Home > News > 11th International Chemical-Mechanical Planarization Symposium
August 7th, 2006
11th International Chemical-Mechanical Planarization Symposium
Abstract:
More than 100 of the world’s premier researchers, academics, high technology companies and suppliers will gather in Lake Placid August 13 – 16 for the 11th International Chemical-Mechanical Planarization (CMP) Symposium, sponsored by Clarkson’s Center for Advanced Materials Processing (CAMP).
Source:
Clarkson University
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