Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button


Home > Press > EV Group's New EVG850TB Bonding System Selected by Major Austrian Semiconductor Maker for High-volume, Ultra-thin Wafer Processing

-- EV Group (EVG), a leading supplier of wafer bonding and thin-wafer processing equipment for advanced semiconductors, MEMS and nanotechnology, today announced that a major Austrian semiconductor manufacturer has selected and installed an EVG850TB fully automated temporary bonding system for high-volume processing of thin- and ultra-thin device wafers. The EVG bonder allows secure and reliable handling of high-value wafers while contributing to higher yield -- a key factor for future power device applications, consumer appliances and other semiconductor-based markets.

EV Group's New EVG850TB Bonding System Selected by Major Austrian Semiconductor Maker for High-volume, Ultra-thin Wafer Processing

ST. FLORIAN, Austria | Posted on October 8th, 2007

The growing need to reduce device power consumption is driving the need for thin- and ultra-thin wafers, requiring special processing techniques including, temporary bonding of wafers to a carrier substrate and de-bonding of wafers following back-grinding and other processing steps. The EVG bonding tool offers increased process flexibility as it allows for automated handling, cleaning, lamination and bonding of a back-thinned device wafer to carrier wafers with different intermediate materials used for temporary bonding.

Leveraging the EVG850TB's UTLRATHIN(R) Wafer Processing Technology enables the customer to expand its thin- and ultra-thin wafer processing capabilities, further increasing device yield for complex, fragile semiconductors, while adding process safety and reliability essential for high-volume production. According to a spokesperson, "Automatic processing of ultra-thin substrates in the thickness range of below 100 micron on various wafer sizes isn't an easy task. Increased diameter variations, as well as handling sensitivity and reduced wafer-edge quality from back grinding, substrate warping, fragile and brittle materials, all require a specialized know-how and a lot of experience to deal with an automated system platform. EVG has accepted the challenge and successfully achieved it."

Stefan Pargfrieder, business development manager of EV Group, noted, "This is the world's first system that can perfectly align and center carrier wafers, device wafers and dry laminated adhesive tape on an automated cluster platform, dealing with various substrate diameters. It also integrates pre-processing and post-processing steps, such as coating, protective-film removal and cleaning. This major customer again selected EVG to jointly develop and install this fully automated temporary thin-wafer processing equipment due to our proven technology portfolio and expertise in thin-wafer processing."

Further information regarding EVG's EVG850TB bonding system, as well as its full portfolio of leading-edge thin-wafer handling and lithography equipment, will be available during SEMICON Europa, Oct. 9-11, 2007 at the Stuttgart Trade Fair Centre in Stuttgart, Germany. Editors and analysts interested in learning more about the company and its products are invited to visit EVG's booth #912 (Hall 1).


About EV Group (EVG)
Founded in 1980, EV Group (EVG) is a global supplier of wafer bonders, aligners, thin-wafer temporary bonding and debonding equipment, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding and debonding equipment, and is a leader in lithography for advanced packaging, MEMS and nanoimprint lithography (NIL).

The company's unique Triple "i" approach (Invent - Innovate - Implement) is supported by a vertical infrastructure, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. Headquartered in St. Florian, Austria, EV Group operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. For more information, visit and our EVG-TShop "Click, Stop -- the new way to shop," .

For more information, please click here

EV Group
E. Thallner GmbH
DI Erich Thallner Strasse 1
A-4782 St.Florian/Inn
Phone: +43 7712 5311 0
Fax: +43 7712 5311 4600

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

Global leader in semiconductor technology to maintain and expand operations at SUNY Poly CNSE in Albany October 8th, 2015

Purdue launching new quantum center during workshop October 8th, 2015

Leti Joins GLOBALFOUNDRIES’ Eco-System Partners With Focus on Supporting 22FDX™ Platform: GLOBALSOLUTIONSSM Partnership Will Enable Leti’s FD-SOI and ASICS Design-and-Fabrication Solutions on GLOBALFOUNDRIES Technologies October 7th, 2015

Double the (quantum) fun: A detailed analysis of the electrical characteristics of a tiny transistor made from 2 quantum dots could help researchers design better devices to manipulate single electrons October 7th, 2015


Scientists pave way for diamonds to trace early cancers October 10th, 2015

Controllable protein gates deliver on-demand permeability in artificial nanovesicles October 9th, 2015

Faster design -- better catalysts: New method facilitates research on fuel cell catalysts October 9th, 2015

Performance of Polymeric Nanoparticles as Gene Carriers Studied by Iranian, Dutch Scientists October 9th, 2015


Scientists pave way for diamonds to trace early cancers October 10th, 2015

Oxford Instruments announces call for nominations for the 2016 Science Prizes for Europe and Americas October 7th, 2015

Organic semiconductors get weird at the edge: University of British Columbia research October 7th, 2015

Electron tomography with 3,487 images in 3.5 seconds: High-speed electron tomography sets new standards for 3-D images of the nanoworld October 6th, 2015


Arrowhead to Present at Upcoming Conferences October 8th, 2015

Purdue launching new quantum center during workshop October 8th, 2015

Iran Organizes Nanotechnology Educational Workshop in China October 7th, 2015

8th Int'l Iran Nano 2015 Festival Kicks Off Work October 7th, 2015


Harris & Harris Group Portfolio Company, D-Wave Systems, Announces Multi-Year Agreement to Provide Its Technology to Google, NASA and USRA's Quantum Artificial Intelligence Lab October 6th, 2015

CAMECA Helps US Navy LEAP Forward in Materials Design: CAMECA Delivers Local Electrode Atom Probe (LEAP) To US Naval Research Laboratory for Advanced Materials Development September 11th, 2015

Tongfang Global and QD Vision Partner to Bring Wide Color Gamut to Global Television Lines: Color IQTM quantum dots help boost company’s focus on superior color reproduction September 3rd, 2015

Nanolab Technologies LEAPS Forward with High-Performance Analysis Services to the World: Nanolab Orders Advanced Local Electrode Atom Probe (LEAP®) Microscope from CAMECA Unit of AMETEK Materials Analysis Division August 27th, 2015

The latest news from around the world, FREE

  Premium Products
Only the news you want to read!
 Learn More
University Technology Transfer & Patents
 Learn More
Full-service, expert consulting
 Learn More

Nanotechnology Now Featured Books


The Hunger Project

Car Brands
Buy website traffic