Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > MEMS Industry Group's Annual Executive Conference Shows Why MEMS Is Growing 2x Faster Than Semiconductors: MEMS Executive Congress US 2013 Sets Attendance Record, Honors 'MEMS Innovation' Award Winners, Crowns MEMS Technology Showcase Favorites

Abstract:
MEMS Industry Group (MIG)'s MEMS Executive Congress® -- held November 7-8, 2013 in Napa, CA -- showed why the MEMS industry is outpacing the semiconductor industry, in both growth and innovation. With a ten percent increase in attendance over 2012 and market analysts such as IHS Inc.'s Jérémie Bouchaud predicting that the MEMS industry will grow twice as fast as the semiconductor industry -- MEMS Executive Congress highlighted innovation through presentations, panels and awards.

MEMS Industry Group's Annual Executive Conference Shows Why MEMS Is Growing 2x Faster Than Semiconductors: MEMS Executive Congress US 2013 Sets Attendance Record, Honors 'MEMS Innovation' Award Winners, Crowns MEMS Technology Showcase Favorites

Pittsburgh, PA | Posted on November 14th, 2013

Gregg Bartlett, chief technology officer, GLOBALFOUNDRIES, captured the buoyant mood during the opening keynote presentation. "MEMS is an innovation race, not an arms race. If you can dream it, it can be built," said Bartlett. "That's the beauty of MEMS. It is limited only by someone's ability to conceive it."

From market analysts such as Yole Développement's Laurent Robin, who described a wider variety of MEMS in the smartphone of 2018, to HTC America's Gary Yao, who predicted that watches, glasses and wearable patches will join smartphones in our connected world of 2020, event speakers cited the critical role of consumer and mobile markets in the growth of MEMS.

The Winners: MEMS Innovation Awards and MEMS Technology Showcase
MEMS Executive Congress also celebrated innovation through MIG's first MEMS Innovation Awards. "We are delighted to recognize STMicroelectronics as a multiple award-winner in our MEMS Innovation Awards," said Karen Lightman, executive director, MEMS Industry Group. "ST won device of the year for its 2x2 eCompass and MEMS Company of the Year as well as MEMS Executive of the Year for Benedetto Vigna."

"We are also thrilled to announce that SPTS Technologies earned MEMS Supplier of the Year, Samsung won MEMS Integrator of the Year, and Maxim Integrated's Demetre Kondylis was recognized for a Lifetime Achievement Award."

MEMS Executive Congress attendees also had the chance to vote for the best live demo given during MIG's third annual MEMS Technology Showcase®. For the first time in its history, there was a tie: DigitalOptics' mems|cam product and MicroGen's BOLT™ Power Cell both shared the crown.

More Recognition: MIG's Hall of Fame
MIG also used the forum to induct two new MIG members into its annual Hall of Fame: Alissa M. Fitzgerald, founder and managing member, A.M. Fitzgerald & Associates, and Michael Gaitan, group leader, NIST.

MEMS Executive Congress Sponsors
Premier sponsors of MEMS Executive Congress US 2013 include: Platinum Sponsor EV Group; Gold Sponsor SPTS Technologies; Silver Sponsors Analog Devices, Freescale Semiconductor, STMicroelectronics and SUSS MicroTec; and Bronze Sponsor Applied Materials.

Event sponsors include: ACUTRONIC, AEPI, Akustica, Bosch Automotive Electronics, Bosch Sensortec, LETI, Coventor, Electronic Engineering Journal, Fries Research & Technology (FRT), IHS Inc., Kionix, Maxim Integrated, MCA Public Relations, MEMS Journal, MEMS and Nanotechnology Exchange, Micralyne, Movea, Okmetic, Plan Optik, Rock Health, Semico Research, Silex Microsystems, Solid State Technology, Teledyne Dalsa, X-FAB and Yole Développement.

Upcoming Events
MIG's featured upcoming events include a MEMS conference track and MotionTech show-floor exposition at the 2014 International CES (January 7-10, 2014, Las Vegas) and MEMS Executive Congress EU® (March 11, 2014, Munich, Germany). For more information, please contact MIG via phone: 412/390-1644 or email: info[at]memsindustrygroup.org .

