Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > EV Group's New EVG850TB Bonding System Selected by Major Austrian Semiconductor Maker for High-volume, Ultra-thin Wafer Processing

Abstract:
-- EV Group (EVG), a leading supplier of wafer bonding and thin-wafer processing equipment for advanced semiconductors, MEMS and nanotechnology, today announced that a major Austrian semiconductor manufacturer has selected and installed an EVG850TB fully automated temporary bonding system for high-volume processing of thin- and ultra-thin device wafers. The EVG bonder allows secure and reliable handling of high-value wafers while contributing to higher yield -- a key factor for future power device applications, consumer appliances and other semiconductor-based markets.

EV Group's New EVG850TB Bonding System Selected by Major Austrian Semiconductor Maker for High-volume, Ultra-thin Wafer Processing

ST. FLORIAN, Austria | Posted on October 8th, 2007

The growing need to reduce device power consumption is driving the need for thin- and ultra-thin wafers, requiring special processing techniques including, temporary bonding of wafers to a carrier substrate and de-bonding of wafers following back-grinding and other processing steps. The EVG bonding tool offers increased process flexibility as it allows for automated handling, cleaning, lamination and bonding of a back-thinned device wafer to carrier wafers with different intermediate materials used for temporary bonding.

Leveraging the EVG850TB's UTLRATHIN(R) Wafer Processing Technology enables the customer to expand its thin- and ultra-thin wafer processing capabilities, further increasing device yield for complex, fragile semiconductors, while adding process safety and reliability essential for high-volume production. According to a spokesperson, "Automatic processing of ultra-thin substrates in the thickness range of below 100 micron on various wafer sizes isn't an easy task. Increased diameter variations, as well as handling sensitivity and reduced wafer-edge quality from back grinding, substrate warping, fragile and brittle materials, all require a specialized know-how and a lot of experience to deal with an automated system platform. EVG has accepted the challenge and successfully achieved it."

Stefan Pargfrieder, business development manager of EV Group, noted, "This is the world's first system that can perfectly align and center carrier wafers, device wafers and dry laminated adhesive tape on an automated cluster platform, dealing with various substrate diameters. It also integrates pre-processing and post-processing steps, such as coating, protective-film removal and cleaning. This major customer again selected EVG to jointly develop and install this fully automated temporary thin-wafer processing equipment due to our proven technology portfolio and expertise in thin-wafer processing."

Further information regarding EVG's EVG850TB bonding system, as well as its full portfolio of leading-edge thin-wafer handling and lithography equipment, will be available during SEMICON Europa, Oct. 9-11, 2007 at the Stuttgart Trade Fair Centre in Stuttgart, Germany. Editors and analysts interested in learning more about the company and its products are invited to visit EVG's booth #912 (Hall 1).

####

About EV Group (EVG)
Founded in 1980, EV Group (EVG) is a global supplier of wafer bonders, aligners, thin-wafer temporary bonding and debonding equipment, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding and debonding equipment, and is a leader in lithography for advanced packaging, MEMS and nanoimprint lithography (NIL).

The company's unique Triple "i" approach (Invent - Innovate - Implement) is supported by a vertical infrastructure, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. Headquartered in St. Florian, Austria, EV Group operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. For more information, visit http://www.evgroup.com/ and our EVG-TShop "Click, Stop -- the new way to shop," http://www.evgtshop.com/ .

For more information, please click here

Contacts:
EV Group
E. Thallner GmbH
DI Erich Thallner Strasse 1
A-4782 St.Florian/Inn
Phone: +43 7712 5311 0
Fax: +43 7712 5311 4600

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

Graphene key to growing 2-dimensional semiconductor with extraordinary properties August 30th, 2016

Continuous roll-process technology for transferring and packaging flexible LSI August 29th, 2016

A nanoscale wireless communication system via plasmonic antennas: Greater control affords 'in-plane' transmission of waves at or near visible light August 27th, 2016

A promising route to the scalable production of highly crystalline graphene films August 26th, 2016

Announcements

Graphene key to growing 2-dimensional semiconductor with extraordinary properties August 30th, 2016

University of Akron researchers find thin layers of water can become ice-like at room temperature: Results could lead to an assortment of anti-friction solutions August 30th, 2016

Nanocatalysis for organic chemistry: This research article by Dr. Qien Xu et al. is published in Current Organic Chemistry, Volume 20, Issue 19, 2016 August 30th, 2016

Meteorite impact on a nano scale August 29th, 2016

Tools

Designing ultrasound tools with Lego-like proteins August 29th, 2016

Nanofiber scaffolds demonstrate new features in the behavior of stem and cancer cells August 25th, 2016

50 years after the release of the film 'Fantastic Voyage,' science upstages fiction: Science upstages fiction with nanorobotic agents designed to travel in the human body to treat cancer August 25th, 2016

University of Puerto Rico and NASA back in the news – XEI reports August 23rd, 2016

Events/Classes

Stretchy supercapacitors power wearable electronics August 25th, 2016

Semblant to Present at China Mobile Manufacturing Forum 2016 August 25th, 2016

Nanoparticles that speed blood clotting may someday save lives August 23rd, 2016

Impressive List of Doctors, Scientists Coming to Vail for Scientific Summit: The Second Vail Scientific Summit Convenes the Greatest Minds in Regenerative Medicine and Science August 17th, 2016

New-Contracts/Sales/Customers

Thomas Swan and NGI announce unique partnership July 28th, 2016

Oxford Instruments and Dresden High Magnetic Field Laboratory collaborate to develop HTS magnet technology components for high field superconducting magnet systems June 29th, 2016

Nanometrics Selected for Third-Generation 3D-NAND Process Control: Atlas® Systems Extend Advanced Device Manufacturing Capability June 14th, 2016

Industrial Nanotech, Inc. Signs Agreement With and Receives First Purchase Order from Major New Customer in China June 6th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic