Home > News > Phillip J. Bond to Deliver Address at Nanotechnology Conference
May 25th, 2004
Phillip J. Bond to Deliver Address at Nanotechnology Conference
Abstract:
Pennsylvania Community and Economic Development Secretary Dennis Yablonsky today announced that
Phillip J. Bond, Secretary of Commerce for Technology, U.S. Department of Commerce, will make remarks at "The Business of Nano" conference, which will be held May 25-26 at the Pennsylvania Convention Center in Philadelphia. The conference is designed to showcase innovative products, resources and programs
that are accelerating the adoption and application of nanotechnology throughout the state.
Source:
PRNewswire
Bookmark:
| Related News Press |
Announcements
Decoding hydrogen‑bond network of electrolyte for cryogenic durable aqueous zinc‑ion batteries January 30th, 2026
COF scaffold membrane with gate‑lane nanostructure for efficient Li+/Mg2+ separation January 30th, 2026
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||