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Home > News > NanoWorld Selects SUSS Wafer Bonding System

September 18th, 2006

NanoWorld Selects SUSS Wafer Bonding System

Abstract:
SUSS MicroTec (FWB:SMH)(GER:SMH), a leading supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced an order for its ELAN CB6L wafer bonding system to NanoWorld Services.

Source:
businesswire

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