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Home > News > Hewlett-Packard: Embracing Failure

June 10th, 2005

Hewlett-Packard: Embracing Failure

Abstract:
Jack Uldrich: Two articles from Nanotechnology Now recently caught my attention. The first was a short article from the EETimes talking about several futuristic technologies which might help solve the interconnect bottleneck in chip design. The article addressed carbon nanotubes, optical interconnects, spin-wave buses and molecular wires.

Source:
NanoNovus

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