####

About MEMS Industry Group
MEMS Industry Group (MIG) is the trade association advancing MEMS across global markets. More than 160 companies comprise MIG, including Analog Devices, Applied Materials, ARM, Bosch, Broadcom, Freescale Semiconductor, GE, Honeywell, HP, Infineon, Intel, InvenSense, Murata Electronics Oy, OMRON Electronic Components, Qualcomm, STMicroelectronics and Texas Instruments. For more information, visit: www.memsindustrygroup.org.

MEMS Industry Group, MEMS Executive Congress, MEMS Technology Showcase and the MEMS Industry Group logo are registered trademarks of MEMS Industry Group. All other product and company names are trademarks or registered trademarks of their respective holders.

For more information, please click here

Contacts:
Karen Lightman
MEMS Industry Group
Phone: +412/390-1644
info[at]memsindustrygroup.org

Maria Vetrano
Vetrano Communications
Phone: +617/876.2770

Copyright © Marketwire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

ICN2 researchers compute unprecedented values for spin lifetime anisotropy in graphene November 17th, 2017

Math gets real in strong, lightweight structures: Rice University researchers use 3-D printers to turn century-old theory into complex schwarzites November 16th, 2017

The stacked color sensor: True colors meet minimization November 16th, 2017

Nanometrics to Participate in the 6th Annual NYC Investor Summit 2017 November 16th, 2017

MEMS

First Capacitive Transducer with 13nm Gap July 27th, 2017

Bosch announces high-performance MEMS acceleration sensors for wearables June 27th, 2017

Smart multi-layered magnetic material acts as an electric switch: New study reveals characteristic of islands of magnetic metals between vacuum gaps, displaying tunnelling electric current March 1st, 2017

Engineers shrink microscope to dime-sized device February 17th, 2017

Announcements

ICN2 researchers compute unprecedented values for spin lifetime anisotropy in graphene November 17th, 2017

Math gets real in strong, lightweight structures: Rice University researchers use 3-D printers to turn century-old theory into complex schwarzites November 16th, 2017

The stacked color sensor: True colors meet minimization November 16th, 2017

Nanometrics to Participate in the 6th Annual NYC Investor Summit 2017 November 16th, 2017

Events/Classes

Nanometrics to Participate in the 6th Annual NYC Investor Summit 2017 November 16th, 2017

Arrowhead to Present at 29th Annual Piper Jaffray Healthcare Conference November 14th, 2017

Leti Will Present 11 Papers and Host More-than-Moore Technologies Workshop November 14th, 2017

TUBALL nanotube-based concentrates recognised as the most innovative raw material for composites by JEC Group November 7th, 2017

Grants/Sponsored Research/Awards/Scholarships/Gifts/Contests/Honors/Records

Math gets real in strong, lightweight structures: Rice University researchers use 3-D printers to turn century-old theory into complex schwarzites November 16th, 2017

Oxford Instruments announces winner of the 2017 Sir Martin Wood Prize for Japan November 14th, 2017

A new way to mix oil and water: Condensation-based method developed at MIT could create stable nanoscale emulsions November 8th, 2017

Nanoshells could deliver more chemo with fewer side effects: In vitro study verifies method for remotely triggering release of cancer drugs November 8th, 2017

Alliances/Trade associations/Partnerships/Distributorships

EC Project Aims at Creating and Commercializing Cyber-Physical-System Solutions November 14th, 2017

GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card November 14th, 2017

Leti Coordinating Project to Develop Innovative Drivetrains for 3rd-generation Electric Vehicles: CEA Tech’s Contribution Includes Liten’s Knowhow in Magnetic Materials and Simulation And Leti’s Expertise in Wide-bandgap Semiconductors October 20th, 2017

More 22 of 59,885 Print all In new window Leti to Present Update of CoolCube/3DVLSI Technologies Development at 2017 IEEE S3S: Future Developments and Tape-Out Vehicles to Be Presented during Oct. 17 Workshop October 12th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project