape on an automated cluster platform, dealing with various substrate diameters. It also integrates pre-processing and post-processing steps, such as coating, protective-film removal and cleaning. This major customer again selected EVG to jointly develop and install this fully automated temporary thin-wafer processing equipment due to our proven technology portfolio and expertise in thin-wafer processing."
Further information regarding EVG's EVG850TB bonding system, as well as its full portfolio of leading-edge thin-wafer handling and lithography equipment, will be available during SEMICON Europa, Oct. 9-11, 2007 at the Stuttgart Trade Fair Centre in Stuttgart, Germany. Editors and analysts interested in learning more about the company and its products are invited to visit EVG's booth #912 (Hall 1).
About EV Group (EVG)
Founded in 1980, EV Group (EVG) is a global supplier of wafer bonders, aligners, thin-wafer temporary bonding and debonding equipment, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding and debonding equipment, and is a leader in lithography for advanced packaging, MEMS and nanoimprint lithography (NIL).
The company's unique Triple "i" approach (Invent - Innovate - Implement) is supported by a vertical infrastructure, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. Headquartered in St. Florian, Austria, EV Group operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. For more information, visit http://www.evgroup.com/ and our EVG-TShop "Click, Stop -- the new way to shop," http://www.evgtshop.com/ .
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E. Thallner GmbH
DI Erich Thallner Strasse 1
Phone: +43 7712 5311 0
Fax: +43 7712 5311 4600
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